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Development of CAE System for Fatigue Strength Design of Solder Joints in Surface Mount Devices

Research Project

Project/Area Number 07455051
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypeSingle-year Grants
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionYokohama National University

Principal Investigator

SHIRATORI Masaki  Yokohama National University, Faculty of Engineering, Professor, 工学部, 教授 (60017986)

Co-Investigator(Kenkyū-buntansha) OGASAWARA Nagahisa  Yokohama National University, Faculty of Engineering, Research associate, 工学部, 助手 (60262408)
YU Qiang  Yokohama National University, Faculty of Engineering, Assistant professor, 工学部, 助教授 (80242379)
Project Period (FY) 1995 – 1996
Project Status Completed (Fiscal Year 1996)
Budget Amount *help
¥8,400,000 (Direct Cost: ¥8,400,000)
Fiscal Year 1996: ¥1,500,000 (Direct Cost: ¥1,500,000)
Fiscal Year 1995: ¥6,900,000 (Direct Cost: ¥6,900,000)
KeywordsAssembly / Solder Joints / Elasto-plastic creep / Strength of low-cycle fatigue / Thermal cycle fatigue
Research Abstract

In order to study the get a cyclic stress-strain hysteresis in microelectronic solder joints during a temperature cyclic test, a TSOP,a BGA and a LCCC were modeled for FEA,and a stress-strain evaluating system for solder joints has been developed. The analytic results show that for a temperature cyclic test, long high-temperature and low-temperature dwell times do not contribute to the cyclic strain range in solder joint so much. Based upon the results of the strain analyzes, some efficient testing processes of temperature cycling and mechanical fatigue experiments for the microelectronics solder joint were proposed, and the cycling tests were carried out. The experimental results show a good agreement with the analytic results. The proposed thermal cyclic accelerated test method can save over 50% testing time than an usual methods, and the experimental results showed that the proposed mechanical fatigue test method can be used as a good accelerated test method for the thermal fatigue strength of solder joints. It was shown that the fatigue life of TSOP and BGA solder joints could be estimated by Manson-Coffin's low as N_f=A DELTAepsilon_<in>^n. Further more a CAE system for fatigue strength estimation of solder joints has been developed based upon the statistical optimization method (SOM) and experimental results. It was shown that SOM could be used as a very practical tool to conduct fatigue design of solder joints. The fatigue life of BGA solder joints subjected to operating conditions was estimated, and the results showed that the fatigue life is greatly affected by not only the temperature changing range but also by the mean temperature. In the CAE system, a mathematical programming (successive quadratic programing) was employed to solve the optimization problem of the weight of solder joints.

Report

(3 results)
  • 1996 Annual Research Report   Final Research Report Summary
  • 1995 Annual Research Report
  • Research Products

    (25 results)

All Other

All Publications (25 results)

  • [Publications] Qiang Yu: "Reliability and Structural Optimization of BGA Packages" The PACIFIC RIM/ASME International, Intersociety Electronic & Photonic Packaging Conferenc & Exhibition. (in print). (1997)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] 柏村孝義: "自動車用シートの衝撃挙動に関する研究" 日本機械学会論文集(A編). 63-607(印刷中). (1997)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] 柏村孝義: "統計的最適化手法による衝撃荷重を受ける構造部材の最適設計" 日本機械学会論文集(A編). 62-603. 2422-2427 (1996)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] M. Shiratori: "Fatigue-Strength Prediction of Microelectronics Solder Joints under Thermal Cyclic Loading" Proceeding of 5th Intersociety Conference on Thermal Phenomena in Electronics Systems. (in print). (1996)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] 王樹波: "表面実装部品はんだ接合部の弾塑性-クリープ有限要素解析法に関する研究" 日本機械学会論文集. 62. 527-532 (1996)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] 柏村孝義: "実験計画法,数理計画法を用いた構造最適化" 日本機械学会論文集(A編). 62-601. 2180-2185 (1996)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] Q. YU: "A Study of Mechanical and Thermal Stress behavior due to Global and Local Thermal Mismatch of Dissimilar Materials in Electronic Packaging" Advances in Electronic Packaging, ASME. EEP-Vol. 10-1. 389-394 (1995)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] M. Shiratori: "A Computational and Experimental Hybrid Approach to Creep Fatigue Behavior of Surface-Mounted Solder Joints" Advances in Electronic Packaging, ASME. EEP-Vol. 10-1. 451-457 (1995)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] Qiang Yu: "Fatigue Crack Propagating Evaluation of Microelectronics Solder Joints." The PACIFIC RIM/ASME International, Intersociety Electronic & Photonic Packaging Conference & Exhibition. (in print). (1997)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] Takayoshi Kashiwamura: "Study on Impact Behavior of Automobile Seat" Trans.of JSME (A). 63-607, (in print). (1997)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] Takayoshi Kashiwamura: "Structural Optimization Using the Design of Experiments and Mathematical Programming" Trans.of JSME (A). 62-601. 2180-2185 (1996)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] Takayoshi Kashiwamura: "Optimum Design of Frame Column Subjected to Axial Crushing by Statistical Optimization Method" Trans. of JSME (A).62-603. 2422-2427 (1996)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] Masaki Shiratori: "Assessment of Residual Fatigue Lives for Surface-Cracked Structures by an Influence Function Method" The 1995 Joint ASME/JSME Pressure Vessels and Piping Conference. PVP-V,305. 357-364 (1995)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] Masaki Shiratori: "Analysis of Stress Intensity Factors for Surface Cracks in Thermal Stress Field." The 1995 Joint ASME/JSME Pressure Vessels and Piping Conference. PVP-V,305. 379-385 (1995)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] Qiang Yu: "A Study of Mechanical and Thermal Stress behavior due to Global and Local Thermal Mismatch of Dissimilar Materials in Electronic Packaging." Advances in Electronic Packaging, ASME. EEP-Vol 10-1. 389-394 (1995)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] M.Shiratori: "A Computational and Experimental Hybrid Approach to Creep Fatigue Behavior of Surface-Mounted Solder Joints." Advances in Electronic Packaging, ASME. EEP-Vol.10-1. 451-457 (1995)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] Qiang Yu: "Reliability and Structural Optimization of BGA Packages" The PACIFIC RIM/ASME International, Intersociety Electronic & Photonic Packaging Conference & Exhibition. (in print). (1997)

    • Related Report
      1996 Annual Research Report
  • [Publications] Qiang Yu: "Fatigue Crack Propagating Evaluation of Microelectronics Solder Joints" The PACIFIC RIM/ASME International, Intersociety Electronic & Photonic Packaging Conference & Exhibition. (in print). (1997)

    • Related Report
      1996 Annual Research Report
  • [Publications] 柏村 孝義: "実験計画法,数理計画法を用いた構造最適化" 日本機械学会論文集(A編). 62-601. 2180-2185 (1996)

    • Related Report
      1996 Annual Research Report
  • [Publications] 柏村 孝義: "統計的最適化手法による衝撃荷重を受ける構造部材の最適設計" 日本機械学会論文集(A編). 62-603. 2422-2427 (1996)

    • Related Report
      1996 Annual Research Report
  • [Publications] 柏村 孝義: "自動車用シートの衝撃挙動に関する研究" 日本機械学会論文集(A編). 63-607(印刷中). (1997)

    • Related Report
      1996 Annual Research Report
  • [Publications] M.Shiratori: "Fatigue-Strength Prediction of Microelectronics Solder Joints under Thermal Cyclic Loading" Proceeding of 5th Intersociety Conference on Thermal Phenomena in Electronic Systems (in print). (1996)

    • Related Report
      1995 Annual Research Report
  • [Publications] 王樹波: "表面実装部品はんだ接合部の弾塑性-クリープ有限要素解析法に関する研究" 日本機械学会論文集. 62. 527-532 (1996)

    • Related Report
      1995 Annual Research Report
  • [Publications] Q.YU: "A Study of Mechanical and Thermal Stress behavior due to Global and Local Thermal Mismatch of Dissimilar Materials in Electronic Packaging" Advances in Electronic Packaging, ASME. EEP-Vol.10-1. 389-394 (1995)

    • Related Report
      1995 Annual Research Report
  • [Publications] M.Shiratori: "A Computational and Experimental Hybrid Approach to Creep Eatigue Behavior of Surface-Mounted Solder Joints" Advances in Electronic Packaging, ASME. EEP-Vol.10-1. 451-457 (1995)

    • Related Report
      1995 Annual Research Report

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Published: 1995-04-01   Modified: 2016-04-21  

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