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Ultraprecision Grinding Technique of Fine Ceramics with Micro Loose Diamond Grain

Research Project

Project/Area Number 07555042
Research Category

Grant-in-Aid for Scientific Research (A)

Allocation TypeSingle-year Grants
Section試験
Research Field 機械工作・生産工学
Research InstitutionOkayama university

Principal Investigator

NAKAJIMA Toshikatsu  Okayama University, Fuculty of Engineering, Professor, 工学部, 教授 (80026038)

Co-Investigator(Kenkyū-buntansha) OHASHI Kazuhito  Okayama University, The Graduate School of Natural Science and Technology, Resea, 大学院・自然科学研究科, 助手 (10223918)
TSUKAMOTO Shinya  Okayama University, Fuculty of Engineering, Associate Professor, 工学部, 助教授 (80163773)
Project Period (FY) 1995 – 1996
Project Status Completed (Fiscal Year 1996)
Budget Amount *help
¥7,200,000 (Direct Cost: ¥7,200,000)
Fiscal Year 1996: ¥2,300,000 (Direct Cost: ¥2,300,000)
Fiscal Year 1995: ¥4,900,000 (Direct Cost: ¥4,900,000)
Keywordsultraprecision grinding / micro loose abrasive grain / sucking machining / carrier / restrictor / cavitation / clearance / grain number / 吸引加工 / クリアランス
Research Abstract

In this reserch, a new ultraprecision grinding technique of fine ceramics with micro loose diamond grain is proposed by development of a ultraprecision sucking machining apparatus and investigating the new grinding mechanism with the apparatus. Furthermore, machining mechanism is investigated by analyzing flowing behavior of carrier theoretically. Main conclusions obtained in this research are as follows : (1) The ultraprcision sucking machining apparatus, which carrier mixed with micro loose abrasive grains is sucked through the restrictor just above workpiece surface to be machined by a pump, is developed. (2) Stock removal is generated and surface finish is improved with the machining technique. (3) In the case of 2.0mm in clearance of restrictor, highest machining effect is occurred, so that both stock removal and decrease of surface roughness are maximum. (4) Workpiece surface downstream from just under the center of restrictor is machined, and at the machining point generating maximum stock removal, stock removal rate is about 17nm/min. (5) Workpiece material is removed by interference of abrasive grains with not only flowing of carrier through a restrictor but also cavitation occurring downstream from the center of restrictor. (6) Stock removal is expressed as a function of cavitation, clearance and grain number effect, and it can be predicted by three effect of the ultraprecision machining.

Report

(3 results)
  • 1996 Annual Research Report   Final Research Report Summary
  • 1995 Annual Research Report
  • Research Products

    (6 results)

All Other

All Publications (6 results)

  • [Publications] 中島利勝: "常圧焼結窒化けい素の単粒研削によるクラック層に関する研究" 精密工学会誌. 62巻9号. 1330-1334 (1996)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] Toshikatsu NAKAJIMA: "Dressing Process of Resinoid Bonded Wheel with YAG Laser" Proceeding of The Third International Conference on Progress of Cutting and Grinding. Vol.3,Nov. 570-575 (1996)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] Toshikatsu NAKAJIMA: "Crack Penetration Layr in a Single Point Diamond Grinding of Sintered Silicon Nitride" Journal of the Japan Society for Precision Engineering. Vol.62 No.3. 1330-1334 (1996)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] Toshikatsu NAKAJIMA: "Dressing Proceess of Resionoid Bonded Wheel with YAG Laser" Proceeding of The Third International Conference on Progress of Cutting and Grinding. Vol.3 Nov.570-575 (1996)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] 中島利勝: "常圧焼結窒化けい素の単粒研削によるクラック層に関する研究" 精密工学会誌. 62巻9号. 1330-1334 (1996)

    • Related Report
      1996 Annual Research Report
  • [Publications] Toshikatsu NAKAJIMA: "Dressing Process of Resinoid Bonded Wheel with YAG Laser" Proceeding of The Third International Conference on Progress of Cutting and Grinding. Vol.3,Nov. 570-575 (1996)

    • Related Report
      1996 Annual Research Report

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Published: 1995-04-01   Modified: 2016-04-21  

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