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Development of Ultra-Light Fiberboard

Research Project

Project/Area Number 06660214
Research Category

Grant-in-Aid for General Scientific Research (C)

Allocation TypeSingle-year Grants
Research Field 林産学
Research InstitutionKYOTO UNIVERSITY

Principal Investigator

KAWAI Shuichi  Wood Research Inst., Kyoto Univ.Professor, 木質科学研究所, 教授 (00135609)

Co-Investigator(Kenkyū-buntansha) SASAKI Hikaru  Inst.of Wood Tech., Akita Pref.College of Agri., Professor, 木材高度加工研究所, 教授 (50027158)
TAKINO Shinjiro  Wood Res.Inst., KYoto Univ.Research Associate, 木質科学研究所, 助手 (90115874)
Project Period (FY) 1994 – 1995
Project Status Completed (Fiscal Year 1995)
Budget Amount *help
¥2,100,000 (Direct Cost: ¥2,100,000)
Fiscal Year 1995: ¥500,000 (Direct Cost: ¥500,000)
Fiscal Year 1994: ¥1,600,000 (Direct Cost: ¥1,600,000)
Keywordsfiberboard / building material / thermal insulation material / sound adsorption material / steam-injection pressing / wood based material
Research Abstract

This study deals with lowering the density of fiberboard using foam-type adhesives together with steam-injection pressing technology. Fiberboards with a density range between 0.05-0.40 g/cm^3 were manufactured with three different resins, namely, foam powder phenolic adhesive resin, polymeric isocyanate adhesive resin, and foam isocyanate resin by using steam-injection pressing and the physical and mechanical properties were examined. The results showed that the polymeric isocyanate adhesive resin was most suitable for manufacturing the low-density fiberboard and made it possible to lower the density to 0.1g/cm^3. The properties of low-density fiberboards were affected by the density, the adhesive used, and the resin content. The fiberboards showed, in general, good dimensional stability and high performances for thermal insulation and sound absorption in the density range between 0.1-0.2g/cm^3. Therefore, these could be applied to the core of composite structural materials, thermal insulation and sound absorption materials. The low-density fiberboard overlaid with the veneer of different thicknesses is now investigated targeting the development of continuous production process for 100 mm thick light-weight structural composite panel of high thermal insulation performance.

Report

(3 results)
  • 1995 Annual Research Report   Final Research Report Summary
  • 1994 Annual Research Report
  • Research Products

    (5 results)

All Other

All Publications (5 results)

  • [Publications] 川井秀一他: "ファイバーボードの低比重化して及ぼす原料樹種・比重の影響" 日本木材学会誌. (発表予定).

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1995 Final Research Report Summary
  • [Publications] 川井秀一他: "低密度ファイバーボードの製造と性質" 日本木材学会誌. (発表予定).

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1995 Final Research Report Summary
  • [Publications] S.Kawai et al.: "Lowering the density of fiberboard" J.Japan Wood Res.Soc.(to be submitted).

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1995 Final Research Report Summary
  • [Publications] S.Kawai, et.al.: "Manufacture and properties of low-density fiberboard" J.Japan Wood Res.Soc.(to be submitted).

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1995 Final Research Report Summary
  • [Publications] 川井秀一他: "ファイバーボードの低比重化に及ぼす原料樹種・比重の影響" 木材学会誌. (発表予定).

    • Related Report
      1994 Annual Research Report

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Published: 1994-04-01   Modified: 2016-04-21  

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