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Development of high speed processing silicon slicer using diamond wire tool

Research Project

Project/Area Number 11555046
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypeSingle-year Grants
Section展開研究
Research Field 機械工作・生産工学
Research InstitutionKanazawa Institute of Technology

Principal Investigator

ISHIKAWA Ken-ichi  Kanazawa Institute of Technology, Faculty of Engineering, Professor, 工学部, 教授 (00064452)

Co-Investigator(Kenkyū-buntansha) KAJIKURA Atsushi  Fujikoshi Machinary Co., researcher
NISHIMOTO Yoshinobu  Fujikoshi Machinary Co., Head Officer of research, 営業技術本部・研究開発部, 部長
SUWABE Hitoshi  Kanazawa Institute of Technology, Faculty of Engineering, Associate Professor, 工学部, 助教授 (40202139)
鍛治倉 惇  不二越機械工業(株)・研究開発部・研究係
畝田 道雄  金沢工業大学, 工学部, 助手 (00298324)
Project Period (FY) 1999 – 2001
Project Status Completed (Fiscal Year 2001)
Budget Amount *help
¥8,200,000 (Direct Cost: ¥8,200,000)
Fiscal Year 2001: ¥1,700,000 (Direct Cost: ¥1,700,000)
Fiscal Year 2000: ¥1,700,000 (Direct Cost: ¥1,700,000)
Fiscal Year 1999: ¥4,800,000 (Direct Cost: ¥4,800,000)
KeywordsGrinding / Slicing / Cutting / Wire tool / Semiconductor material / Hard and brittle material / マルチワイヤソー / ダイヤモンド砥粒
Research Abstract

The diamond wire saw is one of slicing methods to semiconductor materials and hard and brittle materials. And, this slicing system is begun to paid attention for near future slicer to change the multi-wire saw using slurry. The investigators designed to develop the new slicing systems and wire making system of the diamond wire saw. The slicing characteristics and the processing mechanisms were studied by using the normal size diamond wire tool and the newly developed thin wire tool with a small diameter. As the results of development of wire tool and slicer system, the followings are clear;
◎ Development of wire tool
1. The investigators made success of the thin diamond wire tool of the diameter of 180 μm by using the diamond grains of 30-40 μm and the twisting core wire (two piano wires of the diameter of 58 μm).
2. This thin diamond wire tool showed 1.3 times as much as the processing efficiency compared with the ordinary size diamond wire tool.
3. As the results of material strength and twist test, the processing wire tension of this thin diamond wire tool had to set on the value of 7,84 N or less.
◎ Development of slicing system
1. The processing efficiency by means of rotating the workpiece in the slicing was twice as much as the normal slicing (in case of no-rotating workpiece). And, the slicing by rotating the workpiece decreased the surface roughness.
2. The saw mark could decrease by setting up asynchronously the reverse time of wire running and workpiece rotating.
3. The investigators developed the new slicer for thin wire tool, and the thin wire tool became to be able to run at 200m/min as the wire running speed.

Report

(4 results)
  • 2001 Annual Research Report   Final Research Report Summary
  • 2000 Annual Research Report
  • 1999 Annual Research Report
  • Research Products

    (17 results)

All Other

All Publications (17 results)

  • [Publications] 石川憲一: "フッ素樹脂を用いたスパイラル状ダイヤモンド電着ワイヤ工具の開発"砥粒加工学会誌. 43-10. 431-436 (1999)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2001 Final Research Report Summary
  • [Publications] 石川憲一: "A Basic Study on Processin Characteristics of Diamond Multi-Wire Saw by means the orkpiec e Rotation Type"Advances in Abrasive Technology III. 229-232 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2001 Final Research Report Summary
  • [Publications] 石川憲一: "ダイヤモンド電着ワイヤ工具による工作物回転型マルチワイヤソーの試作"2000年度精密工学会春季大会学術講演会. 240 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2001 Final Research Report Summary
  • [Publications] 石川憲一: "高能率・高精度マルチスライサーの開発"日本設計工学会北陸支部平成12年度研究発表会. 31-36 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2001 Final Research Report Summary
  • [Publications] 石川憲一: "細線ダイヤモンドワイヤ工具の開発"2000年度砥粒加工学会学術講演会. 285-286 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2001 Final Research Report Summary
  • [Publications] 石川憲一: "樹脂コーティングダイヤモンドワイヤ工具の試作"2001年度砥粒加工学会学術講演会. 289-290 (2001)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2001 Final Research Report Summary
  • [Publications] 石川憲一: "工作物回転型ダイヤモンドワイヤソーにおける加工面評価"2002年度精密工学会春季大会学術講演会. 18 (2002)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2001 Final Research Report Summary
  • [Publications] Ishikawa,Ken-ichi: "Development of spiral wire tool electrodeposited diamond grains used teflon-coating"Journal of JSGE. 43-10. 431-436 (1999)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2001 Final Research Report Summary
  • [Publications] Ishikawa,Ken-ichi: "A Basic Study on processing characteristics of diamond multi-wire saw by means of the workpiece rotation type"Advances in Abrasive Technology III. 229-232 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2001 Final Research Report Summary
  • [Publications] Ishikawa,Ken-ichi: "Deyelopment of multi-wire saw of work rotation type using diamond wire tool"Proc. of JSPE. 240 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2001 Final Research Report Summary
  • [Publications] Ishikawa,Ken-ichi: "Development of high efficiency multi-slicer"Proc. of JSDE. 31-36 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2001 Final Research Report Summary
  • [Publications] Ishikawa,Ken-ichi: "Development of thin diamond wire tool"Proc. of JSGE. 285-286 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2001 Final Research Report Summary
  • [Publications] Ishikawa,Ken-ichi: "Development of diamond wire tool by plastic coating"Proc. of JSGE. 289-290 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2001 Final Research Report Summary
  • [Publications] Ishikawa,Ken-ichi: "Evaluations of slicing surface by the Workpiece Rotation Type"Proc. of JSPE. 18 (2002)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2001 Final Research Report Summary
  • [Publications] 石川憲一: "樹脂コーティングダイヤモンドワイヤ工具の試作"2001年度砥粒加工学会学術講演会論文集. 289-290 (2001)

    • Related Report
      2001 Annual Research Report
  • [Publications] 石川憲一: "工作物回転型ダイヤモンドワイヤソーにおける加工面評価"2002年度精密工学会春季大会学術講演会. (講演予定). (2002)

    • Related Report
      2001 Annual Research Report
  • [Publications] 石川憲一: "細線ダイヤモンドワイヤ工具の開発"砥粒加工学会学術講演会論文集. 285-286 (2000)

    • Related Report
      2000 Annual Research Report

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Published: 1999-04-01   Modified: 2016-04-21  

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