• Search Research Projects
  • Search Researchers
  • How to Use
  1. Back to previous page

Development of THz Wave Tomography Technique and Nondestructive Evaluation of Delamination in Mounted Electronic Packages

Research Project

Project/Area Number 14350050
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypeSingle-year Grants
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionTohoku University

Principal Investigator

JU Yang  Tohoku University, Graduate School of Engineering, Associate Professor, 大学院・工学研究科, 助教授 (60312609)

Co-Investigator(Kenkyū-buntansha) SAKA Masumi  Tohoku University, Graduate School of Engineering, Professor, 大学院・工学研究科, 教授 (20158918)
SOYAMA Hitoshi  Tohoku University, Graduate School of Engineering, Professor, 大学院・工学研究科, 教授 (90211995)
SASAGAWA Kazuhiko  Hirosaki University, Faculty of Science and Technology, Associate Professor, 理工学部, 助教授 (50250676)
OGURA Yukio  Hitachi Engineering Co. Ltd., Senior Engineer, 検査部門, 技師長(研究職)
Project Period (FY) 2002 – 2003
Project Status Completed (Fiscal Year 2003)
Budget Amount *help
¥15,000,000 (Direct Cost: ¥15,000,000)
Fiscal Year 2003: ¥4,500,000 (Direct Cost: ¥4,500,000)
Fiscal Year 2002: ¥10,500,000 (Direct Cost: ¥10,500,000)
KeywordsTHz wave / Laser / Electro-optic crystal / Tomography / Electronic package / Delamination / Contactless / High resolution
Research Abstract

1.Development of the generation and detection system of THz wave
A pulsed laser beam generated by a fs laser was separated into a pump and a probe beam by a beam splitter. The pump beam was then focused on a nondoped GaAs wafer. Due to the photoconductive effect, a pulsed THz beam was generated from the GaAs emitter. Moreover, the THz beam was focused on a ZnTe crystal white the probe beam was also focused on the ZnTe sensor, through a time delay. Due to the Pockels effect, a phase variation of the probe beam was induced by the electro-optic modulation. By using a pair of balanced photodiodes, the phase variation which varies with the electric field of the THz wave was detected.
2.Construction of the tomography system
The generated THz beam was focused on the inspected sample, and the reflected THz wave which carries the information of the sample was focused on the ZnTe sensor. The probe beam was synchronized with the reflected THz beam at the ZnTe sensor. In the same time, the sample was moved in the x and y direction by an electric stage. Therefore, by adjusting the time delay as a time gate, the amplitude of the reflected THz wave from a cross section of the sample was recorded, and a tomograph was generated.
3.Nondestructive evaluation of delamination in electronic packages
For the practical use of the THz wave tomography, the generation of the 3D image of delamination between the chip and the encapsulant resin in the mounted electronic packages, and the establishment of nondestructive evaluation method of mounted electronic packages on an assembly line, are being promoted.

Report

(3 results)
  • 2003 Annual Research Report   Final Research Report Summary
  • 2002 Annual Research Report
  • Research Products

    (49 results)

All Other

All Publications (49 results)

  • [Publications] Y.Ju, (K.Inoue, M.Saka, H.Abe): "Contactless Measurement of Electrical Conductivity of Semiconductor Wafers Using the Reflection of Millimeter Waves"Applied Physics Letters. 81・19. 3585-3587 (2002)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (M.Saka, T.Hiroshima): "Nondestructive Detection of Small Cracks in Polycrystalline Silicon Substrates Using Millimeter Waves"Proc.6th Far-East Conference on Nondestructive Testing. 535-539 (2002)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] 巨 陽, (坂 真澄): "シリコンウェーハの導電率の非接触計測手法の開発"日本機械学会平成14年度材料力学部門講演会講演論文集. 157-158 (2002)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] 広沢 容, (巨 陽, 坂 真澄): "ミリ波コンパクト装置による導電薄膜の導電率の非接触計測"日本機械学会東北支部八戸地方講演会講演論文集. 215-216 (2002)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (Y.Hirosawa, M.Saka): "Microwave Measurement of the Conductivity of Conducting Thin Films"Optics and Precision Engineering. 11・1. 59-61 (2003)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (Y.Hirosawa, M.Saka, H.Abe): "Contactless Measurement of Thin Film Conductivity by a Microwave Compact Equipment"International Journal of Modern Physics B. 17・3/4. 737-742 (2003)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (Y.Hirosawa, M.Saka, H.Abe): "Development of a Millimeter Wave Compact Equipment for NDT of Materials"International Journal of Infrared and Millimeter Waves. 24・3. 391-397 (2003)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (M.Saka, H.Abe): "Microwave Imaging of Conductivity Distribution of Silicon Wafers"International Electronic Packaging Technical Conference and Exhibition '03. InterPack 2003-35117(CD-ROM). 1-4 (2003)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (H.Yamamoto, M.Saka): "Nondestructive Inspection of Chip Size Package by Millimeter Waves"International Electronic Packaging Technical Conference and Exhibition '03. InterPack 2003-35118(CD-ROM). 1-4 (2003)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (Y.Hirosawa, H.Soyama, M.Saka): "Contactless Measurement of Conductivity of Silicon Wafers by a Microwave Compact Equipment"Proc.5th International Conference on Electronics Materials and Packaging. 141-144 (2003)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] M.Saka, (Y.Ju, Y.Uchimura, T.Miyadu): "On Microwave Dual Frequency Technique for Evaluation of Surface Cracks"Key Engineering Materials. 261-263. 955-961 (2004)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] 巨 陽, (大野 悌, 祖山 均, 坂 真澄): "マイクロ波による半導体材料の導電率の定量評価手法の開発"第13回MAGDAコンファレンス講演論文集. 17-22 (2004)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (Y.Ohno, M.Saka, H.Abe): "Quantitative Evaluation of Moisture in Encapsulant Resin of IC Packages by Microwaves"JSME International Journal, Series A. 47(印刷中). (2004)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (Y.Ohno, M.Saka): "A Method for Quantitative Evaluation of Electrical Conductivity of Silicon Wafers by Millimeter-Waves"Key Engineering Materials. 270-273(印刷中). (2004)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] M.Saka, (T.Miyadu, Y.Ju): "Investigation of the Effect of Crack Closure Stress on Microwave Dual Frequency Technique for Evaluation of Small Cracks"Key Engineering Materials. 270-273(印刷中). (2004)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (K.Inoue, M.Saka, H.Abe): "Contactless Measurement of Electrical Conductivity of Semiconductor Wafers Using the Reflection of Millimeter Waves"Applied Physics Letters. Vol.81, No.19. 3585-3587 (2002)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (M.Saka, T.Hiroshima): "Nondestructive Detection of Small Cracks in Polycrystalline Silicon Substrates Using Millimeter Waves"Proc. 6th Far-East Conf. on Nondestructive Testing. 535-539 (2002)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (M.Saka): "Development of a Contactless Method for Measuring Conductivity of Silicon Wafers"Proc. The 2002 Annual Meeting of JSME/MMD. No.02-05. 157-158 (2002)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Hirosawa, (Y.Ju, M.Saka): "Contactless Measurement of Conductivity of Conducting Film by Compact Millimeter-Wave Equipment"Proc. JSME Tohoku Branch Hachinohe Local Meeting. 215-216 (2002)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (Y.Hirosawa, M.Saka): "Microwave Measurement of the Conductivity of Conducting Thin Films"Optics and Precision Engineering. Vol.11, No.1. 59-61 (2003)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (Y.Hirosawa, M.Saka, H.Abe): "Contactless Measurement of Thin Film Conductivity by a Microwave Compact Equipment"Int.J. of Modern Physics B. Vol.17, Nos.3&4. 737-742 (2003)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (Y.Hirosawa, M.Saka, H.Abe): "Development of a Millimeter Wave Compact Equipment for NDT of Materials"Int.J. of Infrared and Millimeter Waves. Vol.24, No.3. 391-397 (2003)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (M.Saka, H.Abe): "Microwave Imaging of Conductivity Distribution of Silicon Wafers"Int. Electronic Packaging Technical Conf. and Exhibition '03. Inter Pack2003-35117(CD-ROM). 1-4 (2003)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (H.Yamamoto, M.Saka): "Nondestructive Inspection of Chip Size Package by Millimeter Waves"Int. Electronic Packaging Technical Conf. and Exhibition '03. Inter Pack2003-35118(CD-ROM). 1-4 (2003)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (Y.Hirosawa, H.Soyama, M.Saka): "Contactless Measurement of Conductivity of Silicon Wafers by a Microwave Compact Equipment"Proc. 5th International Conference on Electronics Materials and Packaging. 141-144 (2003)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] M.Saka, (Y.Ju, Y.Uchimura, T.Miyadu): "On Microwave Dual Frequency Technique for Evaluation of Surface Cracks"Key Engineering Materials. Vol.261-263. 955-961 (2004)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (Y.Ohno, H.Soyama, M.Saka): "A Study on the Evaluation of Electrical Conductivity of Semiconductor Materials by Microwaves"Proc. MAGDA Conference in Sendai. 17-22 (2004)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (Y.Ohno, H.Soyama, M.Saka): "Quantitative Evaluation of Moisture in Encapsulant Resin of IC Packages by Microwaves"JSME International Journal, Series A. Vol.47(in press). (2004)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, (Y.Ohno, M.Saka): "A Method for Quantitative Evaluation of Electrical Conductivity of Silicon Wafers by Millimeter-Waves"Key Engineering Materials. Vol.270-273(in press). (2004)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] M.Saka, (T.Miyadu, Y.Ju): "Investigation of the Effect of Crack Closure Stress on Microwave Dual Frequency Technique for Evaluation of Small Cracks"Key Engineering Materials. Vol.270-273(in press). (2004)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2003 Final Research Report Summary
  • [Publications] Y.Ju, Y.Hirosawa, M.Saka, H.Abe: "Development of a Millimeter Wave Compact Equipment for NDT of Materials"International Journal of Infrared and Millimeter Waves. 24・3. 391-397 (2003)

    • Related Report
      2003 Annual Research Report
  • [Publications] Y.Ju, M.Saka, H.Abe: "Microwave Imaging of Conductivity Distribution of Silicon Wafers"International Electronic Packaging Technical Conference and Exhibition '03. InterPack2003-35117(CD-ROM). 1-4 (2003)

    • Related Report
      2003 Annual Research Report
  • [Publications] Y.Ju, H.Yamamoto, M.Saka: "Nondestructive Inspection of Chip Size Package by Millimeter Waves"International Electronic Packaging Technical Conference and Exhibition '03. InterPack2003-35118(CD-ROM). 1-4 (2003)

    • Related Report
      2003 Annual Research Report
  • [Publications] Y.Ju, Y.Ohno, M.Saka, H.Abe: "Quantitative Evaluation of Moisture in Encapsulant Resin of IC Packages by Microwaves"International Conference on Advanced Technology in Experimental Mechanics 2003. OS02W0125(CD-ROM). 1-4 (2003)

    • Related Report
      2003 Annual Research Report
  • [Publications] Y.Ju, Y.Hirosawa, H.Soyama, M.Saka: "Contactless Measurement of Conductivity of Silicon Wafers by a Microwave Compact Equipment"Proc.5th International Conference on Electronics Materials and Packaging. 141-144 (2003)

    • Related Report
      2003 Annual Research Report
  • [Publications] M.Saka, Y.Ju, Y.Uchimura, T.Miyadu: "On Microwave Dual Frequency Technique for Evaluation of Surface Cracks"Key Engineering Materials. 261-263. 955-961 (2004)

    • Related Report
      2003 Annual Research Report
  • [Publications] Y.Ju, Y.Ohno, M.Saka: "A Method for Quantitative Evaluation of Electrical Conductivity of Silicon Wafers by Millimeter-Waves"Key Engineering Materials. (印刷中). (2004)

    • Related Report
      2003 Annual Research Report
  • [Publications] M.Saka, T.Miyadu, Y.Ju: "Investigation of the Effect of Crack Closure Stress on Microwave Dual Frequency Technique for Evaluation of Small Cracks"Key Engineering Materials. (印刷中). (2004)

    • Related Report
      2003 Annual Research Report
  • [Publications] Y.Ju, T.Miyadu, H.Soyama, M.Saka: "Quantitative Evaluation of Cracks Underwater by Microwaves"Proc.Asian Pacific Conference for Fracture and Strength '04. (発表予定). (2004)

    • Related Report
      2003 Annual Research Report
  • [Publications] Y.Ju, Y.Hirosawa, H.Soyama, M.Saka: "Contactless Measurement of Conductivity of Silicon Wafers by Minimeter Waves"Proc. the Fifth International Kharkov Symposium on Physics and Engineering of Microwaves, Millimeter and Submillimeter Waves. (発表予定). (2004)

    • Related Report
      2003 Annual Research Report
  • [Publications] Y.Ju, Y.Ohno, H.Soyama, M.Saka: "Electrical Characterization of Doped Silicon Using High-Frequency Electromagnetic Waves"Proc.4th International Forum on Advanced Material Science and Technology. (発表予定). (2004)

    • Related Report
      2003 Annual Research Report
  • [Publications] Y.Ju, K.Nakagawa, H.Soyama, M.Saka: "Investigation of Electrical Properties of Semiconductor Wafers Using THz Electromagnetic Waves"Proc.The 29th International Conference on Infrared and Millimeter Waves. (発表予定). (2004)

    • Related Report
      2003 Annual Research Report
  • [Publications] Y.Ju, K.Inoue, M.Saka, H.Abe: "Contactless Measurement of Electrical Conductivity of Semiconductor Wafers Using the Reflection of Millimeter Waves"Applied Physics Letters. 81・19. 3585-3587 (2002)

    • Related Report
      2002 Annual Research Report
  • [Publications] Y.Ju, M.Saka, T.Hiroshima: "Nondestructive Detection of Small Cracks in Polycrystalline Silicon Substrates Using Millimeter Waves"Proc. 6th Far-East Conf. on Nondestructive Testing (FENDT '02). 535-539 (2002)

    • Related Report
      2002 Annual Research Report
  • [Publications] Y.Ju, Y.Hirosawa, M.Saka: "Microwave Measurement of the Conductivity of Conducting Thin Films"Proc. Int. Symp. on Precision Engineering and MEMS. 79-82 (2002)

    • Related Report
      2002 Annual Research Report
  • [Publications] 巨 陽, 坂 真澄: "シリコンウェーハの導電率の非接触計測手法の開発"日本機械学会平成14年度材料力学部門講演会講演論文集. 157-158 (2002)

    • Related Report
      2002 Annual Research Report
  • [Publications] 広沢 容, 巨 陽, 坂 真澄: "ミリ波コンパクト装置による導電薄膜の導電率の非接触計測"日本機械学会東北支部八戸地方講演会講演論文集. 215-216 (2002)

    • Related Report
      2002 Annual Research Report
  • [Publications] Y.Ju, Y.Hirosawa, M.Saka, H.Abe: "Contactless Measurement of Thin Film Conductivity by a Microwave Compact Equipment"International Journal of Modern Physics B. 17・3/4. 737-742 (2003)

    • Related Report
      2002 Annual Research Report
  • [Publications] Y.Ju, Y.Hirosawa, M.Saka, H.Abe: "Development of a Millimeter Wave Compact Equipment for NDT of Materials"International Journal of Infrared and Millimeter Waves. 24・3(印刷中). (2003)

    • Related Report
      2002 Annual Research Report

URL: 

Published: 2002-04-01   Modified: 2016-04-21  

Information User Guide FAQ News Terms of Use Attribution of KAKENHI

Powered by NII kakenhi