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Research on Thermal Meromechanics of Electronic Packaging

Research Project

Project/Area Number 07455046
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypeSingle-year Grants
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionHOKKIDO UNIVERSITY

Principal Investigator

ISHIKAWA Hiromasa  Hokkaido Univ., Graduate School of Eng., Prof., 大学院・工学研究科, 教授 (80001212)

Co-Investigator(Kenkyū-buntansha) SASAKI Katsuhiko  Hokkaido Univ., Graduate School of Eng., Assoc.Prof., 大学院・工学科研究科, 助教授 (90215715)
Project Period (FY) 1995 – 1997
Project Status Completed (Fiscal Year 1997)
Budget Amount *help
¥6,200,000 (Direct Cost: ¥6,200,000)
Fiscal Year 1997: ¥1,400,000 (Direct Cost: ¥1,400,000)
Fiscal Year 1996: ¥1,500,000 (Direct Cost: ¥1,500,000)
Fiscal Year 1995: ¥3,300,000 (Direct Cost: ¥3,300,000)
KeywordsElectoronic Packaging / Microstructural Mechanics / Macrostructural Mechanics / Constitutive equation / Viscoplasticity / Creep / Solder Alloys / Fatigue Failure
Research Abstract

Solder joints provide both electrical interconnection and mnechanical support. Therefore, the structural integrity of solder joints is a very inportant reliability concern. Especially, the fatigue resistance of near eutectic Pb-Sn solders is a major concern in the development of surface mount technology. Solder alloys, such as Pb-Sn solders are commonly used as high temperature. The solder alloys show strongly time dependent deformation, such as creep and strain rate effect in the high temperature regimes. Then, structural analysis and the estimation of strength of isothermal fatigue life demand a detail experimental observation and theoretical research on the viscous deformation of the solder alloy. In this research, the experimental and theoretical observation on fatigue, crack propagation and damage from both the macro and micro point of view. As a result, the following conclusions are obtained :
(1) The stress-strain relation and yield sufaces of Pb-Sn solder alloy have strong strain rate effect and temperature effect.
(2) The relationship between the number of cycle to fatigue failure and the plastic strain energy density can be expressed by a formula.
(3) The constitutive model incorporating the creep effect was constructed in order to consider the change of microstructure of the solder alloy.
(4) Using the constitutive model and the formula of the result (2), the method to estimate number of cycle to fatigue failure.
(5) The possibility to construct more reliable method for the estimation of fatigue failure was found out, with more accuracy considering of microstructural change of the solder alloy in the constitutive model.

Report

(4 results)
  • 1997 Annual Research Report   Final Research Report Summary
  • 1996 Annual Research Report
  • 1995 Annual Research Report
  • Research Products

    (15 results)

All Other

All Publications (15 results)

  • [Publications] K.Ohguchi: "Fatigue Failure of 60Sn-40Pb Solder Alloys and Its Prediction Using Constitutive Model for Cyclic Plasticity" Proceedings of Fifth International Symposium on Plasticity and Its Current Application. 1. 637-640 (1995)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] 大口 健一: "繰返し粘塑性構成式を用いた60Sn-40Pb材の疲労寿命予測" 日本機械学会論文集A編. 62. 500-506 (1996)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] K.Ohguchi: "Cyclic Deformation and Life Prediction of Pb-Sn Solder Alloys" Proceedings of the third Asia-Pacific Symposium on Advance in Engineering Plasticity and Its Application. 1. 164-169 (1996)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] Hiromasa Ishikawa: "Prediction of Fatigve Foilure of60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity" Transactions of ASME,Journal of Electronic Packaging. 118. 164-169 (1996)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] 大口 健一: "60Sn-40Pbはんだ材の粘塑性変形(ひずみ速度効果の記述)" 日本機械学会論文集A編. 63. 954-961 (1997)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] K.Ohguchi, H.Ishikawa and K.Sasaki: "Fatigue Failure of 60Sn-40Pb Solder Alloys and Its Prediction Using Constitutive Model for Cyclic Plasticity" Proceedings of The Fifth International Symposium on Plasticity and Its Current Applications. 1. 637-640 (1995)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] K.Ohguch, K.Sasaki and H.Ishikawa: "Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity" Transactions JSME A. 62. 500-506 (1996)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] K.Ohguchi, H.Ishikawa and K.Sasaki: "Cyclic Deformation and Life Prediction of Pb-Sn Solder Alloys" Proceedings of the Third Asia-Pacific Symposium on Advances in Engineering Plasticity and Its Applications. 1. 259-264 (1996)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] Hiromasa Ishikawa, Katsuhiko Sasaki and Ken-ichi Ohguchi: "Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity" Transactions of ASME,Journal of Electronic Packaging. 118. 164-169 (1996)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] K.ohguch, K.Sasaki and H.Ishikawa: "Viscoplastic Deformation of 60Sn-40Pb Solder Alloys (Description of Strain Rate Effect)" Transactions JSME A. 63. 954-961 (1997)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] 大口健一: "60Sn-40Pbはんだ材の粘塑性変形(ひずみ速度効果の記述)" 日本機械学会論文集A編. 63. 954-961 (1997)

    • Related Report
      1997 Annual Research Report
  • [Publications] K. Ohguchi: "Cycilic Deformation and Life Prediction of Sn-Pb Solder Alloys" Proceedings of AEPA'96. Vol. 1. 259-264 (1996)

    • Related Report
      1996 Annual Research Report
  • [Publications] H. Ishikawa: "Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity" Transaction of ASME, Jounal of Electronic Packaging. Vol. 118. 164-169 (1996)

    • Related Report
      1996 Annual Research Report
  • [Publications] K.Ohguchi: "Fatigue Failure of 60Sn-40Pb Solder Alloys and Its Prediction Using Constitutive Model for Cyclic Plasticity" Proceedings of Plasticity ′95. Vol.1. 637-640 (1995)

    • Related Report
      1995 Annual Research Report
  • [Publications] 大口健一: "繰返し粘塑性構成式を用いた60Sn-40Pb材の疲労寿命予測" 日本機械学会論文集A編. 第62巻(予定). (1996)

    • Related Report
      1995 Annual Research Report

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Published: 1995-04-01   Modified: 2016-04-21  

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