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Development of a Microwave Focusing Sensor and a High Resolution Imaging System for Nondestructive Evaluation of Materials

Research Project

Project/Area Number 11555025
Research Category

Grant-in-Aid for Scientific Research (B).

Allocation TypeSingle-year Grants
Section展開研究
Research Field Materials/Mechanics of materials
Research InstitutionTohoku University

Principal Investigator

SAKA Masumi  Tohoku University, Graduate School of Engineering, Professor, 大学院・工学研究科, 教授 (20158918)

Co-Investigator(Kenkyū-buntansha) SASAGAWA Kazuhiko  Hirosaki University, Department of Intelligent Machine and System Engineering, Associate Professor, 理工学部, 助教授 (50250676)
SOYAMA Hitoshi  Tohoku University, Graduate School of Engineering, Associate Professor, 大学院・工学研究科, 助教授 (90211995)
KAMIYA Shoji  Tohoku University, Graduate School of Engineering, Associate Professor, 大学院・工学研究科, 助教授 (00204628)
TAKEUCHI Masahiro  Sumitomo Bakelite Techno-research Co., Ltd., Senior Engineer, 研究部, 副技師長(研究職)
YANG Ju  Tohoku University, Graduate School of Engineering, Research Associate, 大学院・工学研究科, 助手 (60312609)
Project Period (FY) 1999 – 2000
Project Status Completed (Fiscal Year 2000)
Budget Amount *help
¥13,100,000 (Direct Cost: ¥13,100,000)
Fiscal Year 2000: ¥4,500,000 (Direct Cost: ¥4,500,000)
Fiscal Year 1999: ¥8,600,000 (Direct Cost: ¥8,600,000)
KeywordsNondestructive Evaluation / Microwave / Focusing Sensor / Imaging / Spatial Resolution / Delamination / IC Package / Materials
Research Abstract

1.Clarification of the principles of microwave focusing and reflecting by using electromagnetic wave theory A focusing sensor was developed. The microwave reflection occurring at the interface of the materials, in a small area, was analyzed. The characteristic of the microwave response relative to the size and the shape of defects, and their electromagnetic properties was clarified.
2.Evaluation of delaminations with a high spatial resolution The delaminations between the lead frame and the encapsulant resin in IC packages were evaluated. The variations of the amplitude and the phase of the reflection coefficient, for the samples with and without delaminations, were observed. The parameters used for evaluation of the delamination in a high spatial resolution were obtained.
3.Development of the microwave imagine system The microwave sensor was used to scan the detected object in two perpendicular directions in a plane parallel to the object. A high speed imaging system was developed, wher … More e information of the defects was recorded corresponding to the measurement position.
4.Improvement of the focusing sensor For increasing the spatial resolution, the shape and the set position of the focusing sensor were optimized. The spatial resolution was further increased while a larger standoff distance between the sensor and the detected object was remained.
5.Microwave applications in evaluation of the thickness of films and coating materials and the state of the interface between the coating materials and their substrates A new method for evaluation of the conductive film, which has widely been used in the manufacture of liquid crystal and solar cell etc., was investigated. Moreover, the capability of microwave to detect a small crack in the silicon film, which is used to make solar cells, was also confirmed.
6.Development of the compact imagine system Based on the developed imaging system, the compact imaging system was designed fundamentally, which is expected to be used for large machines and structures in the industrial environment. A new scanning sensor was suggested for realizing the small size, low cost and popular imaging system. Less

Report

(3 results)
  • 2000 Annual Research Report   Final Research Report Summary
  • 1999 Annual Research Report
  • Research Products

    (66 results)

All Other

All Publications (66 results)

  • [Publications] Y.Ju(M.Saka and H.Abe): "A Method of the Measurement of Moisture in IC Packages Using Microwaves"Proc.the 1st International Workshop on Electronics Materials and Packaging. 182-187 (1999)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 坂真澄(巨陽): "マイクロ波による材料評価"日本機械学会論文集(A編). 65. 2193-2198 (1999)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 巨陽(金子祐二,坂真澄,阿部博之): "マイクロ波イメージングによる誘電体材料内部の欠陥の非破壊評価"非破壊検査. 49. 121-126 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 巨陽(三瓶聖,坂真澄,阿部博之): "マイクロ波による電子パッケージ封止樹脂の吸湿評価"日本機械学会東北支部第35期総会・講演会講演論文集. 124-125 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 坂真澄: "マイクロ波による材料評価-特徴と二,三の応用例-"日本機械学会材料力学部門分科会・研究会合同シンポジウム講演論文集. 11-14 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju (M.Saka and H.Abe): "NDI of Delamination in IC Packages Using Millimeter-Wave"Proc.17th IEEE Instrumentation and Measurement Technology Conference. 3. 1597-1602 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 坂真澄(巨陽,阿部博之): "材料評価へのマイクロ波の応用"日本非破壊検査協会第7回新素材及びその製品の非破壊評価シンポジウム論文集. 111-116 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 巨陽(坂真澄,阿部博之): "ミリ波による電子パッケージ内の非破壊評価"日本機械学会2000年度年次大会講演論文集. 3. 247-248 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju (M.Saka and H.Abe): "Millimeter-Wave Imaging for Integrity Assessment of IC Packages"Proc.International Workshop on Sensing and Evaluation of Materials System. 76-81 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju (M.Saka and H.Abe): "Nondestructive Evaluation of Delamination in IC Packages by Millimeter-Waves"25th International Conference on Infrared and Millimeter Waves Conference Digest, IEEE. 421-422 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] M.Saka (Y.Ju,D.Luo and H.Abe): "A Method for Nondestructive Evaluation of Crack Depth on Metal Surface by Microwaves"25th International Conference on Infrared and Millimeter Waves Conference Digest, IEEE. 423-424 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 巨陽(坂真澄,阿部博之): "マイクロ波による電子パッケージの吸湿の定量評価"日本機械学会平成12年度材料力学部門講演会講演論文集. 333-334 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju (S.Sanpei,M.Saka and H.Abe): "NDE of Moisture in Encapsulant Resin of IC Packages by Microwaves"15th World Conference on Nondestructive Testing (CD-ROM). 1-4 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 巨陽(坂真澄,羅大贏,阿部博之): "マイクロ波による金属材料表面上の閉じた疲労き裂の非破壊評価"日本非破壊検査協会平成12年度秋季大会講演概要集. 1-4 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 坂真澄: "き裂の高感度非破壊評価とマイクロ波材料評価"九州地方非破壊検査研究会平成12年度研究発表会資料集. 16-36 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju (M.Saka and H.Abe): "Detection of Delamination in IC Packages Using the Phase of Microwaves"NDT & E International. 34. 49-56 (2001)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju (M.Saka and H.Abe): "Nondestructive Inspection of Delamination in IC Packages by High-Frequency Microwaves"NDT & E International. 34. 207-211 (2001)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 巨陽(坂真澄): "マイクロ波非破壊検査におけるセンサ"検査技術. 6. 4-8 (2001)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju (M.Saka and H.Abe): "Microwave Imaging for the Integrity Assessment of IC Packages"Trans.ASME, J.Electronic Packaging. 123. 42-46 (2001)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju (S.Sanpei,M.Saka and H.Abe): "Microwave Measurement of Moisture in Encapsulant Resin of IC Packages"Nondestructive Characterization of Materials X. (印刷中). (2001)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 巨陽(猿田賢治,坂真澄,阿部博之): "マイクロ波非破壊検査における集束センサの開発"非破壊検査. 50(印刷中). (2001)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju(M.Saka and H.Abe): "A Method of the Measurement of Moisture in IC Package Using Microwaves"Proc.the 1st Int.Workshop on Electronics Materials and Packaging. 182-187 (1999)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] M.Saka(Y.Ju): "Materials Evaluation by Using Microwave"Trans.JSME(A). Vol.65, No.639. 2193-2198 (1999)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju(Y.Kaneko, M.Saka and H.Abe): "Nondestructive Evaluation of Dielectric Materials by Microwave Imaging"J.JSNDI. Vol.49, No.2. 121-126 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju(S.Sanpei, M.Saka and H.Abe): "Moisture Evaluation of Encapsulant Resin of IC Packages by Microwaves"Proc.35th JSME Tohoku Branch Meeting. No.001-1. 124-125 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] M.Saka: "Materials Evaluation by Using Microwave -Feasibility and Some Examples of Its Application-"Proc.2000 JSME/MMD Meeting. No.001-3. 11-14 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju(M.Saka and H.Abe): "NDI of Delamination in IC Packages Using Millimeter-Wave"Proc.17th IEEE Instrumentation and Measurement Technology Conf.. Vol.3. 1597-1602 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] M.Saka(Y.Ju and H.Abe): "Application of Microwave to Materials Evaluation"Proc.the 7th Symp.on Nondestructive Evaluation for New Materials. 111-116 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju(M.Saka and H.Abe): "Nondestructive Evaluation of IC Package by Millimeter-Wave"Proc.2000 JSME Fall Annu.Meeting. Vol.3, No.00-1. 247-248 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju(M.Saka and H.Abe): "Millimeter-Wave Imaging for Integrity Assessment of IC Packages"Proc.Int.Workshop on Sensing and Evaluation of Materials System. 76-81 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju(M.Saka and H.Abe): "Nondestructive Evaluation of Delamination in IC Packages by Millimeter-Waves"25th Int. Conf.on Ingrared and Millimeter Waves Conf.Digest, IEEE. 421-422 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] M.Saka(Y.Ju, D.Luo and H.Abe): "A Method for Nondestructive Evaluation of Crack Depth on Metal Surface by Microwaves"25th Int.Conf.on Infrared and Millimeter Waves Conf. Digest, IEEE. 423-424 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju(M.Saka and H.Abe): "Moisture Evaluation of IC Packages by Microwaves"Proc.2000 Annu.Meeting of JSME/MMD. No.00-19. 333-334 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju(S.Sanpei, M.Saka and H.Abe): "NDE of Moisture in Encapsulant Resin of IC Packages by Microwaves"15th World Conf.on Nondestructive Testing. (CD-ROM), paper 274. 1-4 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju(M.Saka, D.Luo and H.Abe): "Microwave Nondestructive Evaluation of Closed Fatigue Crack on the Metal Surface"Proc.JSNDI Fall Conf.2000. 1-4 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] M.Saka: "Highly Sensitive NDE of Cracks and Microwave Materials Evaluation"Proc.2000 Kyushu Local NDI Meeting. 16-36 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju(M.Saka and H.Abe): "Detection of Delamination in IC Packages Using the Phase of Microwaves"NDT & E Int.. Vol.34, No.1. 49-56 (2001)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju(M.Saka and H.Abe): "Nondestructive Inspection of Delamination in Packages by High-Frequency Microwaves"NDT & E Int.. Vol.34, No.3. 207-211 (2001)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju(M.Saka): "Microwave Sensor for Nondestructive Inspection"Inspection Engineering. Vol.6, No.1. 4-8 (2001)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju(M.Saka and H.Abe): "Microwave Imaging for the Integrity Assessment of IC Packages"Trans, ASME, J.Electronic Packaging. Vol.123, No.3. 42-46 (2001)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju(S.Sanpei, M.Saka and H.Abe): "Microwave Measurement of Moisture in Encapsulant Resion of IC Packages"Nondestructive Characterization of Materials X, Elsevier Science. (in press). (2001)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] Y.Ju(K.Saruta, M.Saka and H.Abe): "Development of Focusing Sensor for Nondestructive Inspection by Microwaves"J.JSNDI. Vol.50, No.6(in press). (2001)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 巨陽(三瓶聖,坂真澄,阿部博之): "マイクロ波による電子パッケージ封止樹脂の吸湿評価"日本機械学会東北支部第35期総会・講演会講演論文集. No.001-1. 124-125 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] 坂真澄: "マイクロ波による材料評価-特徴と二,三の応用例-"日本機械学会材料力学部門分科会・研究会合同シンポジウム講演論文集. No.001-3. 11-14 (200)

    • Related Report
      2000 Annual Research Report
  • [Publications] Y.Ju (M.Saka and H.Abe): "NDI of Delamination in IC Packages Using Millimeter-Wave"Proc.17th IEEE Instrumentation and Measurement Technology Conference. Vol.3. 1597-1602 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] 猿田賢治(巨陽,坂真澄,阿部博之): "マイクロ波非破壊検査における集束センサの開発"日本非破壊検査協会平成12年度春季大会講演概要集. 127-130 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] 坂真澄(巨陽,阿部博之): "材料評価へのマイクロ波の応用"日本非破壊検査協会第7回新素材及びその製品の非破壊評価シンポジウム論文集. 111-116 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] Y.Ju (S.Sanpei,M.Saka and H.Abe): "Microwave Measurement of Moisture in Encapsulant Resin of IC Packages"Proc.the 10th International Symposium on Nondestructive Characterization of Materials. 451-452 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] 巨陽(坂真澄,阿部博之): "ミリ波による電子パッケージ内の非破壊評価"日本機械学会2000年度年次大会講演論文集. 3・00-1. 247-248 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] Y.Ju (M.Saka and H.Abe): "Millimeter-Wave Imaging for Integrity Assessment of IC Packages"Proc.International Workshop on Sensing and Evaluation of Materials System. 76-81 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] Y.Ju (M.Saka and H.Abe): "Nondestructive Evaluation of Delamination in IC Packages by Millimeter-Waves"25th International Conference on Infrared and Millimeter Waves Conference Digest, IEEE. 421-422 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] M.Saka (Y.Ju,D.Luo and H.Abe): "A Method for Nondestructive Evaluation of Crack Depth on Metal Surface by Microwaves"25th International Conference on Infrared and Millimeter Waves Conference Digest, IEEE. 423-424 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] 巨陽(坂真澄,阿部博之): "マイクロ波による電子パッケージの吸湿の定量評価"日本機械学会平成12年度材料力学部門講演会講演論文集. No.00-19. 333-334 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] Y.Ju (S.Sanpei,M.Saka and H.Abe): "NDE of Moisture in Encapsulant Resin of IC Packages by Microwaves"15th World Conference on Nondestructive Testing. (CD-ROM). 1-4 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] 巨陽(坂真澄,羅大贏,阿部博之): "マイクロ波による金属材料表面上の閉じた疲労き裂の非破壊評価"日本非破壊検査協会平成12年度秋季大会講演概要集. 1-4 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] Y.Ju (M.Saka and H.Abe): "Detection of Delamination in IC Packages Using the Phase of Microwaves"NDT & E International. 34・1. 49-56 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] 巨陽(坂真澄): "マイクロ波非破壊検査におけるセンサ"検査技術. 6・1. 4-8 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] 坂真澄: "き裂の高感度非破壊評価とマイクロ波材料評価"九州地方非破壊検査研究会平成12年度研究発表会資料集. 16-36 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] Y.Ju (M.Saka and H.Abe): "Nondestructive Inspection of Delamination in IC Packages by High-Frequency Microwaves"NDT & E International. 34・3. 207-211 (2001)

    • Related Report
      2000 Annual Research Report
  • [Publications] Y.Ju (M.Saka and H.Abe): "Microwave Imaging for the Integrity Assessment of IC Packages"Trans.ASME,J.Electronic Packaging. 123・3(掲載予定). (2001)

    • Related Report
      2000 Annual Research Report
  • [Publications] Y.Ju (M.Saka and H.Abe): "Microwave Imaging for the Integrity Assessment of IC Package"Proc. Advances in Electronic Packaging 1999, ASME. EEP-Vol.26-1. 847-853 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] M.Saka (Y.Ju and H.Abe): "Microwave Nondestructive Testing by Open-Ended Coaxial Line Sensor"Proc. The Second Japan-US Symp.on Advances in NDT. 30-33 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] Y.Ju (M.Saka and H.Abe): "A Method of the Measurement of Moisture in IC Packages Using Microwaves"Proc. The 1st International Workshop on Electronics Materials and Packaging. 182-187 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] Y.Ju (M.Saka and H.Abe): "Nondestructive Inspection of Delamination in IC Packages by Microwaves"Proc. The 5th Far-East Conference on Nondestructive Testing. 117-122 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] 坂真澄(巨陽): "マイクロ波による材料評価"日本機械学会論文集(A編). 65・639. 2193-2198 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] 巨陽(金子祐二,坂真澄,阿部博之): "マイクロ波イメージングによる誘電体材料部分の欠陥の非破壊評価"非破壊検査. 49・2. 121-126 (2000)

    • Related Report
      1999 Annual Research Report

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Published: 1999-04-01   Modified: 2016-04-21  

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