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Bonding Ceramics to Metal by Discharged Plasma Heating

Research Project

Project/Area Number 10650723
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field Material processing/treatments
Research InstitutionThe Faculty of Engineering, Kinki University

Principal Investigator

FUKAYA Yasuhiro  Faculty of Engineering, Kinki University, Professor, 工学部, 教授 (40268454)

Co-Investigator(Kenkyū-buntansha) SINOZAKI Kenzi  Hiroshima University, Faculty of Engineering, Assistant Professor, 工学部, 助教授 (70154218)
KUROKI Hidenori  Hiroshima University, Faculty of Engineering, Professor, 工学部, 教授 (80037853)
OKUMOTO Yasuhisa  Kinki University, Faculty of Engineering, Professor, 工学部, 教授 (50247962)
Project Period (FY) 1998 – 1999
Project Status Completed (Fiscal Year 1999)
Budget Amount *help
¥2,100,000 (Direct Cost: ¥2,100,000)
Fiscal Year 1999: ¥800,000 (Direct Cost: ¥800,000)
Fiscal Year 1998: ¥1,300,000 (Direct Cost: ¥1,300,000)
KeywordsCeramic / AlィイD22ィエD2 OィイD23ィエD2 / SiィイD23ィエD2 NィイD24ィエD2 / Bonding / Crack / Residual stress / Discharged plasma / Diffusion bonding / 焼結接合
Research Abstract

Crack propagates in ceramic when extensive residual stress generates in ceramic at joint of ceramic to metal. Low temperature and soft metal(Ag,Cu) inserted bonding are effective for reduction of residual stress. Discharged plasma heating is applied for low temperature bonding and Ag,Cu are used for soft metal inserted bonding. Boding test AlィイD22ィエD2 O ィイD23ィエD2 SiィイD23ィエD2 N ィイD24ィエD2 to γ-stainless steel by this proposed bonding was done. Main results obtained are as follows :
(1) Crack propagates usually in ceramic at conventional bonding(Ag-Cu-Ti direct brazing).
This crack was prevented perfectly by proposed bonding.
(2) Residual stress in ceramic was analyzed by Thermo- elasto-plastic analysis by FEM. It was confirmed that residual stress in ceramic at conventional bonding was equivalent to strength of base ceramic and reduced to 23-50% by proposed bonding. It is assumed that prevention of crack is due to this reduction of residual stress in ceramic.
(3) Joint strength of proposed bonding was investigated by 4-point bending test.
Excellent strength was obtained.

Report

(3 results)
  • 1999 Annual Research Report   Final Research Report Summary
  • 1998 Annual Research Report
  • Research Products

    (12 results)

All Other

All Publications (12 results)

  • [Publications] 深谷保博ほか: "Ag薄膜ろう付+放電プラズマ加熱接合法によるAl_2O_3/SUS304の残留応力緩和接合"溶接学会全国大会講演概要. 第63集. 360-361 (1998)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] 深谷保博ほか: "Cu薄膜ろう付+Cu粉挿入放電プラズマ加熱接合法によるAl_2O_3/SUS304の残留応力緩和接合"溶接学会全国大会講演概要. 第63集. 362-363 (1998)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] 深谷保博ほか: "Ag,Cu薄膜ろう付とパルス通電加熱接合を併用したSi_3N_4とSUS304の接合"溶接学会全国大会講演概要. 第65集. 584-585 (1999)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] 深谷保博ほか: "セラミックス/金属接合体における残留応力とセラミックスの割れ"日本機械学会第7回機械材料・材料加工技術講演会講演論文集. No99-23. 283-284 (1999)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] Y. Fukaya, etal.: "Stress Relief of AlィイD22ィエD2 O ィイD23ィエD2 /SUS304 Bonded Joint by Discharged Plasma Heated Bonding after Ag Brazing."Preprints of the national meeting of J. W. S.. 63. 360-361 (1998)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] Y. Fukaya, etal: "Stress Relief of AlィイD22ィエD2 O ィイD23ィエD2 /SUS304 Bonded Joint by Discharged Plasma Heated Bonding with Cu Powder after Cu Brazing"Preprints of the national meeting of J. W. S.. 63. 362-363 (1998)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] Y. Fukaya, etal: "Bonding SiィイD23ィエD2 N ィイD24ィエD2 to SUS304 by Diffusion bonding with Pulse Current Heating after Brazing Ag, Cu Thin Film to SiィイD23ィエD2 N ィイD24ィエD2 , SUS304"Preprints of the national meeting of J. W. S... 65. 584-585 (1999)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] Y. Fukaya, etal: "Relationship between Crack in Ceramics and Residual Stress at Ceramics/Metal Bonded Joint"The 7th Materials and Processing Conference(M&P'99). 99-23. 283-284 (1999)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1999 Final Research Report Summary
  • [Publications] 深谷保博ほか: "Ag,Cu薄膜ろう付とパルス通電加熱接合を併用したSi_3N_4とSUS304の接合"溶接学会全国大会講演概要. 第65集. 584-585 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] 深谷保博ほか: "セラミックス/金属接合体における残留応力とセラミックスの割れ"日本機械学会第7回機械材料・材料加工技術講演会講演論文集. No99-23. 283-284 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] 深谷保博ほか: "Ag薄膜ろう付+放電プラズマ加熱接合法によるAl_2O_3/SUS304の残留応力緩和接合" 溶接学会全国大会講演概要. 第63集. 360-361 (1998)

    • Related Report
      1998 Annual Research Report
  • [Publications] 深谷保博ほか: "Cu薄膜ろう付+Cu粉挿入放電プラズマ加熱接合法によるAl_2O_3/SUS304の残留応力緩和接合" 溶接学会全国大会講演概要. 第63集. 362-363 (1998)

    • Related Report
      1998 Annual Research Report

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Published: 1998-04-01   Modified: 2016-04-21  

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