| Project/Area Number |
14350073
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
機械工作・生産工学
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| Research Institution | Okayama University |
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Principal Investigator |
UNO Yoshiyuki Okayama University, Faculty of Engineering, Professor, 工学部, 教授 (20029341)
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| Co-Investigator(Kenkyū-buntansha) |
OKADA Akira Okayama University, Faculty of Engineering, Lecture, 工学部, 講師 (60263612)
OKAMOTO Yasuhiri Okayama University, Faculty of Engineering, Research Associate, 工学部, 助手 (40304331)
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| Project Period (FY) |
2002 – 2004
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| Project Status |
Completed (Fiscal Year 2004)
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| Budget Amount *help |
¥14,800,000 (Direct Cost: ¥14,800,000)
Fiscal Year 2004: ¥3,500,000 (Direct Cost: ¥3,500,000)
Fiscal Year 2003: ¥4,100,000 (Direct Cost: ¥4,100,000)
Fiscal Year 2002: ¥7,200,000 (Direct Cost: ¥7,200,000)
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| Keywords | Wire EDM / Monocrystalline Silicon Ingot / Silicon Wafer / Slicing / Contamination / Multi-slicing |
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| Research Abstract |
High efficiency and high accuracy slicing method of monocrystalline silicon ingot by wire EDM, in which machining force is relatively small because of non-contact processing, were investigated.
In the first year (FY2002), special electrical discharge slicing equipment with one wire electrode was experimentally manufactured. This equipment can generate relatively low peak and long duration pulse compared to usual commercial wire EDM equipment. Besides, wire speed is 10m/s and faster than commercial one. This equipment could realize that machining accuracy was almost same and removal rate was faster compared to conventional multi-wire saw method.
In the second year (FY2003), we experimentally developed multi-wire EDM slicing equipment based on the results obtained in the first year for the purpose of high efficiency processing. In the case of this system, stable processing could not be obtained by traditional ISO pulse system, because the concentration of electrical discharge was observed
… More
by single wire and multi-power supply system. Therefore, we investigated the simultaneous pulse system, in which all pulses were generated at the same time. This simultaneous pulse system lead to better processing results compared to ISO pulse system.
In the last year (FY2004), we the improved newly developed multi-wire EDM slicing equipment and investigated its characteristics. Stable processing could be realized by the changing conductivity pieces position, newly setting of wire sub-guide and the improvement of working fluid supplying method. It was cleared that better kerf shape was obtained with increasing the wire speed, and better machined surface was also obtained by controlling electrical discharge condition properly. Moreover, removal rate with three wire electrodes was equal to that with single wire electrode, and kerf shapes also were good. Therefore, it was confirmed that the multi-wire EDM method has the possibility of high efficiency and high accuracy slicing method for monocrystalline silicon ingot by using the new equipment developed in this study. Less
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