• Search Research Projects
  • Search Researchers
  • How to Use
  1. Back to previous page

Analysis of Mechanism of Very fine Agglutinative Bonding Between Fine Gold Lead and Electric Pad On Integrated Circuit.

Research Project

Project/Area Number 10450273
Research Category

Grant-in-Aid for Scientific Research (B).

Allocation TypeSingle-year Grants
Section一般
Research Field Material processing/treatments
Research InstitutionOsaka University

Principal Investigator

TAKAHASHI Yasuo  Osaka University, Associate Professor, 接合科学研究所, 助教授 (80144434)

Project Period (FY) 1998 – 2000
Project Status Completed (Fiscal Year 2000)
Budget Amount *help
¥11,000,000 (Direct Cost: ¥11,000,000)
Fiscal Year 2000: ¥1,700,000 (Direct Cost: ¥1,700,000)
Fiscal Year 1999: ¥5,200,000 (Direct Cost: ¥5,200,000)
Fiscal Year 1998: ¥4,100,000 (Direct Cost: ¥4,100,000)
KeywordsMicrojoining / Fine gold wire / Electric pad / Integrated circuit / Assembly Process / Bonding mechanism / Interfacial deformation / Numerical analysis / 電子実装 / インナーリードボンディング / 常温接合 / 空孔拡散 / 接合強度 / 残留応力
Research Abstract

It is indispensable technology to develop the new microjoining used for the packaging process of IC and LSI of the electronics field. This is the basic technology which achieves the interconnection between integrated circuit electrodes and external leads such as the leadframe, and it is not the exaggeration. However, the materials used there are dissimilar to each other, and the optimization of the interconnection is not easy. Then, in the present study, the bonding mechanism between integrated circuit electrodes and gold fine wires and leads is analyzed and has been clarified from experiments and theoretical calculation results. Especially, material properties (difference between the mechanical properties of the gold fine lead/gold pad), transition of the bonding mechanism by the bonding load increase, the promoting effect of the wire deformation with the pad temperature increase, and the effects of the bonding tool shape on the interconnection formation, etc.were clarified. And also, … More the analysis for adhesional bonding mechanism at room temperature which is expected to be very important in the near future were carried out in the present study, and the increase phenomenon of the bond strength with the time after bonding was investigated and the mechanism was clarified. The results that were concretely obtained in the present study are classified into the following 8 points.
1) The effect of material properties, bonding pressure, bonding temperature on the bonding process were analyzed.
2) The analysis of the interfacial diffusion behavior between pad and fine wires and the change in the stress distribution with time.
3) The transition of adhesional bonding mechanism with the bonding load increase.
4) The numerical simulation of deformation process of pad and gold fine wire.
5) The analysis of the effect of the bonding tool on the bonding process.
6) Effect on the bonded interface extension of the pad thickness and effectiveness of the gold bump for the microjoining.
7) Theory of adhesional bonding process between gold fine wire and pad, and also the quantification.
8) Numerical examination of the bonded interface migration phenomenon and the abnormal formation of the grain boundary groove. Less

Report

(4 results)
  • 2000 Annual Research Report   Final Research Report Summary
  • 1999 Annual Research Report
  • 1998 Annual Research Report
  • Research Products

    (16 results)

All Other

All Publications (16 results)

  • [Publications] 松坂壮太,高橋康夫,井上勝敬: "常温凝着接合における接合強度の時間依存性に関する研究"溶接学会論文集. 17. 583-588 (1999)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.TAKAHASHI,M.INOUE,K.INOUE: "Numerical Analysis of Fine Lead Bonding…・Effect of Pad Thickness on Interfacial Deformation"IEEE Trans.on CPT. 22. 291-228 (1999)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.TAKAHASHI,M.InouE,K.INOUE: "Numerical Analysis of Fine Lead Bonding…・Effect of Pad Mechanical Properties on Interfacial Deformation"IEEE Trans.on CPT. 22. 558-566 (1999)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 松坂壮太,高橋康夫,井上勝敬: "常温凝着接合界面における応力緩和過程に対する表面粗さの影響"Proceeding of 6th Sympo.Mate 2000. 6. 191-196 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 高橋康夫,上杉勝洋,松坂壮太: "アルゴンイオン衝撃により表面活性化された金ワイヤと金箔との凝着接合に関する検討"Proceeding of 7th Sympo.Mate 2001. 7. 9-12 (2001)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] S.Matsusaka, Y.Takahashi, and K.Inoue: "Study on Time Dependence of Bond Strength in Room Temperature Bonding"Quarterly J.of JWS.. Vol.17, No.4. 583-588 (1999)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Takahashi, M.Inoue, K.Inoue: "Numerical Analysis of Fine Lead Bonding -Effect of Pad Thickness on Interfacial Deformation-"IEEE Trans.on CPT. Vol.22, No.2. 291-298 (1999)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Takahashi, M.Inoue, K.Inoue: "Numerical Analysis of Fine Lead Bonding -Effect of Pad Mechanical Properties on Interfacial Deformation-"IEEE Trans.on CPT. Vol.22, No.4. 558-566 (1999)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] S.Matsusaka, Y.Takahashi, K.Inoue: "Effect of Surface Roughness on Stress Relaxation Process during Room Temperature Bonding"Proc.6th Sympo.... Mate2000, Yokonama, pp.191-196 Feb.3-4. (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Takahashi, K.Uesugi, S.Matsusaka: "Study on Adhesional Bonding Between Gold Wire and Gold Foil Surface-activated by Ar Ion Irradiation"Proc.7the Sympo.Mate2001, Yokonama, pp.9-12 Feb.1-2. (2001)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 高橋康夫,上杉勝洋,松坂状太: "アルゴンイオン衝撃により表面活性化された金ワイヤと金箔との凝着接合に関する検討"Proceeding of 7th Sympo.Mate 2001. 7. 9-12 (2001)

    • Related Report
      2000 Annual Research Report
  • [Publications] Y.Takahashi, M.Inoue, K.Inoue: "Numerical Analysis of Fine Lead Bonding.・・・Effect of Pad Thickness on Interfacial Deformation"IEEE Transaction CPT. 22. 291-298 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] Y.Takahashi, M.Inoue, K.Inoue: "Numerical Analysis of Fine Lead Bonding.・・・Effect of Pad Mechanical Properties on Interfacial Deformation"IEEE Transaction CPT. 22. 558-566 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] Yasuo Takahashi: "Numerical Study of Fine Lead and Wire Bonding in Electronic Packaging"Apack'99, Proceeding, Singapore 8th-10th 12月. 454-461 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] Y.TAKAHASHI,Souta Matsusaka,and K.INOUE: "Time Dependence of Room Temperature Bonding Strength" Proceeding of ECOMAP-98,. 533-536 (1998)

    • Related Report
      1998 Annual Research Report
  • [Publications] 松阪壮太 高橋康夫 井上勝敬: "金細線の常温凝着接合に関する研究" 第5回 Symposium on “Microjoining and Assembly Technology in Electsonics"(Mate'9). Vol.5. P11-14 (1999)

    • Related Report
      1998 Annual Research Report

URL: 

Published: 1998-04-01   Modified: 2016-04-21  

Information User Guide FAQ News Terms of Use Attribution of KAKENHI

Powered by NII kakenhi