| Project/Area Number |
13450085
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Thermal engineering
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| Research Institution | KYUSHU UNIVERSITY |
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Principal Investigator |
FUJII Motoo Kyushu University, Institute of Advanced Material Study, Professor, 機能物質化学研究所, 教授 (90038589)
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| Co-Investigator(Kenkyū-buntansha) |
ZHANG Xing Kyushu University, Institute of Advanced Material Study Research Associate, 機能物質化学研究所, 助手 (40236823)
TOMIMURA Toshio Kyushu University, Institute of Advanced Material Study Associate Professor, 機能物質化学研究所, 助教授 (70136563)
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| Project Period (FY) |
2001 – 2002
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| Project Status |
Completed (Fiscal Year 2002)
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| Budget Amount *help |
¥14,700,000 (Direct Cost: ¥14,700,000)
Fiscal Year 2002: ¥6,800,000 (Direct Cost: ¥6,800,000)
Fiscal Year 2001: ¥7,900,000 (Direct Cost: ¥7,900,000)
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| Keywords | Conjugate Heat Transfer Phenomena / Heat Transfer Coefficient / Velocity Profile / Flow Resistance / Non-dimensional Correlation / Analysis on Fluid Flow and Heat Transfer |
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| Research Abstract |
(1) 3-D CFD code for the simulation of fluid flow and heat transfer has been developed. Using this CFD code, conjugate heat transfer of conduction and natural convection from a small heat source mounted on the bottom wall of an enclosure has been simulated. Based on the numerical results, a new concept of the effective heat transfer area that is applicable to conjugate heat transfer problems has been proposed. This CFD code is also applicable to the conjugate heat transfer of conduction and forced convection.
(2) Study on conjugate heat transfer of a single heat source mounted on a printed circuit board (PCB) has been carried out. Based on the concept of the effective heat transfer area, a unique correlation between Nusselt number and Reynolds number has been obtained. This correlation can predict the maximum temperature on the heat spreader surface and estimate the effective heat transfer surface area for thermal design of electronic equipment.
(3) Heat transfer coefficients affected by
… More
the flow rate, dimensions of the heat source and thermal conductivity of PCB have been measured accurately for two cases; one for a heat source with a surface area of several square centimeters mounted on the one side of PCB, the other for a protruded heat source mounted on the PCB. As the benchmark experimental data, these results can assist CFD designer to develop and evaluate new CFD code for thermal design of electronic equipment.
(4) Measurements of heat transfer characteristics of an electronic chip module mounted on the PCB have been performed. The heat transfer characteristics of a module package have been compared with a simple heat source mounted on the PCB. The main heat transfer paths and the thermal resistance of each path have been clarified. The validation of modeled heat transfer paths has been investigated. The models for heat transfer paths have been amended and improved. Simulation results obtained with the 'CFdesign' code have been compared with the present experimental data. The limitations and accuracy of 'CFdesign' code have been clarified.
(5) Conjugate heat transfer characteristics for the multiple module packages mounted on a PCB have been numerically studied in details. Based on these numerical results, the effects of the interval between the module packages, thermal conductivity of PCB, and flow rate inside the duct on the effective heat transfer area and the relation between the Nusselt number and Reynolds number have been studied. Based on the above studies, the optimal arrangements of multiple module packages have been discussed. Less
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