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Development for analytical methods for impurities in super-high purity base metals by combination of stripping and surface analytical methods

Research Project

Project/Area Number 11650827
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field 工業分析化学
Research InstitutionTohoku University

Principal Investigator

OKU Masaoki  Tohoku University, Institute for Materials Research, Associated Professor, 金属材料研究所, 助教授 (90005968)

Co-Investigator(Kenkyū-buntansha) TUJI Koichi  Tohoku university, Institute for Materials Research, Research Associate, 金属材料研究所, 助手 (30241566)
TAKADA Kunio  Tohoku University, Institute for Materials Research, Assistant Professor, 金属材料研究所, 講師 (50005930)
Project Period (FY) 1999 – 2000
Project Status Completed (Fiscal Year 2000)
Budget Amount *help
¥3,200,000 (Direct Cost: ¥3,200,000)
Fiscal Year 2000: ¥600,000 (Direct Cost: ¥600,000)
Fiscal Year 1999: ¥2,600,000 (Direct Cost: ¥2,600,000)
Keywordsstripping methods / surface analysis / super high purity base metals / impurities
Research Abstract

Tellurium and selenium were deposited on silver metal of rotating electrode by non-electrolysis and electrolysis from aqueous solutions containing sodium borimide restrictively. The deposition is the pre-treatment for cathode stripping voltammetry. The chemical states and amounts of the deposited elements by XPS.The detection limits corresponding aqueous solution concentration are ng/ml order, which is comparable to the stripping method. The binding energies of the core level and kinetic energies of Auger electrons changed with the amounts of the depositions. The XPS results and surface sensitive XRD showed the existence of elemental tellurium. These results indicate that modification of the deposition conditions will decrease the detection limits of impurities in high purity base metals.

Report

(3 results)
  • 2000 Annual Research Report   Final Research Report Summary
  • 1999 Annual Research Report

URL: 

Published: 1999-04-01   Modified: 2016-04-21  

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