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Trial Production of Light Sensor by Laser Direct Drawing

Research Project

Project/Area Number 13555032
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypeSingle-year Grants
Section展開研究
Research Field 機械工作・生産工学
Research InstitutionTokyo Institute of Technology

Principal Investigator

TOKURA Hitoshi  Tokyo Institute of Technology, Graduate School of Science and Engineering, Professor, 大学院・理工学研究科, 教授 (10016628)

Co-Investigator(Kenkyū-buntansha) IMAI Yoshihito  Mitsubishi electric, Industrial System laboratories Chief Scientist, 産業システム研究所, 主任研究員
HIDAI Hirofumi  Tokyo Institute of Technology, Graduate School of Science and Engineering Research Associate, 大学院・理工学研究科, 助手 (60313334)
HIRATA Atsushi  Tokyo Institute of Technology, Graduate School of Science and Engineering Associate Professor, 大学院・理工学研究科, 助教授 (50242277)
Project Period (FY) 2001 – 2002
Project Status Completed (Fiscal Year 2002)
Budget Amount *help
¥13,600,000 (Direct Cost: ¥13,600,000)
Fiscal Year 2002: ¥4,600,000 (Direct Cost: ¥4,600,000)
Fiscal Year 2001: ¥9,000,000 (Direct Cost: ¥9,000,000)
KeywordsLaser / Glass / Print curcuit / Deposition / Maskless / マスクレス / 微小レンズ
Research Abstract

Many chips on silicon wafer are separated and packaged, on the process of silicon device manufacturing. Especially, processes are complicated on the optical devices manufacturing, because they need optical system. Hence, if silicon wafer and glass can be bonded freely and wired on the glass, that method is useful as a new device package process.
In order to achieve these process, purposes of this research were (1) estimate the bonding strength of laser bonded silicon wafer - glass (2) contamination cloud be occur if device area on the silicon and glass contact directly, hence, in order to avoid direct contact, small protrusion formation by laser irradiation was tried. (3) Laser processing of the glass was difficult, because of its transparency. However it will be useful if the glass is processed by laser irradiation. Hence, laser processing of glass was tried.
As a result, (1) silicon wafer and class could be boned by laser irradiation to silicon wafer through glass. The bonding strength was stronger than silicon wafer itself. (2) Laser irradiation to silicon wafer caused changes, the change could be used as a mask for KOH, and could make small protrusion. (3) Cooling and condensing water on the glass enabled to laser process.

Report

(3 results)
  • 2002 Annual Research Report   Final Research Report Summary
  • 2001 Annual Research Report
  • Research Products

    (10 results)

All Other

All Publications (10 results)

  • [Publications] 比田井 洋史, 戸倉 和: "水滴をレンズとして使用したレーザ加工"2002年度精密工学会秋期大会学術講演論文集. 439-439 (2002)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] 比田井 洋史, 戸倉 和: "透明材料のレーザ加工"2001年度精密工学会秋期大会学術講演論文集. 176-176 (2001)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] 細野高史, 戸倉和: "レーザ照射におる単結晶シリコン表面の改質"2002年度精密工学会春期大会学術講演論文集. 374-374 (2002)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] Hirofumi HIDAI, Hitoshi TOKURA: "Laser processing used water droplet as a lens"Proc. Of Jpn. Soc. For Precision Eng 2002 Fall Meeting. 439 (2002)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] Hirofumi HIDAI, Hitoshi TOKURA: "Laser processing of transparent materials"Proc. Of Jpn. Soc. For Precision Eng 2001 Fall Meeting. 176 (2001)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] Takashi HOSONO, Hitoshi TOKURA: "Modification of single crystal silicon by laser irradiation"Proc. Of Jpn. Soc. For Precision Eng 2002 Spring Meeting. 374 (2002)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2002 Final Research Report Summary
  • [Publications] S.Nakazawa, H.Hidai, H.Tokura: "Spherical objects molding using liquid-liquid interface"Proc. of the 3rd int. conf. and 4th general meeting of euspen. 245-248 (2002)

    • Related Report
      2002 Annual Research Report
  • [Publications] 中澤伸一, 比田井洋史, 戸倉和: "液体の界面張力を利用したプラスチック成形の試み-球面体成形の試み-"精密工学会誌. 68・4. 571-575 (2002)

    • Related Report
      2002 Annual Research Report
  • [Publications] 比田井 洋史, 戸倉 和: "透明材料のレーザ加工"2001年度精密工学会終期大会学術講演論文集. 176-176 (2001)

    • Related Report
      2002 Annual Research Report
  • [Publications] 比田井 洋史, 戸倉 和: "透明材料のレーザ加工"2001年度精密工学会秋期大会学術講演論文集. 176-176 (2002)

    • Related Report
      2001 Annual Research Report

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Published: 2001-04-01   Modified: 2016-04-21  

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