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Fabrication of Micro Bump Using Electroless Plating

Research Project

Project/Area Number 08650855
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field Material processing/treatments
Research InstitutionKanto Gakuin University

Principal Investigator

HONMA Hideo  College of Engineering Kanto Gakuin University Professor, 工学部, 教授 (00064105)

Project Period (FY) 1996 – 1997
Project Status Completed (Fiscal Year 1997)
Budget Amount *help
¥1,900,000 (Direct Cost: ¥1,900,000)
Fiscal Year 1997: ¥500,000 (Direct Cost: ¥500,000)
Fiscal Year 1996: ¥1,400,000 (Direct Cost: ¥1,400,000)
KeywordsElectroless Nickel Plating / Electroless Copper Plating / Initial Deposition / in-situ monitoring / Bump / DMAB / Via Hole / Fine Copper Pattern / 無電解金めっき / バリアメタル / アルミニウム電極 / マイクロ接続
Research Abstract

Recently, the formation of microelectrode on the IC chip and the high density wiring board have become important. First, a microbump formation on the aluminum electrode using the electroless nickel plating was investigated. The micro nickel bumps of 20 mum wide and 15 mum high were formed by applying the nickel displacement process instead of the zincate process on the aluminum. It is important to control the behavior of the early stage of deposition reaction in the bump formation. The flat bumps were formed on the electrode by activating with the dimethyl amine borane (DMAB) solution in place of the nickel displacement solution. We examined the plating of the high density wiring as the next research that is required to IC mounting. Generally, the palladium catalyst has been used as the pretreatment to initiate the electroless nickel plating on copper. However, the extraneous deposition did not occured using the mixed solution of DMAB and nickel instead of the palladium catalyst solution. The electroless nickel films can be obtained on the copper substrate adding DMAB into the electroless nickel plating bath. Furthermore, the selective nickel deposition was formed by the control of the oxidation of reducing agent and early stage of electroless nickel plating.

Report

(3 results)
  • 1997 Annual Research Report   Final Research Report Summary
  • 1996 Annual Research Report
  • Research Products

    (19 results)

All Other

All Publications (19 results)

  • [Publications] Hideto Watanabe and Hideo Honma: "Fabrication of Nickel Microbump on Aluminum Substrate Using Electroless Nicker Plating" Trans,IMF. 74. 138-141 (1996)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] 渡辺 秀人、本間 英夫: "無電解ニッケルめっきによるアルミニウム上へのマイクロバンプの形成" 第3回シンポジウム、エレクトロニクスにおけるマイクロ接合・実装技術論文集. 29-32 (1997)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] 渡辺 秀人、五十嵐 靖、本間 英夫: "DAMB溶液による銅パターンの選択的活性化法" 回路実装学会誌. 12. 29-33 (1997)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] Hideto Watanabe and Hideo Honma: "Fabrication of Nickel Microbomp on Alminum Substrate Using Electroless Nickel Plating" J,Electrochem.Soc.144. 471-476 (1997)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] 阿部 真二、藤波 知之、青野 隆之、本間 英夫: "微小ビアホールへの無電解銅めっきの均一析出性" 表面技術. 48. 433-438 (1997)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] 渡辺 秀人、五十嵐 靖、本間 英夫: "ジメチルアミンボランを第2還元剤とした無電解ニッケルめっき" 回路実装学会誌. 12. 231-235 (1997)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] Hideto Watanabe and Hideo Honma: "Fabrication of Nickel Microbump on Alumium Substrate Using Eleatroless Nickel Plating" Trans.IMF. Vol.74. 138-141 (1996)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] Hideto Watanabe and Hideo Honma: "Fabrication of Microbumps on Alumium by Eleatroless Nickel Plating" 3rd.Symposium "Microjoining and Assembly Technology in Electronics". 29-32 (1997)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] Hideto Watanabe, Yasushi Igarashi, Hideo Honma: "Eleatroless Nickel Plating on Copper Fine Patterns by Selective Activation Process" J.Japan Institute for Interconnecting and Packaging Electronic Circuits. Vol.12. 29-33 (1997)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] Hideto Watanabe and Hideo Honma: "Fabrication of Nickel Microbump on Alumium Substrate Using Eleatroless Nickel Plating" J.Electrochem.Soc.Vol.144. 471-476 (1997)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] Shinji Abe, Tomoyuki Fujinami, Takayuki Aono, Hideo Honma: "Uniformity of Electroless Copper Plating for Small Via Hole" J.Surf.Finish.Soc.JPN. Vol.48. 433-438 (1997)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] Hideto Watanabe, Yasushi Igarashi, Hideo Honma: "Eleatroless Nickel Plating Using DMAB as 2nd Reducing Agent" J.Japan Institute for Interconnecting and Packaging Electronic Circuits. Vol.12. 231-235 (1997)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1997 Final Research Report Summary
  • [Publications] Hideto Watanabe and Hedeo Honma: "Fabrication of Nickel Microbump on Aluminum Substrate Using Electroless Nickel Plating" Journal of The Electrochemical Society. 144,2. 471-476 (1997)

    • Related Report
      1997 Annual Research Report
  • [Publications] 阿部真二, 藤波知之, 青野隆之, 本間英夫: "微小ビアホールへの無電解銅めっきの均一析出性" 表面技術. 48,4. 433-438 (1997)

    • Related Report
      1997 Annual Research Report
  • [Publications] 渡辺秀人, 五十嵐靖, 本間英夫: "ジメチルアミンボランを第2還元剤とした無電解ニッケルめっき" 回路実装学会誌. 12,4. 231-235 (1997)

    • Related Report
      1997 Annual Research Report
  • [Publications] 渡辺秀人、五十嵐靖、本間英夫: "DMAB溶液による銅パターンの選択的活性化法" 回路実装学会誌. 12巻29号. 29-33 (1997)

    • Related Report
      1996 Annual Research Report
  • [Publications] 渡辺秀人、本間英夫: "無電解めっきによるアルミニウム上へのマイクロバンプ形成" 第3回エレクトロニクスにおけるマイクロ接合・実装学会シンポジウム論文集. 29-32 (1997)

    • Related Report
      1996 Annual Research Report
  • [Publications] H.Watanabe and H.Honma: "Fabrication of Nickel Microbump on Aluminum using Electroless Nickel Plating." J.Electrochem.Soc.144,471. (1997)

    • Related Report
      1996 Annual Research Report
  • [Publications] 阿部真二、藤波知之、青野隆之、本間英夫: "微小ビアホールへの無電解めっきの均一析出性" 表面技術. 48巻4号. (1997)

    • Related Report
      1996 Annual Research Report

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Published: 1996-04-01   Modified: 2016-04-21  

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