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Analysis on Via-hole Filling Rrocess in Multilayred LSI Interconnection

Research Project

Project/Area Number 07650100
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionKYOTO UNIVERSITY

Principal Investigator

KITAMURA Takayuki  Kyoto University, Graduate School of Engineering, Associate Professor, 工学研究科, 助教授 (20169882)

Project Period (FY) 1995 – 1996
Project Status Completed (Fiscal Year 1996)
Budget Amount *help
¥2,700,000 (Direct Cost: ¥2,700,000)
Fiscal Year 1996: ¥1,100,000 (Direct Cost: ¥1,100,000)
Fiscal Year 1995: ¥1,600,000 (Direct Cost: ¥1,600,000)
KeywordsLSI / Multilayred interconnection / Via-hole / Filling process / Surface diffusion / Numerical simulation / Reflow / Dellevence Method
Research Abstract

As recent advances on LSI (large scale integrated circuit) technology requires further reduction of the size, multilayred structure has been intensely investigated. The forming process of interconnection between the layrs is one of the key issues in order to accomplish the structure. The reflow, in which the via-hole is filled with the conductor metal by the surface diffusion, is a promising method though the detail in the process has not been clarified yet. In this study, the process is numerically simulated for a two-dimensional model (filling into a groove) and an axi-symmetrical one (filling into a circular cylinder) solving the differential equation of surface diffusion by a finite dellevence method. The results show that the perfect filling can not be achieved for the groove or the cylinder with the aspect ratio, (depth/half width) or (depth/radius), larger than 3. Feasible conditions for the perfect filling are illustrated in a map for reader's convenience. The time for the filling, which is strongly dependent on the size and aspect ratio of via-hole, is discussed. Moreover, the process in incomplete filling is analyzed and the modified shape of via-hole is proposed on the basis of the simulation. The diffusion process is simurated in atomic level in detail using molecular dynamics under constant tempelature.

Report

(3 results)
  • 1996 Annual Research Report   Final Research Report Summary
  • 1995 Annual Research Report
  • Research Products

    (15 results)

All Other

All Publications (15 results)

  • [Publications] 北村隆行: "LSI多層配線のビア孔埋め込みリフロープロセス解析" 日本機械学会論文集,A編. 62. 1754-1759 (1996)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] Takayuki Kitamura: "Numerical Analysis on Via-hole Filling Process in Multilayered LSI Interconnection" Experimental/Numerical Mechanics in Electronic Packaging. 17-18 (1996)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] 北村隆行: "静水圧下のアルミニウム粒界拡散の分子動力学シミュレーション" 日本機械学会論文集,A編. 62. 2791-2796 (1996)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] 梅野宜崇: "粒界三重線近傍における拡散の分子動力学シミュレーション" 日本機械学会第10回計算力学講演会発表予定.

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] Takayuki Kitamura: "Numerical Analysis on Reflow Process of Via-Hole Filling of a Conductor Metal in LSI in Multilayred Interconnection" Trans.JSME,A. 62. 1754-1759 (1996)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] Takayuki Kitamura: "Numerical Analysis on Via-hole Filling Process in Multilayred LSI Interconnection" Experimental/Numerical Mechanics in Electronic Packaging. 17-18 (1996)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] Takayuki Kitamura: "Molecular Dynamics Study on Grain Boundary Diffusion in Aluminum under Hydrostatic Stress" Trans.JSME,A. 62. 2791-2796 (1996)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] Takayuki Kitamura: "Molecular Dynamics Simulation on Diffusion near Grain Boundary Triple Junction" To be appeared in Proc.in JSME National Conf.On Computational Mechanics.

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1996 Final Research Report Summary
  • [Publications] 北村隆行: "LSI多層配線のビア孔埋め込みリフロープロセス解析" 日本機械学会論文集,A編. 62・599. 1754-1759 (1996)

    • Related Report
      1996 Annual Research Report
  • [Publications] Takayuki Kitamura: "Numerical Analvsis on Via-hole Filling Process in Multilayered LSI Interconnection" Experimental/Numerical Mechanics in Electronic Packaging. 17-18 (1996)

    • Related Report
      1996 Annual Research Report
  • [Publications] 北村隆行: "静水圧下のアルミニウム粒界拡散の分子動力学シミュレーション" 日本機械学会論文集,A編. 62・604. 2791-2796 (1996)

    • Related Report
      1996 Annual Research Report
  • [Publications] 北村隆行: "粒界三重線近傍における拡散の分子動力学シミュレーション" 日本機械学会第10回計算力学講演会. (発表予定).

    • Related Report
      1996 Annual Research Report
  • [Publications] 北村隆行: "LSI多層配線ビア孔へのリフローシミュレーション" 日本機械学会講演論文集. 95-4. 167-168 (1995)

    • Related Report
      1995 Annual Research Report
  • [Publications] 北村隆行: "LSI多層配線ビア孔リフロープロセス解析" 日本機械学会講演論文集. 95-2. 269-270 (1995)

    • Related Report
      1995 Annual Research Report
  • [Publications] 北村隆行: "静水圧下のアルミ粒界拡散の分子動力学シミュレーション" 日本機械学会講演論文集. 95-10. 160-161 (1995)

    • Related Report
      1995 Annual Research Report

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Published: 1995-04-01   Modified: 2016-04-21  

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