| Budget Amount *help |
¥12,800,000 (Direct Cost: ¥12,800,000)
Fiscal Year 2002: ¥2,600,000 (Direct Cost: ¥2,600,000)
Fiscal Year 2001: ¥10,200,000 (Direct Cost: ¥10,200,000)
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| Research Abstract |
High-performance and ultra-low power consumption PDAs as a degital-network-communication tool is strongly required in the grobal-network-information society. In such tool, large-scale integrated system which can catch up with changing cutstomer needs day by day is essencial, and therefore ultra-short-time semiconductor manufacturing is required. In this study, ultra-short-time and highly efficient photo-resist stripping technology which can drastically improve semiconductor manufacturing efficiency is established.
AT first, we have developed a experimental equipment, featuring the ability to hange a injection speed, injection quantity, injection pressure of gas-liquid mixture, substrate movement speed, inozzle movement speed an so on. With this equipment, we have optimized such parameters and obtained that the photo-resiston 8 inch wafer can be stripped only in one minute, nevertheless the arsenic ions implantation (10E16 atoms/cm2) have been taken to the photo-resisit, which cannot be stripped easily even if O2 plasma ashing Followed by the chemical cleaning with the 4:1 mixture of 98% H2SO4 and 30% H2O2 have been done.
Moreover, in order to shorten the processing time, we have imvestiated the pre-treatment process Followed by the treatment by the gas-liquid mixture. As a result, we have obtained that the O3-added ultrapure-water treatment with pH control by CO2 addition can effectively remove the photo-resist.
As mentioned above, we have established the foundation for the short-time photo-resist stripping technology for highly efficient and ultra-short-time semiconductor manufacturing.
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