| Project/Area Number |
10555246
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 展開研究 |
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| Research Field |
Material processing/treatments
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| Research Institution | Kanazawa University |
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Principal Investigator |
UEDA Takashi Kanazawa University, Engineering, Professor, 工学部, 教授 (60115996)
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| Co-Investigator(Kenkyū-buntansha) |
MAHFUZ Al Fuda Kanazawa University, Engineering, Assistant, 工学部, 助手 (90313692)
YAMADA Keiji Kanazawa University, Engineering, Assistant, 工学部, 助手 (50242532)
HOSOKAWA Akira Kanazawa University, Engineering, Assistant Professor, 工学部, 助教授 (40199493)
MATSUMORI Noboru Mizuho Co. Ltd., Laboratory, Manager, 研究所, 所長
SATO Masahiko Toyama Prefectural College, Engineering, Assistant, 工学部, 助手 (50244512)
松森 〓 (株)ミズホ研究所, 所長
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| Project Period (FY) |
1998 – 1999
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| Project Status |
Completed (Fiscal Year 1999)
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| Budget Amount *help |
¥12,800,000 (Direct Cost: ¥12,800,000)
Fiscal Year 1999: ¥1,500,000 (Direct Cost: ¥1,500,000)
Fiscal Year 1998: ¥11,300,000 (Direct Cost: ¥11,300,000)
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| Keywords | LASER PROCESSING / PRECISION MACHINING / TWO-COLOR PYROMETER / FIBER COUPLER / INFRARED RADIATION PYROMETER / BREAKING / LASER FORMING / レーザ加工 |
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| Research Abstract |
The objective of the present study is to establish a laser machining system for micro machining in a high precision. The temperature of workpiece irradiated with laser is measured accurately using a new type of infrared radiation pyrometer with an optical fiber. The main results obtained in this study are summarized as follows :
1. A basic technique for measuring temperature of workpiece irradiated with laser is established.
2. A technique for controlling crack progress direction in breaking of silicon wafer is established. And by measuring AE signal, we can monitor the crack progress on the wafer.
3. The relationship between the temperature of workpiece irradiated with the deformation angle in forming of stainless plate is determined. Consequently, we can control the deformation by monitoring the temperature.
4. Breaking of micro-diamond grindstone and liquid-crystal glass, and forming of lead frame of semiconductor cell, are become the subjects for future study.
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