Research on multi-layer type of Peltier cooling micro-devices by assembling thermoelectric particles
| Project/Area Number |
14350378
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Material processing/treatments
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| Research Institution | Tohoku University |
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Principal Investigator |
KAWASAKI Akira Tohoku Univ., Graduate School of Engineering, Professor, 大学院・工学研究科, 教授 (50177664)
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| Co-Investigator(Kenkyū-buntansha) |
KANG Yan-Sheng Tohoku Univ., Graduate School of Engineering, Associate Professor, 大学院・工学研究科, 助教授 (80252716)
渡辺 龍三 東北大学, 教育情報学研究部, 教授 (20005341)
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| Project Period (FY) |
2002 – 2004
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| Project Status |
Completed (Fiscal Year 2004)
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| Budget Amount *help |
¥12,600,000 (Direct Cost: ¥12,600,000)
Fiscal Year 2004: ¥1,800,000 (Direct Cost: ¥1,800,000)
Fiscal Year 2003: ¥2,400,000 (Direct Cost: ¥2,400,000)
Fiscal Year 2002: ¥8,400,000 (Direct Cost: ¥8,400,000)
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| Keywords | peltier cooling / micro particle / thermoelectric material / micro assembly / micro device / POEM / monosized particles / Seebeck coefficient |
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| Research Abstract |
Recent years, technology on development of new thermoelectric (TE) materials and fabrication of thermoelectric device has been made much progress and many efforts are made to extend the application of thermoelectric. On the other hand, micro-machine, microcomputer and CPU have been used in a lot of field in various portable products. These trends make a specific request for small-sized electric source or for local cooling device.
In order to fabricate a thermoelectric module or a device, usually several technique processes are needed. The main procedures include preparation of thermoelectric materials, cutting, joining of TE material with electrode. If we need a small module that is required about the size of several millimeters, the TE material should be cut smaller. This will make a lot of difficulties for assemble a high quality thermoelectric device since most thermoelectric materials are brittle and hard to be cut in very small pieces especially for TE materials those used at low t
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emperature. To solve this problem, assembly of small monosized particles and a sintered module should be an effective choice. The assembling technique for monosized particles can also be easily applied to compose a functionally graded thermoelectric device or other structures. The authors have prepared high accuracy monosized particles including thermoelectric materials balls of Bi-Sb alloy by pulsated orifice ejection method (POEM). These enable us to do the research of assembling and sintering process of monosized particles.
For sintering and joining of bulk thermoelectric materials, the method of spark plasma sintering (SPS) and plasma activated sintering (PAS) are effective processes. The SPS is difficult to use to the sintering of micro particles but in the view of using direct current. The preparation of sintered monosized thermoelectric particles is also can be done by a normal electric furnace, however, we found it is very difficult to control the microstructure and it takes long time. The project is take the aim at developing of an effective method for preparing of sintered monosized thermoelectric particles, and makes some approach to compose micro-thermoelectric device through the discharge sintering.
The characterization results indicate that the discharge-sintered monosized particles shows better properties compared with others, and we consider the condition of electric discharge at 5 watt per second led the thermoelectric properties to a balanced high level. The result of Seebeck at room temperature for discharge sintering is around 82 μ V/K, it is near value from the bulk practical Bi-Sb alloy. Less
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Report
(4 results)
Research Products
(2 results)
