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シリコン結晶書面に形成される薄い自然酸化膜に関する研究

Research Project

Project/Area Number 01550252
Research Category

Grant-in-Aid for General Scientific Research (C)

Allocation TypeSingle-year Grants
Research Field 電子材料工学
Research InstitutionHosei University

Principal Investigator

原 徹  法政大学, 工学部, 教授 (00147886)

Project Period (FY) 1989 – 1991
Project Status Completed (Fiscal Year 1991)
Budget Amount *help
¥2,000,000 (Direct Cost: ¥2,000,000)
Fiscal Year 1991: ¥100,000 (Direct Cost: ¥100,000)
Fiscal Year 1990: ¥100,000 (Direct Cost: ¥100,000)
Fiscal Year 1989: ¥1,800,000 (Direct Cost: ¥1,800,000)
Keywords自然酸化膜 / エッチング / エッチングダメ-ジ / 酸化膜窓開け / 反応性イオンエッチング / ECRブラズマエッチング / シリコン / ヒョウメン / ミゼンサンカマク / ヒョウメンブツリ / ハンドウタイプロセス / シリコン酸化膜 / シリコン表面 / VLSIプロセス技術 / 自然酸化膜評価法 / 自然酸化膜除去法
Research Abstract

今までに設立した評価技術をもとに主として反応性イオンエッチングによる酸化膜の除去に関する研究を行った。
この除去方法は64Mb DRAMb DRAM以上の半導体將来技術として特に重要と考えられている。
1)シリコン表面に形成された酸化膜の反応性イオンエッチングによる除去、
各種ガス、エッチング条件により酸化膜を除去する方法を見出したが、この除去の際シリコン青酉に大量の物理的ダメ-ジが導入され、このダメ-ジはアニ-ルによっても取除けられないことを見出した。このため、酸化膜を除去でき、比較的ダメ-ジ導入の少いエッチング技術の確立と行った。この方法の一つとして從来用いられているガスに比べ、分子量の大きなエッチングガスを用いる方法が有用であることを提案した。
2)エレクトロンサイクロトロン、共鳴プラズマエッチングによる酸化膜の除去
エレクトロンサイクロトロン共鳴プラズマはCVDやAeのエッチングに用いられているが、酸化膜のエッチングに用いた例はほとんどなかった。本年度の研究では酸化膜を高いエッチング速度で、高い選択比でエッチング技術を確立した。
この方法により0.3ミクロン以下の微細寸法のコンタクト開は、酸化膜除去を極く低ダメ-ジで賢現できることを確証した。

Report

(3 results)
  • 1991 Annual Research Report
  • 1990 Annual Research Report
  • 1989 Annual Research Report
  • Research Products

    (38 results)

All Other

All Publications (38 results)

  • [Publications] T.Hara,H.Hagiwara: "“Monitoring of Dose in Low Dose lon Implantation"," Nuclear Instruments and Methods in Physics Research,. B55. 250-252 (1991)

    • Related Report
      1991 Annual Research Report
  • [Publications] M.Furukawa T.Hara: "“Plasma Damage lnduced on Silicon Surface in a Barrel Asher"" J.Electrochem.Soc.138. 542-544 (1991)

    • Related Report
      1991 Annual Research Report
  • [Publications] T.Hara T.Miyamoto: "“In Situ Stress Measurement of Tungsten Silicide"," Appl.Phys.Lett.58(13). 1425-1427 (1991)

    • Related Report
      1991 Annual Research Report
  • [Publications] T.Hara J.Hiyoshi: "Damage Formed by Electron Cyclotron Reトonance Plasma Etching on Silicon Surface"" Japan J.Appl.Phys.30(5). 1045-1049 (1991)

    • Related Report
      1991 Annual Research Report
  • [Publications] T.Hara G.washidzu: "Dose and Damage Measurements in Low Dose Ion Implantation in Silicon by Photoーacoustic Displacement and Minority Carrier Lifetime" Japan J.Appl.Phys.30(6). 1025-1027 (1991)

    • Related Report
      1991 Annual Research Report
  • [Publications] T.Hara,A.Yamanoue: "Properties of Titanium Nitride Films for Barrier Metal in Aluminum Ohmic Contact Systems"" Japan J.Applied Phys.30(7). 1447-1451 (1991)

    • Related Report
      1991 Annual Research Report
  • [Publications] M.Sato,D.Kimura.: "Suppression of Damage in Magnetron Enhanced Reactive Ion Etching"" Electrochemical Society,. (1991)

    • Related Report
      1991 Annual Research Report
  • [Publications] M.Sato,D.Kimura: "Low Damage Magnetron Enhanced Reactive Ion Etching" International Solid State Devices and Materials Conf.23. (1991)

    • Related Report
      1991 Annual Research Report
  • [Publications] T.Hara,K.Kinoshita: "Reflectivity and Ellipsometric Measurements" Intern.Conf.Materials and Phys. 2. 209-212 (1991)

    • Related Report
      1991 Annual Research Report
  • [Publications] T.Hara,H.Suzuki,: "Thermal Wave Measurements for Preamorphized Si" MRS Fall Meeting,. (1991)

    • Related Report
      1991 Annual Research Report
  • [Publications] T.Hara and A.Suga: "Damage Formed by Electron Cyclotron Resonance Plasma Etching on a Gallium Arsenide Surface" J.Appl.Phys.67. 2836-2839 (1990)

    • Related Report
      1990 Annual Research Report
  • [Publications] T.Hara and M.Murota: "Interfacial Reaction of Ta and Si Rich Tantalum Silicides with Si Substrate" J.Appl.Phys.68. 183-188 (1990)

    • Related Report
      1990 Annual Research Report
  • [Publications] T.Hara,T.Miyamoto: "Composition of Tungsten Silicide Films Deposited by Dichlorosilane Reduction of Tungsten Hexafluoride" J.Electrochem.Soc.137. 2955-2959 (1990)

    • Related Report
      1990 Annual Research Report
  • [Publications] T.Hara,K.Tani,K.Inoue,: "Formation of Titanium Nitride Layers by the Nitridation of Titanium,in High Pressure Ammonium Ambient" Appl.Phys.Lett,. 57. 1660-1662 (1990)

    • Related Report
      1990 Annual Research Report
  • [Publications] T.Hara,H.Hagiwara,: "Monitoring of LowーDose Ion Implantation in Silicon" IEEE Electron Device Letts.11. 485-486 (1990)

    • Related Report
      1990 Annual Research Report
  • [Publications] H.Suzuki and T.Hara: "Plasma Damage Induced on Silicon Surface in a Barrel Asher" J.Electrochem.Soc.138. 542-544 (1991)

    • Related Report
      1990 Annual Research Report
  • [Publications] T.Hara,H.Hagiwara,Smith,C.Welles,: "Monitoring of Dose in Low Dose Ion Implantation" Nuclear Instruments and Methods in Physics Research,. B42. (1991)

    • Related Report
      1990 Annual Research Report
  • [Publications] T.Hara,T.Miyamoto: "In Situ Stress Measurement of Tungsten Silicide" Appl.Phys.Lett.58. (1991)

    • Related Report
      1990 Annual Research Report
  • [Publications] T.Hara,A.Yamanoue,: "Properties of Titanium Nitride Films for Barrier Metal in Aluminum Ohmic Contact Systems" Japan J.Appl.Phys.30. (1991)

    • Related Report
      1990 Annual Research Report
  • [Publications] T.Hara,and J.Hiyoshi: "Damage Formed by Electron Cyclotron Resonance Plasma Etching on Silicon Surface" Japan J.Appl.,Phys.30. (1991)

    • Related Report
      1990 Annual Research Report
  • [Publications] T.Hara,and R.Ichikawa: "Dose and Damage Measurements in Low Dose Ion Implantation in Silicon by PhotoーAcoustic Displacement and" Japan J.Appl.,Phys.30. (1991)

    • Related Report
      1990 Annual Research Report
  • [Publications] T.Hara,K.Inoue,: "Formation of Titanium Nitride/Titanium Silicide/Silicon by High Pressure Nitridation of Titanium/" J of Applied.Phys.69. (1991)

    • Related Report
      1990 Annual Research Report
  • [Publications] Tohru HARA: "Sputtered Tungsten Silicides Deposited at Different Pressures" J.of Electrochemical Society. 136. 1174-1177 (1989)

    • Related Report
      1989 Annual Research Report
  • [Publications] Tohru HARA: "Deposition and Properties of Dichlorosilane Tungsten Silicide" J.of Electrochemical Society. 136. 1178-1182 (1989)

    • Related Report
      1989 Annual Research Report
  • [Publications] Tohru HARA: "Tungsten Silicide Barrier Layers in Aluminum Contact Systems" Thin Solid Films. 177. 9-16 (1989)

    • Related Report
      1989 Annual Research Report
  • [Publications] Tohru HARA: "Properties of CVD WSix/GaAs Schottky Barrier" Physica Status solidi(a). 113. 459-466 (1989)

    • Related Report
      1989 Annual Research Report
  • [Publications] Tohru HARA: "Properties of Sputtered Tungsten Silicides Deposited with Different Argon Pressures" Nuclear Instruments and Methods in Physic Research.B39. 302-305 (1989)

    • Related Report
      1989 Annual Research Report
  • [Publications] Tohru HARA: "Damage Formed by Ion Implantation in Si by Displaced Atom Density and Thermal Wave Signal" Applied Physics Letters. 55. 1315-1317 (1989)

    • Related Report
      1989 Annual Research Report
  • [Publications] Tohru HARA: "Damage formed by Electron Cyclotron Resonance Plasma Etching on Gallium Arsenide Surface" J of Applied Physics. 65. (1990)

    • Related Report
      1989 Annual Research Report
  • [Publications] Tohru HARA: "Low Dose Ion Implantation Monitor by Thermal Wave Signal lntensity Measurement" Proc.of 8th Symp.Ion Beam Technology Hosei University. 8. 73-78 (1989)

    • Related Report
      1989 Annual Research Report
  • [Publications] Tohru HARA: "Precipitation of Excess Si licon from Si rich tungsten Silicide Deposited by Dichlorosilane Reduction of Tungsten Hexafluoride" Proc.of 8th Symp.Ion Beam Technology in Hosei University. 8. 103-108 (1989)

    • Related Report
      1989 Annual Research Report
  • [Publications] Tohru HARA: "Titanum Nitride Barrier Metal for Al/TiN/Si Ohmic Contact Systems" Proc.of 8th Symp.Ion Beam Technology in Hosei University. 8. 108-113 (1989)

    • Related Report
      1989 Annual Research Report
  • [Publications] Tohru HARA: "Interfacial Reaction of Ta and Si rich Tantalum Silicides with Si Substrate" J of Applied Physics. 65. (1990)

    • Related Report
      1989 Annual Research Report
  • [Publications] Tohru HARA: "Monitoring of Low Dose Ion Implantation in Silicon" Electron Devices Letters. (1990)

    • Related Report
      1989 Annual Research Report
  • [Publications] Tohru HARA: "Studies of Ion Implantation Damage and its Annealing Kinetics Using The Thermal Wave Method" Symp of Si Materials and Process,Electrochemical.Society. 5. (1990)

    • Related Report
      1989 Annual Research Report
  • [Publications] Tohru HARA: "Properties and Barrier Effect of TiN" J of Electrochem.Soc.137. (1990)

    • Related Report
      1989 Annual Research Report
  • [Publications] Tohru HARA: "Stress of Tungsten Silicides" J of Electrochemical Society.

    • Related Report
      1989 Annual Research Report
  • [Publications] Tohru HARA: "Monitoring of Dose in Low Dose Ion Implantation" Nuclear Instruments and Methods in Physic Research.B44. (1990)

    • Related Report
      1989 Annual Research Report

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Published: 1989-04-01   Modified: 2016-04-21  

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