| Project/Area Number |
13650949
|
|---|
| Research Category |
Grant-in-Aid for Scientific Research (C)
|
| Allocation Type | Single-year Grants |
|---|
| Section | 一般 |
|---|
| Research Field |
高分子構造・物性(含繊維)
|
|---|
| Research Institution | Shizuoka University |
|---|
Principal Investigator |
INGAKI Norihiro Shizuoka University, Fac. Of Eng., Professor, 工学部, 教授 (30022015)
|
|---|
| Co-Investigator(Kenkyū-buntansha) |
NARUSHIMA Kazuo Shizuoka University, Fac. Of Eng., Assistant, 工学部, 助手 (40303531)
TASAKA Shigeru Shizuoka University, Fac. Of Eng., Professor, 工学部, 教授 (10134793)
|
|---|
| Project Period (FY) |
2001 – 2002
|
| Project Status |
Completed (Fiscal Year 2002)
|
| Budget Amount *help |
¥3,500,000 (Direct Cost: ¥3,500,000)
Fiscal Year 2002: ¥700,000 (Direct Cost: ¥700,000)
Fiscal Year 2001: ¥2,800,000 (Direct Cost: ¥2,800,000)
|
|---|
| Keywords | Printed circuit board / Armatic polymers / Copper metallization / Plasma treatment / Surface modification / アラミド |
|---|
| Research Abstract |
Aromatic polymers such as polyimide and poly(oxybenzoate-co-oxynaphthoate) were modified with direct and remote plasmas, and the effects of the modification on the adhesion between the copper layer and the modified film surface were investigated for flexible printed circuit boards. The plasma treatment led to a noticeable decrease in the contact angle, which was mainly due to the C-O functional groups on the surfaces. The modification by the plasma was effective in improving the adhesion with copper metal. The peel strength for the copper/polymer system was enhanced from 10 to more than 500 mN/5 mm by the surface modification.
|
