| Project/Area Number |
10650111
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
機械工作・生産工学
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| Research Institution | Yamanashi University |
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Principal Investigator |
YOSHIDA Yoshikazu Yamanashi Univ. Engineering, Associate Professor, 工学部, 助教授 (50273032)
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| Co-Investigator(Kenkyū-buntansha) |
HIRA Shinichiro Yamanashi Univ. Engineering, Assistant Professor, 工学部, 助手 (70228758)
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| Project Period (FY) |
1998 – 1999
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| Project Status |
Completed (Fiscal Year 1999)
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| Budget Amount *help |
¥3,900,000 (Direct Cost: ¥3,900,000)
Fiscal Year 1999: ¥1,100,000 (Direct Cost: ¥1,100,000)
Fiscal Year 1998: ¥2,800,000 (Direct Cost: ¥2,800,000)
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| Keywords | STM / AFM / Nano-technology / Plasma etching |
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| Research Abstract |
A high-throughput lithographic method for CD pits with several tens nanometers and a high aspect ratio is proposed and demonstrated. We have demonstrated that nanometer-scale structuring can be formed on a polymer resist using the tip of a scanning probe microscope (SPM). In case a hole with 20 nm in diameter and 10 nm deep is formed by the indentation of the tip of a scanning tunneling microscope (STM). In case a ditch with 70 nm in width and 50 nm deep is formed by the indentation and the line scan of the tip of an atomic force microscope (AFM). Thereafter, oxygen reactive ion etching (RIE) is used to remove the remaining resist in the indented areas. After the RIE, the aspect ration is more than one. Moreover, the etching structure is copied into metal (micromolding) using non-electrolytic nickel plating. Mold release agents are added into the resists and worked well to reduce the resist adhesion to the mold. The diameter and the width of the metal molds are about one and a half times those of the etching structures. It seems that the resist is eroded by the plating solution.
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