| Project/Area Number |
06650143
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| Research Category |
Grant-in-Aid for General Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Research Field |
機械工作・生産工学
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| Research Institution | Osaka University |
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Principal Investigator |
YAMAUCHI Kazuto Osaka Univ.Faculty of Eng.Assoc.Prof., 工学部, 助教授 (10174575)
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| Co-Investigator(Kenkyū-buntansha) |
SANO Yasuhisa Osaka Univ.Faculty of Eng.Research Asst., 工学部, 助手 (40252598)
YAMAMURA Kazuya Osaka Univ.Faculty of Eng.Research Asst., 工学部, 助手 (60240074)
MORI Yuzo Osaka Univ.Faculty of Eng.Prof., 工学部, 教授 (00029125)
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| Project Period (FY) |
1994 – 1995
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| Project Status |
Completed (Fiscal Year 1995)
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| Budget Amount *help |
¥2,300,000 (Direct Cost: ¥2,300,000)
Fiscal Year 1995: ¥300,000 (Direct Cost: ¥300,000)
Fiscal Year 1994: ¥2,000,000 (Direct Cost: ¥2,000,000)
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| Keywords | surface photovaltage effects / Si / high sensitive / non-destructive / crystallographic properties / ultra-precision machining / EEM / 加工変質層 / SPV / 分光 / 低温 / 半導体 / 起精密加工 |
|---|
| Research Abstract |
A non-destructive evaluation technique for crystallographic properties of surfaces finished by ultra-precision machining processes has been developed by utilizing surface photo-voltage effects. In this study, spectroscopic measuring system is developed as an advanced type from monochromatic photo-voltage measuring system utilizing Ar+ laser beam as a probe light source which was developed before also by authors. In new system, a detection method of surface voltage with high sensitivity has been constructed so that developed system has enough performance to evaluate the properties of Si wafer surfaces finished by ultra-precision machining processes such as EEM (Elastic Emission Machining), chemical etching or mechanical-chemical polishing.
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