| Project/Area Number |
13450143
|
|---|
| Research Category |
Grant-in-Aid for Scientific Research (B)
|
| Allocation Type | Single-year Grants |
|---|
| Section | 一般 |
|---|
| Research Field |
電子デバイス・機器工学
|
|---|
| Research Institution | OSAKA UNIVERSITY |
|---|
Principal Investigator |
FUJIMOTO Kozo Osaka University, Graduate School of Engineering, Professor, 大学院・工学研究科, 教授 (70135664)
|
|---|
| Co-Investigator(Kenkyū-buntansha) |
IWATA Yoshiharu Osaka University, Collaborative Research Center of Advanced Science and Technology, Assistant Professor, 先端科学技術共同研究センター, 助手 (30263205)
YASUDA Kiyokazu Osaka University, Graduate School of Engineering, Assistant Professor, 大学院・工学研究科, 助手 (00210253)
|
|---|
| Project Period (FY) |
2001 – 2002
|
| Project Status |
Completed (Fiscal Year 2002)
|
| Budget Amount *help |
¥15,100,000 (Direct Cost: ¥15,100,000)
Fiscal Year 2002: ¥2,900,000 (Direct Cost: ¥2,900,000)
Fiscal Year 2001: ¥12,200,000 (Direct Cost: ¥12,200,000)
|
|---|
| Keywords | Self-Organizing / Self-Alignment / Device Asembly / Assembly of Optical Device / Adhesion / Surface Tension / High Accurate Positioning |
|---|
| Research Abstract |
In resent years, along the advances of the information and communication apparatus, mass information are processe transmitted at high speed toward information and multimedia age and the need for miniaturization, higher mount de* lower cost and higher performance of advanced electronic packages have been accelerated. Furthermore, a research development of the high density surface mount technology (SMT) of electronic devices and the opto-electronic technolo* the consolidated optoelectronic multi-chip modules (OE-MCMs) of the optical devices (LD, PD, VCSEL, etc.) and elec* elements to an optical wiring board have been made remarkable progress. Especially, the highly precise alignment technologies have been required in high density SMT and interconnection of an optical devices and elements. In such a highly precise alignment technologies, it is necessary that new alternative self-alignment processes which are sufficient to process simply at low process temperature, low cost and without flux should be developed. The objective of this research is the developm* new alternative self-alignment processes which are sufficient to process simply at low process temperature, without flux* low cost. In this research, it is perceived that the positioning boundary of contact line resulted from the differen* wettability on the mounting material should be existed for the self-alignment capability. And new highly precise put* model, pull up model and 3-D model with metal sphere are established. The relationships between process-related paran* are demonstrated and design tool is developed using the mathematical single joint model. Also the self-alignment mechanism is established through the developed alignment dynamic model. At last, the practicabilities of deve* processes are verified through an analytic numerical method and self-alignment experiment.
|
