| Project/Area Number |
10671834
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
補綴理工系歯学
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| Research Institution | Nagasaki University |
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Principal Investigator |
MATSUMURA Hideo NAGASAKI UNIVERSITY, SCHOOL OF DENTISTRY, DEPARTMENT OF FIXED PROSTHODONTICS, ASSOCIATE, PROFESSOR, 歯学部, 助教授 (40199857)
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| Co-Investigator(Kenkyū-buntansha) |
ATSUTA Mitsuru NAGASAKI UNIVERSITY, SCHOOL OF DENTISTRY, DEPARTMENT OF FIXED PROSTHODONTICS, PROFESSOR, 歯学部, 教授 (60002135)
TANOUE Naomi NAGASAKI UNIVERSITY, HOSPITAL OF DENTISTRY, FIXED PROSTHODONTICS DIVISION, INSTRUCTOR, 歯学部・附属病院, 助手 (70231660)
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| Project Period (FY) |
1998 – 2000
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| Project Status |
Completed (Fiscal Year 2000)
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| Budget Amount *help |
¥3,300,000 (Direct Cost: ¥3,300,000)
Fiscal Year 2000: ¥500,000 (Direct Cost: ¥500,000)
Fiscal Year 1999: ¥500,000 (Direct Cost: ¥500,000)
Fiscal Year 1998: ¥2,300,000 (Direct Cost: ¥2,300,000)
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| Keywords | noble metal alloy / bonding / primer |
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| Research Abstract |
The influence of alloy composition, priming, and thermocycling on bond strength to silver-palladium-copper-gold alloy was evaluated in vitro by means of shear testing. Disk specimens with two different diameters were cast from three commercially available (S12, S20, and Castwell M.C.12) and four experimental silver-palladium-copper-gold alloys (K1, K2, K3, and K4), each of the latter containing copper more than 20%. Specimens were either unprimed or primed with a metal conditioner (V-Primer), bonded with an adhesive resin (Super-Bond Opaque), then shear testing was performed. The results showed that the low-copper S12 and S20 alloys showed lower post-thermocycling bond strength than the Castwell alloy regardless application of the conditioning agent. Post-thermocycling bond strengths of the primed K1, K2, K3 and K4 alloys were the same magnitude as that of the Castwell alloy. For all groups except for one (S12, without thermocycling), bond strength was elevated by use of the metal surface conditioner. Application of thermal stress drastically reduced bond strength of unprimed groups, whereas bond strength of the two primed groups (K1 and K2) was unaffected by thermocycling. It is desirable to use a 20%-copper silver-palladium-copper-gold alloy for achieving durable bonding with the combination of the V-Primer conditioner and the Super-Bond adhesive.
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