| Project/Area Number |
07044122
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| Research Category |
Grant-in-Aid for international Scientific Research
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| Allocation Type | Single-year Grants |
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| Section | Joint Research |
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| Research Institution | The University of Tokyo |
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Principal Investigator |
MASUZAWA Takahisa Institute of Industrial Science, the University of Tokyo, Professor, 生産技術研究所・第2部, 教授 (60013215)
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| Co-Investigator(Kenkyū-buntansha) |
川勝 英樹 東京大学, 生産技術研究所・第2部, 助教授 (30224728)
HIRAMOTO Toshirou VLSI Design and Education Center, the University of Tokyo, 大規模集積システム設計教育研究センター, 助教授 (20192718)
FUJITA Hiroyuki Institute of Industrial Science, the University of Tokyo, 生産技術研究所・第3部, 教授 (90134642)
HASHIMOTO Hideki Institute of Industrial Science, the University of Tokyo, 生産技術研究所・第3部, 助教授 (30183908)
PORTE Henri LOPMD/CNRS, LOPMD研究所, 研究員
HARASHIMA Fumio Institute of Industrial Science, the University of Tokyo, 生産技術研究所・第3部, 教授 (60013116)
DUCROQUET Frederique IEMN/CNRS, IEMN研究所, 研究員
PLANA Robert LAAS/CNRS, LAAS研究所, 研究員
FUJINO Masatoshi Institute of Industrial Science, the University of Tokyo, 生産技術研究所・第2部, 助手 (90242130)
TOSHIYOSHI Hiroshi Institute of Industrial Science, the University of Tokyo, 生産技術研究所・第3部, 講師 (50282603)
CAMON Henri LAAS/CNRS, LAAS研究所, 研究員
MOLLIER Pasca LOPMD/CNRS, LOPMD研究所, 研究員
MINOTTI Partrice LMARC/CNRS, LMARC研究所, 研究員
GORECKI Christophe LOPMD/CNRS, LOPMD研究所, 研究員
PIERALLI Christian LOPMD/CNRS, LOPMD研究所, 研究員
HAESE Nahtalie IEMN/CNRS, IEMN研究所兼リール大学, 研究員助教授
ROLLAND Paul-Alain IEMN/CNRS, IEMN研究所, グループ長
DECARPIGNY J フランス国立科学研究センター, ISEN研究所, 所長
HOUDEN Daniel LPMO/CNRS, LPMO研究所, 所長
GAGNEPAIN Je フランス国立科学研究センター, 工学部門, 部長
DECARPIGNY Jean-Noel ISEN/CNRS
GAGNEPAIN Jean-Jaeques CNRS
HAUDEN Danie フランス科学研究庁, LPMO研究所, 所長
JEANーJAEQUES ガニュパン フランス科学研究庁, 工学部門, 部長
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| Project Period (FY) |
1995 – 1996
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| Project Status |
Completed (Fiscal Year 1996)
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| Budget Amount *help |
¥11,600,000 (Direct Cost: ¥11,600,000)
Fiscal Year 1996: ¥6,200,000 (Direct Cost: ¥6,200,000)
Fiscal Year 1995: ¥5,400,000 (Direct Cost: ¥5,400,000)
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| Keywords | micromachine / fine machining / optical system / atomic force microscope / semiconductor process / electropolishing / mill wave / plastic deformation of Si / micromachining |
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| Research Abstract |
The research project aims at the integration of micromachining technologies to fabricate micromechatronic systems ; these systems are composed of microstructures, actuators, electronic circuits, sensors and optical devices. Because the process technologies for these elements differ each other, it is difficult to apply them all together to built a mcirosystem.
We have selected three target systems : (1) Micro optical systems, (2) scanning probe microscopes, and (3) Scanner for mili-wave anttena. Design, fabrication processes and testing of the systems were carried out.
(1) As for micro optical systems, an optical aligner based on a microactuated stage was designed. The stage should have three dimensional (3-D) shapes to enable multi-degree-of-freedom alignment. We have developed a new technology to self-assemble 3-D microstructures made of polysilicon films. Surface micromachined thin films, i.e.flat microstructures, were elastically deformed into 3-D shapes by the force of microactuators
… More
. The deformation was fixed by annealing structures with Joule heating. No manual manipulation of structures was needed in the process.
(2) As for scanning probe microscopes, an atomic force microscope (AFM) using a very small vibrational probe, called nano-cantilever, was designed. Due to the small mass of the cantilever and the associated high vibrational frequency, it is expected to have extra high sensitivity. The tip of the cantilever was electrochemically etched in a thin film of electrolite. We succeeded to apply the probe in the AFM.
(3) The scanner for mili-wave antena was composed of a tortional stage with the antenna on top, a triangular support with electrostatic driving electrodes and a mili-wave oscillator. The anntena was patterned using thin-film technology. The stage and the support were bulk-micromachined from a fused-quartz substrate and a silicon substrate, respectively. The oscillator was made by the compound semiconductor technology, At the last process, all of them are assembled together. We confirmed the motion of scanner by electrostatic actuation and also the mili-wave emission from the antenna. Thus we demostrated the feasibility of the combined usage of different micromachining processes. Less
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