| Project/Area Number |
07405033
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| Research Category |
Grant-in-Aid for Scientific Research (A)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Material processing/treatments
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| Research Institution | Tokyo Institute of Technology |
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Principal Investigator |
ONZAWA Tadao Tokyo Institute of Technology, Eng., Prof., 工学部, 教授 (10016438)
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| Co-Investigator(Kenkyū-buntansha) |
TAKAHASHI Kunio Tokyo Institute of Technology, Eng., R.A., 工学部, 助手 (70226827)
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| Project Period (FY) |
1995 – 1996
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| Project Status |
Completed (Fiscal Year 1996)
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| Budget Amount *help |
¥21,700,000 (Direct Cost: ¥21,700,000)
Fiscal Year 1996: ¥10,900,000 (Direct Cost: ¥10,900,000)
Fiscal Year 1995: ¥10,800,000 (Direct Cost: ¥10,800,000)
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| Keywords | adhesion / atomic force microscope / ultra high vacuum / molecular dynamics / chemical bond / interface / electronic spectroscopy / surface analysis / AFM / AES |
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| Research Abstract |
A manipulating system which is available in ultra high vacuum chamber of an Auger electron microscope is newly introduced to our adhesion force measurement system. It has a heating system and an additive tilt freedom. Because of them, the reconstruction of surface structure, the smoothing of the surface and the in-situ observation of the surface by secondary electron microscope during the adhesion force measurements.
The gold and the silicon wafer are used as the contacting material. Results are compared with our theory which is deduced assuming the elastic continuum. The effects of the ion sputtering on the adhesion force are examined. The governing mechanism of the adhesional contact is discussed by using the theory and the experimental results.
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