| Project/Area Number |
03045050
|
|---|
| Research Category |
Grant-in-Aid for international Scientific Research
|
| Allocation Type | Single-year Grants |
|---|
| Section | University-to-University Cooperative Research |
|---|
| Research Institution | Suzuka College of Technology |
|---|
Principal Investigator |
TODA Sei-ichi (1993) Suzuka College of Tech., 校長 (90227596)
久保田 郁夫 鈴鹿工業高等専門学校, 校長 (10043283)
|
|---|
| Co-Investigator(Kenkyū-buntansha) |
R. Chandrasekaran Ohio State University Dep. of Information Eng., 情報工学科, 教授
HSIEN-CHING Ko Ohio State University Dep. of Electronic Eng., 電子工学科, 名誉教授
G.R.ST.PIERR オハイオ州立大学, 材料工学科, 教授
MOHAMMED Ismail Ohio State University Dep. of Electrical Eng., 電気工学科, 教授
JOSE B.Cruz オハイオ州立大学, 工学部長
KONDOU Kazuyuki Suzuka College of Technology Dep. of Electrical Eng., 電気工学科, 講師 (00170423)
KITAMURA Noboru Suzuka College of Technology Dep. of Electrical Eng., 電気工学科, 助教授 (50149936)
INOUE Tetuo Suzuka College of Technology Dep. of Materials Sci. and Eng., 材料工学科, 助教授 (10203241)
KUWABARA Hirohumi Suzuka College of Tech. Dep. of Electronic and Information Eng., 電子情報工学科, 助教授 (30043326)
OOI Shiro Suzuka College of Tech. Dep. of Machanical Eng., 機械工学科, 助教授 (30043318)
KUNIEDA Yosihiko Suzuka College of Tech. Dep. of Materials Sci. and Eng., 材料工学科, 助教授 (80043313)
YAMAGUCHI Shinji Suzuka College of Tech. Dep. of Electrical Eng., 電気工学科, 教授 (70043304)
PIERRE G.r.st. Ohio State University Dep. of Materials Sci. and Eng.
CRUZ Jose b.jr. Ohio State University
WILIAM E.Lee オハイオ州立大学, 工学部材料工学科, 教授
R.CHANDRASEK オハイオ州立大学, 工学部情報工学科, 教授
GEIRGE Valco オハイオ州立大学, 工学部電気工学科, 教授
HISEN Ching オハイオ州立大学, 工学部電気工学科, 名誉教授
GEORE St.Pie オハイオ州立大学, 工学部材料工学科, 教授
ROBERT A.Red オハイオ州大学, 工学部, 工学部長
CHANDRASEKAR オハイオ州立大学, 情報工学科, 教授
LEE William オハイオ州立大学, 材料工学科, 教授
VALCO George オハイオ州立大学, 電気工学科, 教授
GLOWER Donal オハイオ州立大学, 副学製
|
|---|
| Project Period (FY) |
1991 – 1993
|
| Project Status |
Completed (Fiscal Year 1993)
|
| Budget Amount *help |
¥4,800,000 (Direct Cost: ¥4,800,000)
Fiscal Year 1993: ¥1,600,000 (Direct Cost: ¥1,600,000)
Fiscal Year 1992: ¥1,600,000 (Direct Cost: ¥1,600,000)
Fiscal Year 1991: ¥1,600,000 (Direct Cost: ¥1,600,000)
|
|---|
| Keywords | Zinc Oxide / Phosphor / Silicon nitride / joining / Aluminum alloy / Slow strain rate technique / High precision electro plated ultra grain wheel / TSUKIDASHIRYO / 新素材 / 酸化亜学蛍光体 / 発光機構 / セラミックス接合 / アルミニューム合金 / 応力腐食割れ / スイッチドキャパシタ / 酸化亜鉛蛍光体 |
|---|
| Research Abstract |
As a result of researching under the theme "Study on New Functional materials concerned with automobile", the following consequences were obtained
(1) The experiments to investigate the electron energy-band structure of Zn0 phosphor were performed in order to elucidate its luminous mechanisms. At first we obtained the method to produce reproducibly Zn0 film electrodeposited with the constant film thickness and then we got the important results to consider the luminous mechanisms of Zn0 by carrying out the experiments of measuring TSC, photo-luminescence and photo-conduction.
(2) It is one of the most important subject to join ceramics to put them to practical use and silicon nitride is one of the exellent candidates for the high temperature structural component. Then, it was investigated to join silicon nitride and it was recognized that silicon nitride was able to be joined to itself with Cr, Fe-V and so on by HIP process. Then, the effects of cupper used as binder was discussed in this
… More
work. The results obtained are as follows. Silicon nitride was able to be bonded itself using thin film of copper by HIP process under the atmosphere of argon gas, 120MPa, and at the higher temperature than 1923K. The joining strength increased with the higher treated temperature.
(3) The potential of the specimen was regulated in region of passivation potential which predetermined from the polarization curve of the alloy in the same solution at 298K. The fracture surface of the specimen was obseved by SEM, and the mechanism of rupture of the alloys was discussed. Ipass is fluctuated widely with increase of strain rates in the solution-treated alloy, but it is not sovaried with increase of strain rates in peak-aged alloy. The cupper content in the ternary Al-Zn-Mg alloy seems to have a decreased effect on Ipass in regard to the formation of surface film. The fluctuation of Ipass by plastic deformation depends on the dissolution of fresh surfaceplane and decrease of it depends on the repair of the surface film. Dimple pattern is mainly observed both vicinity of the surface and inside region, furthermore transgranular cracking is considered in partly as crack induced by pitting corrosion in solution-treated alloy. Intergranular cracking caused by rupture and repair of film, and dimple pattern is mostly observed in peak-aged alloy.
(4) Ultra grinding wheels which use Diamond and CBN grain increase to use for ceramics with high efficiency and accuracy. Therefore we are aiming for production of high precision electroplated ultra grain wheels which have high form deviation and ideal working surface. The results obtained are as follows ; (I)Method which spread grains uniformly use the principle of static electricity. (II)Adhesion layer become uniformity thickness by centrifugal force. It is possible to product grinding wheel. Less
|
