| Project/Area Number |
14350218
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Measurement engineering
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| Research Institution | Kanazawa University |
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Principal Investigator |
YAMADA Sotoshi Kanazawa University, Institute of Nature and Environmental Technology, professor, 自然計測応用研究センター, 教授 (80019786)
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| Co-Investigator(Kenkyū-buntansha) |
IWAHARA Masayoshi Kanazawa University, Graduate School of Nature and Environmental Technology, professor, 自然科学研究科, 教授 (80020212)
WAKIWAKA Hiroyuki Shinsyu University, Faculty of Engineering, professor, 工学部, 教授 (50240461)
TANIGUCHI Tetuki The University of Electro-Communications, Faculty of Electro-Communication, associate, 電気通信学部, 助手 (50283099)
AZUMA Takehito Kanazawa University, Graduate School of Natural Science and Technology, associate, 自然科学研究科, 助手 (60308179)
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| Project Period (FY) |
2002 – 2004
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| Project Status |
Completed (Fiscal Year 2004)
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| Budget Amount *help |
¥13,800,000 (Direct Cost: ¥13,800,000)
Fiscal Year 2004: ¥1,200,000 (Direct Cost: ¥1,200,000)
Fiscal Year 2003: ¥3,400,000 (Direct Cost: ¥3,400,000)
Fiscal Year 2002: ¥9,200,000 (Direct Cost: ¥9,200,000)
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| Keywords | printed circuit board / non-destructive testing / eddy-current testing / giant magneto-resistance / non-contacting test / resistance test / property inspection / image processing |
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| Research Abstract |
The purpose of this study is to contribute to the progress of the high density mounting of electronic equipment by the nature inspection method of the high-density printed wiring based on the compound eddy current testing (ECT) probe by supersensitive magneto-resistance element (GMR). In the features, the testing equipment using eddy-current technology in the printed wiring inspection directly examines electro-conductivity of the printed wiring conductor by eddy currents in comparison with the method by image inspection which is the mainstream.
[1]Development of multi-GMR sensor and examination of characteristics
We developed the multi-GMR sensor for eddy-current probe. There are two type GMR of 50 and 100 mm length which has the sensitivity of 0.2 mV/μT at 1.0 MHz. It is clarified that the sensitivity of the GMR is about 40 dB higher than inductive coil at the same size.
[2]Inspection of printed circuit board by eddy-current probe with GMR sensor.
The characteristic for the printed circuit board inspection was measured by the production of GMR+ planar coil compound probe which made high frequency exciting coil and SV-GMR to be the detection sensor. For printed circuit testing with 70-100 μm width, the disconnection, 20 % chipping defect, 50 % depth imperfection can be detected from the experimental result.
[3]Software for recognizing defect
The signal processing software that extracts the defect portion from two-dimensional detection signal image was developed.
[4]Technology exchange with inspection equipment manufacturing company.
With the aim of the construction of high-density printed wiring testing system using the eddy current testing probe, the exchange and transfer of technology were tried for GMR element manufacturer, ECT technology manufacturer, and testing equipment manufacturer.
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