• Search Research Projects
  • Search Researchers
  • How to Use
  1. Back to previous page

Development of an Apparatus for Measuring Submicroscopic Current Distribution and Evaluation of Interface Delamination and Atom Migration irr Electronic Devices

Research Project

Project/Area Number 10305010
Research Category

Grant-in-Aid for Scientific Research (A).

Allocation TypeSingle-year Grants
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionKYOTO UNIVERSITY

Principal Investigator

OTHANI Ryuichi  Kyoto University, Department of Engineering Physics and Mechanics, Professor, 工学研究科, 教授 (50025946)

Co-Investigator(Kenkyū-buntansha) TADA Naoya  Okayama University, Department of Mechanical Engineering, Associate Professor, 工学部, 助教授 (70243053)
KITAMURA Takayuki  Kyoto University, Department of Engineering Physics and Mechanics, Professor, 工学研究科, 教授 (20169882)
Project Period (FY) 1998 – 2000
Project Status Completed (Fiscal Year 2000)
Budget Amount *help
¥40,400,000 (Direct Cost: ¥40,400,000)
Fiscal Year 2000: ¥2,000,000 (Direct Cost: ¥2,000,000)
Fiscal Year 1999: ¥1,900,000 (Direct Cost: ¥1,900,000)
Fiscal Year 1998: ¥36,500,000 (Direct Cost: ¥36,500,000)
KeywordsScanning Probe Microscope / Apparatus for Measuring Submicroscopic Current Distribution / Electric Field Analysis / Small Defect / Small Crack / 微小はく離
Research Abstract

1. Electric field analysis for predicting the distribution of multiple cracks by means of direct current electrical potential method
Crack-current modification method was proposed for analyzing the electric field around multiple cracks. Electric field analysis was carried out for randomly distributed disk-shaped cracks in a three-dimensional conductor and for distributed through-cracks in a two-dimensional one. Based on the results of the analysis, a procedure was proposed for predicting the distribution of multiple cracks by direct current electrical potential method.
2. Evaluation of a small defect existing right under the surface of conductive materials
A small defect existing right under the surface of the conductive material was evaluated by means of a scanning probe microscone with current measuring system where electric current was supplied through a cantilever to the conductor and the defect was evaluated by the change in the current. Electric analysis was carried out for discussing the basis of this apparatus by the crack-current modification method which was used for the electric field analysis around multiple cracks. It was clarified by actual current measurement that contact condition or contact electric resistance between the cantilever and the specimen has a great influence on the amount of current. In order to find the best measuring condition, electric analysis was carried out simulating the apparatus in which the contact area was fluctuated intentionally. The following results were obtained. Modification of the shape of a cantilever tip is necessary. Further development is needed on the servomechanism of cantilever.

Report

(4 results)
  • 2000 Annual Research Report   Final Research Report Summary
  • 1999 Annual Research Report
  • 1998 Annual Research Report
  • Research Products

    (23 results)

All Other

All Publications (23 results)

  • [Publications] 多田直哉: "Analysis of Direct Current Potential Field around Multiple Spherical Defects"JSME International Journal,Series A,. 43・2. 109-116 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 多田直哉: "Measurement of Cavities and Evaluation of Creep Damage Parameters"Proc.2000 SEM IX International Congress on Experimental Mechanics. 409-412 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 坂東正樹: "多端子型直流電位差法による多数き裂の分布評価"日本非破壊検査協会平成12年度春季大会講演概要集. 111-112 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 多田直哉: "多端子型直流電位差法によるき裂分布の非破壊評価"日本機械学会材料力学部門講演会講演論文集. No.00-19. 317-318 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 多田直哉: "多数分布き裂型高温疲労損傷の直流電位差法による非破壊定量評価"日本材料学会第38回高温強度シンポジウム前刷集. 60-63 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Tada, N., et. al.: "Analysis of Direct Current Potential Field around Multiple Spherical Defects"JSME International Journal Series A. 43-2. 109-116 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Tada, N., et. al.: "Measurement of Cavities and Evaluation of Creep Damage Parameters."Proc. 2000 SEM IX-th Int. Congress on Experimental Mechanics. 409-412 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Bando M., et. al.: "Prediction of the Distribution of Multiple Cracks by means of Direct Current Electrical Potential Method"Report of 2000 Spring Meeting of JSNDE. 111-112 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Tada.N., et. al.: "Non-destructive Evaluation of Crack Distribution by means of Multi-Probe Direct Current Electrical Potential Method"Report of 2000 Meeting of Solid Mechanics and Material Engng., JSME. No.00-19. 317-318 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Tada, N., et. al.: "Quantitative NDE of High-Temperature Fatigue Damage characterized by Multiple Distributed Cracks by means of Direct Current Electrical Potential Method"Report of 38^<th> Symposium on High-Temp. Strength, JSMS. 63-64 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 多田直哉: "Analysis of Direct Current Potential Field around Multiple Spherical Defects"JSME International Journal,Series A,. 43・2. 109-116 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] 多田直哉: "Measurement of Cavities and Evaluation of Creep Damage Parameters"Proc.2000 SEM IX International Congress on Experimental Mechanics . 409-412 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] 坂東正樹: "多端子型直流電位差法による多数き裂の分布評価"日本非破壊検査協会平成12年度春季大会講演概要集. 111-112 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] 多田直哉: "多端子型直流電位差法によるき裂分布の非破壊評価"日本機械学会材料力学部門講演会講演論文集. No.00-19. 317-318 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] 多田直哉: "多数分布き裂型高温疲労損傷の直流電位差法による非破壊定量評価"日本材料学会第38回高温強度シンポジウム前刷集. 60-63 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] 大谷 隆一: "直流電位差法による多数分布き裂の個数,長さ,角度の推定"日本材料学会第48期学術講演会講演論文集. 201-202 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] 北村 隆行: "LSI配線のストレスマイグレーション破壊に及ぼす粒界/界面ネットワークの影響"日本機械学会論文集(A編). 65-640. 2497-2503 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] 多田 直哉: "電位差法によるキャビティあるいはき裂の連続モニタリングに基づく高温機器の余寿命予測"日本機械学会第12回計算力学講演会講演論文集. 99-5. 371-372 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] 多田 直哉: "多数球形欠陥まわりの直流電位場解析"日本機械学会論文集(A編). 65-632. 693-700 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] 大谷 隆一: "多数欠陥の分布と直流電位差の関係に関する検討" 日本機械学会第76期全国大会講演論文集(Vol.I). No.98-3. 361-362 (1998)

    • Related Report
      1998 Annual Research Report
  • [Publications] 北村 隆行: "体拡散クリープ下の粒界キャビティ成長の数値解析" 日本機械学会論文集(A編). 64・618. 373-378 (1998)

    • Related Report
      1998 Annual Research Report
  • [Publications] 北村 隆行: "第一原理分子動力学法によるアルミニウムΣ9傾角粒界の構造および特性解析" 日本機械学会論文集(A編). 64・626. 2463-2470 (1998)

    • Related Report
      1998 Annual Research Report
  • [Publications] 多田 直哉: "直流電位差法により評価したクリープ疲労損傷の実体" 日本材料学会第36回高温強度シンポジウム前刷集. 98-102 (1998)

    • Related Report
      1998 Annual Research Report

URL: 

Published: 1998-04-01   Modified: 2016-04-21  

Information User Guide FAQ News Terms of Use Attribution of KAKENHI

Powered by NII kakenhi