| Project/Area Number |
09650088
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Materials/Mechanics of materials
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| Research Institution | TOKYO INSTITUTE OF TECHNOLOGY |
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Principal Investigator |
NAKAMURA Haruo Associate Professor, Dept.Mechano-Aerospace Engineering, TOKYO INSTITUTE OF TECHNOLOGY, 工学部, 助教授 (40134829)
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| Co-Investigator(Kenkyū-buntansha) |
SHIMAMURA Yoshinobu Research Associate, Dept.Mechano-Aerospace Engineering, TOKYO INSTITUTE OF TECHN, 工学部, 助手 (80272673)
TODAROKI Akira Associate Professor, Dept.Mechano-Aerospace Engineering, TOKYO INSTITUTE OF TECH, 工学部, 助教授 (50211397)
KOBAYASHI Hideo Professor, Dept.Mechano-Aerospace Engineering, TOKYO INSTITUTE OF TECHNOLOGY, 工学部, 教授 (00016487)
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| Project Period (FY) |
1997 – 1998
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| Project Status |
Completed (Fiscal Year 1998)
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| Budget Amount *help |
¥3,400,000 (Direct Cost: ¥3,400,000)
Fiscal Year 1998: ¥800,000 (Direct Cost: ¥800,000)
Fiscal Year 1997: ¥2,600,000 (Direct Cost: ¥2,600,000)
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| Keywords | Interface / Hydrogen Diffusion / Fracture / Ddformation / Molecular Dynamics / Fe-H potential / Fe-Hポテンシャル / α鉄 / 水素侵入 / ひずみ / 強度 |
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| Research Abstract |
Deformation and fracture characteristics of an interface, which is commonly encountered in a multi-layered structure of an electrode of a solar cell, in a BCC metal (alpha-Fe) under hydrogen diffusion are investigated by the molecular dynamics (MD) analysis. Influence of strain, existence of interface and hydrogen concentration on diffusion of hydrogen from a free surface are studied. Two types of Fe-H potentials gave different results. By comparing these results with a physical H diffusion mechanism, a new model of H diffusion combining two Fe-H potentials, was developed. In this model, deformation and fracture of an interface are relatively promoted than the previous models using a single Fe-H potential. It is shown major factors of interface fracture are applied strain and hydrogen concentration. So, to improve strength of an interface, it is suggested to reduce residual stresses during lamination and to coat a moisture proof film around the electrode.
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