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Study on Generalized Criteria of Interfacial Strength between Dissimilar Materials

Research Project

Project/Area Number 12450045
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypeSingle-year Grants
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionTOKYO INSTITUTE OF TECHNOLOGY

Principal Investigator

KISHIMOTO Kikuo  Tokyo Institute of Technology, Graduate school of Science and Engineering, Professor, 大学院・理工学研究科, 教授 (30111652)

Co-Investigator(Kenkyū-buntansha) OMIYA Masaki  Tokyo Institute of Technology, Graduate school of Science and Engineering, Associated Professor, 大学院・理工学研究科, 助手 (30302938)
INOUE Hirotsugu  Tokyo Institute of Technology, Graduate school of Science and Engineering, Associated Professor, 大学院・理工学研究科, 助教授 (90193606)
Project Period (FY) 2000 – 2002
Project Status Completed (Fiscal Year 2002)
Budget Amount *help
¥8,800,000 (Direct Cost: ¥8,800,000)
Fiscal Year 2002: ¥1,700,000 (Direct Cost: ¥1,700,000)
Fiscal Year 2001: ¥1,700,000 (Direct Cost: ¥1,700,000)
Fiscal Year 2000: ¥5,400,000 (Direct Cost: ¥5,400,000)
KeywordsInterface / Evaluation of Strength / Fracture Criteria / Cohesive Zone Model / Peel Test / クライテリオン / 界面き裂 / 応力拡大係数 / 破壊クライテリオン / 界面モデル / 有限要素解析
Research Abstract

The purpose of this project is to establish the generalized fracture criteria for bonding interfaces. From the observation of damage process and fracture phenomena in bonding interface between dissimilar materials, interfacial damage model based on damage mechanics was developed. Then, by using this interfacial damage model to numerical simulations, the generalized fracture criteria of interfacial fracture were investigated. The mixed mode fracture tests were also conducted and the validity of this generalized fracture criteria was studied. The research results of this project are summarized as following,
1. The cohesive zone model including loading histories and friction effect at the interface has been proposed.
2. The numerical simulations for mixed fracture test under elastic and elastic-plastic analysis were carried out. Then, the fracture criteria based on the interfacial stress intensity factors can be describe as the elliptical shape.
3. It is shown that the characteristic length … More included in interfacial stress intensity factors can be considered as the fracture process zone ahead of the crack tip. By using this characteristic length, the generalized fracture criteria can be obtained in any kind of material pairs if the mechanical properties of the interface are same.
4. The mixed mode fracture tests for bonding specimen were conducted and the fracture criteria of the bonding interface were obtained. It is shown that the generalized fracture criteria can be applied to the bonding fracture test.
5. The new peel test method to measure the interface strength under several kinds of phase angles has been developed. This test method is called as Multi-stages peel test. The peel strength of multi-layer films, that is composed of Si/PI/Cr/Cu, were measured. In conventional method, the thickness of peeled film was influenced to the peel strength. However, by considering the energy balance under the steady-state peeling, the peel strength independent of film thickness can be obtained. Less

Report

(4 results)
  • 2002 Annual Research Report   Final Research Report Summary
  • 2001 Annual Research Report
  • 2000 Annual Research Report
  • Research Products

    (17 results)

All Other

All Publications (17 results)

  • [Publications] 岸本喜久雄: "界面破壊力学3.接着・接合界面の破壊力学"材料. 49・2. 238-244 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] Omiya, I.Kishimoto, W.Yang: "Interface Debonding Model and it's application to the Mixed Mode Interface Fracture Toughness"International Journal of Damage Mechanics. 11・3. 263-286 (2002)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] M.Omiya, K.Kishimoto, T.Shibuya: "Finite Element Analysis on Fracture Behavior of the Interface Crack with Plastic Deformation"Materials Science Research International. STP-1. 238-243 (2001)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] M.Omiya, K.Kishimoto, H.Inoue, M.Amagai: "Measurement of Copper Thin Film Adhesion by Multi-stages Peel Test"Proceedings of the 4th International Symposium on Electronic Materials and Packaging, Kaohsiung, Taiwan, December 4-6. 472-477 (2002)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] M.Omiya, K.Kishimoto: "Cohesive Zone Approach to the Mixed Mode Fracture Criterion of the Bonding Interface"Proceedings of ETM2002, Experimental & Theoretical Mechanics, Sanur, Bali, Indonesia, March 18-19. 77-83 (2002)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] K.Kishimoto, M.Omiya, W.Yang: "FRACTURE MECHANICS OF BONDING INTERFACE -A COHESIVE ZONE MODEL-"Sensors and actuators, A Physical. 99. 198-206 (2002)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] M.Omiya, K.Kishimoto, W.Yang: "Interface Debonding Model and it's application to the Mixed Mode Interface Fracture Toughness"International Journal of Damage Mechanics. Vol.11, No.3. 263-286 (2002)

    • Related Report
      2002 Annual Research Report
  • [Publications] K.Kishimoto, M.Omiya, W.Yang: "FRACTURE MECHANICS OF BONDING INTERFACE -A COHESIVE ZONE MODEL -"Sensors and actuators, A Physical. Vol.99. 198-206 (2002)

    • Related Report
      2002 Annual Research Report
  • [Publications] M.Omiya, K.Kishimoto, H.Inoue, M.Amagai: "Measurement of Copper Thin Film Adhesion by Multi-stages Peel Test"Proceedings of the 4th International Symposium on Electronic Materials and Packaging, Kaohsiung, Taiwan, December4-6. 472-477 (2002)

    • Related Report
      2002 Annual Research Report
  • [Publications] M.Omiya: "Finite Element Analysis on Fracture Behavior of the Interface Cack with plastic Peformation"Material Science Research International, Special Technical Publication. 1. 238-243 (2001)

    • Related Report
      2001 Annual Research Report
  • [Publications] 大宮正毅: "界面破壊基準の結合力モデルによる検討"第45回日本学術会議材料研究連合講演会講演論文集. 231-232 (2001)

    • Related Report
      2001 Annual Research Report
  • [Publications] 篠原良和: "マルチステージピール試験によるコーティング薄膜のはく離強度評価"日本機械学会材料力学部門講演会講演論文集. 01-16. 417-418 (2001)

    • Related Report
      2001 Annual Research Report
  • [Publications] 大宮正毅: "鉛つり-はんだ接合部の界面強度に及ぼす熱時効の影響"日本機械学会2001年度年次大会講演論文集(I). 01-01. 281-282 (2001)

    • Related Report
      2001 Annual Research Report
  • [Publications] M.Omiya: "Effect of Intermetallic Compound Layer Development on Interfancial strength of Solder Joint"Proceedings of IPACK'01, July8-13, 2001, Kauai, Hawaii, USA. (in CD-ROM). IPACK2001-15556 (2001)

    • Related Report
      2001 Annual Research Report
  • [Publications] K.Kishimoto: "Fracture mechanics of bonding interface -A cohesive zone model-"Proceedings of E-MRS2001, Spring Meeting Symposium, Strasbourg, June5-8, 2001. (2001)

    • Related Report
      2001 Annual Research Report
  • [Publications] 大宮正毅: "界面き裂の塑性変形と伴う破壊挙動に関する有限要素解析"日本機械学会講演論文集. 00-1. 187-188 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] M.Omiya: "The Influence of Plastic Deformation on Interface Fracture Behavior"Key Engineering Materials. 183・187. 779-784 (2000)

    • Related Report
      2000 Annual Research Report

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Published: 2000-04-01   Modified: 2016-04-21  

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