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Evaluation of Mechanical Properties for Nanometric Silicon Wire Used for Single Electron

Research Project

Project/Area Number 13555030
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypeSingle-year Grants
Section展開研究
Research Field Materials/Mechanics of materials
Research InstitutionRitsumeikan University

Principal Investigator

ISONO Yoshitada  Ritsumeikan Univ., Fac.Science and Engineering, Professor, 理工学部, 助教授 (20257819)

Co-Investigator(Kenkyū-buntansha) 小西 聡  立命館大学, 理工学部, 助教授 (50288627)
Project Period (FY) 2001 – 2003
Project Status Completed (Fiscal Year 2003)
Budget Amount *help
¥13,000,000 (Direct Cost: ¥13,000,000)
Fiscal Year 2003: ¥2,600,000 (Direct Cost: ¥2,600,000)
Fiscal Year 2002: ¥2,600,000 (Direct Cost: ¥2,600,000)
Fiscal Year 2001: ¥7,800,000 (Direct Cost: ¥7,800,000)
KeywordsSilicon nanowire / Bending test / Tensile test / Atomic force microscope / Electrostatic actuator / Size effect / 走査型プローブナノリソグラフィ / マイクロマシーニング / AFM
Research Abstract

This research focuses on revealing specimen size and temperature effects on mechanical properties of nanometric single crystal silicon (SCS) wires used for single electron devices. Mechanical properties of the nanometric SCS wires were characterized by bending tests with an atomic force microscope (AFM). The fixed-fixed SCS wires with widths from 200 nm to 800 nm and a thickness of 255 nm were fabricated on a silicon diaphragm by means of field-enhanced anodization with AFM and anisotropic wet etching. The AFM bending tests of the SCS wires were carried out at temperatures ranging from 295 K to 573 K in high vacuum. The tensile tesiting device including an electrostatic actuator and nanometric SCS wire was also designed.
The nanometric SCS wires fractured in a brittle manner at room temperature, whereas they deformed plastically above 373 K. Young's modulus of the wires in the <110> direction on the (111) surface at temperature ranging from 295 K to 573 K averaged from 170 GPa to 159 GP … More a, respectively, but had no specimen size effect. However, the specimen size produced a large effect on the fracture strength since the fracture strength of the 200 nm-wide wires ranged from 17.8 GPa to 15.9 GPa, which were 1.5 times larger than that of the 800 nm-wide wires.
Plastic flow of the nanometric SCS wires appeared in force-displacement curves at 373 K, which was caused by high shear stress acting on the wires. Slip lines comprised of edge dislocations responsible for the plastic flow was observed by AFM and SEM techniques. The slip line density of the nanometric wires was 100 times larger than that of the micrometer scale specimen, which meant the specimen size had a large influence on the plastic deformation behavior. The edge dislocation model newly proposed in this research was able to rationalize that the specimen size effect on the plastic deformation behavior at elevated temperature was determined by the correlation between the specimen size and the activation Gibbs free energy.
Finally, the electrostatic actuator on the tensile testing device, developed here, gave a useful performance in the nanoscale tensile testing. Less

Report

(4 results)
  • 2003 Annual Research Report   Final Research Report Summary
  • 2002 Annual Research Report
  • 2001 Annual Research Report
  • Research Products

    (6 results)

All Other

All Publications (6 results)

  • [Publications] Takahiro Namazu, Yoshitada Isono, Takeshi Tanaka: "Plastic Deformation of Nanometric Single Crystal Silicon Wire in AFM Bending Test at Intermediate Temperatures"Journal of Micro electro mechanical systems, IEEE/ASME, pp.-, 2002.. Vol.11, No.2. 125-135 (2002)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Takahiro Namazu, Yoshitada Isono: "Quasi-static Bending Test of Nano-Scale SiO2 Wire at Intermediate Temperatures Using AFM-based Technique"Sensor and Actuators A, Elsevier. 104. 78-85 (2003)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Takahiro Namazu, Yoshitada Isono, Takeshi Tanaka: "Plastic Deformation of Nanometric Single Crystal Silicon Wire in AFM Bending Test at Intermediate Temperatures"Journal of Micro electro mechanical systems. IEEE/ASME, Vol.11, No.2. 125-135 (2002)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Takahiro Namazu, Yoshitada Isono: "Quasi-Static Bending Test of Nano-Scale SiO2 Wire at Intermediate Temperatures Using AFM-based Technique"Sensor and Actuators A. 104. 78-85 (2003)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Takahiro Namazu, Yoshitada Isono: "High-Cycle Fatigue Damage Evaluation for Micro-Nanoscale Single Crystal Silicon under Bending and Tensile Stressing"Proc.of the 17th IEEE International Conference on MEMS 2004. 149-152 (2004)

    • Related Report
      2003 Annual Research Report
  • [Publications] Takahiro Namazu, Yoshitada Isono: "High-Cycle Fatigue Test of Nanoscale Si and SiO_2 Wires Based on AFM Technique"Proc. of the 16th IEEE International Conference on MEMS 2003. 662-665 (2003)

    • Related Report
      2002 Annual Research Report

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Published: 2001-04-01   Modified: 2016-04-21  

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