• Search Research Projects
  • Search Researchers
  • How to Use
  1. Back to previous page

Study on Thermal Fatique Life Prediction of Micro Soldered Joints

Research Project

Project/Area Number 09450044
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypeSingle-year Grants
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionTokyo Gakugei University

Principal Investigator

EBIHARA Yoshinori  Dept. of Education, Professor, 教育学部, 教授 (00203654)

Co-Investigator(Kenkyū-buntansha) TANEDA Motoharu  Fukuyama Univ. Dept. of Engineering, Professor, 工学部, 教授 (90188392)
Project Period (FY) 1997 – 1999
Project Status Completed (Fiscal Year 1999)
Budget Amount *help
¥13,300,000 (Direct Cost: ¥13,300,000)
Fiscal Year 1999: ¥1,100,000 (Direct Cost: ¥1,100,000)
Fiscal Year 1998: ¥2,800,000 (Direct Cost: ¥2,800,000)
Fiscal Year 1997: ¥9,400,000 (Direct Cost: ¥9,400,000)
KeywordsSubstrate / Solder / Fatigue Life Evaluation / Creep / Crack Initiation Life / Cyclic Bending / Fracture Life / Manson-Coffin's Law / クリープ / 有限要素法 / 破断寿命 / き裂発生寿命 / 基板くり返しそり変形 / ボールグリッドアレイパッケージ / 温度サイクル / 要素分割 / ぬれ / 疲労強度 / 繰り返しそり変形
Research Abstract

Torsional fatigue tests and creep tests were carried out on a 60Sn-40Pb solder. In both tests three temperatures (303-333K) were used, and in the fatigue test five cycling frequencies (0.001-5.0Hz) were used. An evaluation method for the solder fatigue life under relatively high temperature or low cycling frequency was proposed from the test results, nothing that the characteristics of fatigue under the above mentioned conditions were similar to the creep characteristics. Furthermore, this evaluation method was applied to the estimation of the crack initiation life of through-hole-type joints. By comparing the estimated values with the experimental ones it was clarified that this method was valid for the assessment of the crack initiation life of solder joints.
To predict the fatigue life of soldered joints owing to the cyclic bending of the substrates when carrying movable electronic equipments, we conducted the fatigue tests by bending the substrates cyclically. As a result of the fatigue tests, it was shown that the fracture life was predicted well by Manson-Coffin's law using the equivalent plastic strain ranges as parameters and the life prediction equation was determined. Furthermore, the easier prediction method that the fracture life was about five times the crack initiation life was obtained.
Finally, the state of the art of the research on fatigue life prediction of micro soldered joints was reported.

Report

(4 results)
  • 1999 Annual Research Report   Final Research Report Summary
  • 1998 Annual Research Report
  • 1997 Annual Research Report
  • Research Products

    (24 results)

All Other

All Publications (24 results)

  • [Publications] 海老原 理徳: "プリント基板が繰り返し曲げを受けるBGAはんだ接合部の疲労寿命予測"エレクトロニクス実装学会誌. Vol.3,No.5. 未定 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] 海老原 理徳: "強度信頼性解析の現状と今後の課題"エレクトロニクス実装学会誌. Vol.3,No.1. 8-10 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] 海老原、小俣、茂木、中村、酒井: "BGAパッケージはんだ接合部の疲労強度評価"エレクトロニクス実装学会誌. Vol.1,No.1. 53-57 (1998)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] 種田元治、上西研、本廣誠二: "クリープ特性を基にしたはんだのクリープ疲労寿命評価法"日本機械学会論文集A編. 第64巻 第617号. 50-57 (1998)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] 上西研、飯野牧夫、種田元治: "表面実装微細はんだ接合部の疲労き裂発生および進展寿命の評価"日本機械学会論文集A編. 第64巻 第620号. 871-878 (1998)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] 小俣宣行、海老原理徳: "微細はんだ接合部の熱疲労強度解析"東京学芸大学紀要. 第49集. 1-4 (1997)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] Y. Ebihara: "Fatigue Life Prediction of BGA Solder Joints under Cyclic Bending of PCB"J. of Japan Institute of Electronics Packaging. Vol. 3, No. 5 (to be published). (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] Y. Ebihara: "The State of the Art of Analysis of Strength Reliability of Electronics Packaging"J. of Japan Institute of Electronics Packaging. Vol. 3, No. 1. 8-10 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] Y. Ebihara et al.: "Fatigue Strength Evaluation to BGA Package Solder Joints"J. of Japan Institute of Electronics Packaging. Vol. 1, No. 1. 53-57 (1998)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] M. Taneda et al.: "Creep-Fatigue Life Evaluation of Solder Based on Creep Characteristics"Trans. Of the Japan Society of Mechanical Engineers (A). Vol. 64, No. 617. 50-57 (1998)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] K. Kaminishi et al.: "Evaluation of Fatigue Crack Initiation and Extension Life in Microelectronics solder Joint of Surface-Mounted Type"Trans. Of the Japan Society of Mechanical Engineers (A). Vol. 64, No. 620. 871-878 (1998)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] No. Omata et al.: "Thermal Fatigue Strength Analysis of Micro Solder Joints"Bulletin of Tokyo Gakugei Univ., Section IV. Vol. 49. 1-4 (1997)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] 種田元治、上西研、本廣誠二: "クリープ特性を基にしたはんだのクリープ疲労寿命評価法"日本機械学会論文集. 64巻617号A編. 50-57 (1998)

    • Related Report
      1999 Annual Research Report
  • [Publications] 海老原理徳、小俣宣行、酒井秀久、茂木正徳、中村直樹: "プリント配線板がくり返しそり変形を受けるBGAはんだ接合部の疲労強度解析"日本機械学会第12回計算力労講演会講演論文集. No.99-5. 541-542 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] 海老原理徳: "各種電子機器の実装技術と信頼性"エレクトロニクス実装学会編2010年までのエレクトロニクス実装の信頼性技術. 3-16 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] 海老原理徳: "強度信頼性解析の現状と今後の課題"エレクトロニクス実装学会誌. Vol.3,No1. 8-10 (2000)

    • Related Report
      1999 Annual Research Report
  • [Publications] 小俣宣行,海老原理徳: "BGAはんだ接合部の有限要素解析に関する基礎的検討" 東京学芸大学紀要 第6部門. 第50集. (1998)

    • Related Report
      1998 Annual Research Report
  • [Publications] Y.Ebihara,N.Omata H.Sakai,M.Motegi,N.Nakamura: "Fatigue Life Prediction of BGA Solder Joints" Proceedings of the International Intersociety Electronic Packaging Conference-INTER pack ‘99. 未定. 未定 (1999)

    • Related Report
      1998 Annual Research Report
  • [Publications] 小俣宣行,海老原理徳 菅谷茂良: "機械的疲労試験による微細はんだ接合部の疲労寿命評価" 東京学芸大学紀要 第6部門. 第51集(未定). (1999)

    • Related Report
      1998 Annual Research Report
  • [Publications] 海老原理徳,小俣宣行: "微小はんだ接合部の熱疲労強度解析" 計算工学講演会論文集. 第2巻第3号. 1061-1062 (1997)

    • Related Report
      1997 Annual Research Report
  • [Publications] 海老原理徳,小俣宣行,茂木正徳,中村直樹,酒井秀久: "プリント配線板の繰り返しそり変形によるBGAパッケージはんだ接合部の疲労破壊の寿命予測" 第10回計算力学講演会講演論文集. NO.97-7. 31-32 (1997)

    • Related Report
      1997 Annual Research Report
  • [Publications] 小俣宣行,海老原理徳: "微細はんだ接合部の熱疲労強度解析" 東京学芸大学紀要 第6部門. 第49集. 1-4 (1997)

    • Related Report
      1997 Annual Research Report
  • [Publications] 海老原理徳,周雪平,雀从君: "最大接戦方向応力破壊基準によるセラミックス・金属接合材の強度評価" 東京学芸大学紀要 第6部門. 第49集. 5-12 (1997)

    • Related Report
      1997 Annual Research Report
  • [Publications] 海老原理徳,小俣宣行: "BGAパッケージはんだ接合部の疲労強度評価" エレクトロニクス実装学会誌. Vol1,No1(未定). (1998)

    • Related Report
      1997 Annual Research Report

URL: 

Published: 1997-04-01   Modified: 2016-04-21  

Information User Guide FAQ News Terms of Use Attribution of KAKENHI

Powered by NII kakenhi