| Project/Area Number |
14350480
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
高分子合成
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| Research Institution | HOKKAIDO UNIVERSITY |
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Principal Investigator |
IJIRO Kuniharu Hokkaido Univ., Research Institute for Electronic Science, Asso.Prof, 電子科学研究所, 助教授 (90221762)
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| Co-Investigator(Kenkyū-buntansha) |
TANAKA Masaru Hokkaido Univ., Research Institute for Electronic Science, RA., 電子科学研究所, 助手 (00322850)
SHIMOMURA Masatsugu Hokkaido Univ., Research Institute for Electronic Science, Prof., 電子科学研究所, 教授 (10136525)
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| Project Period (FY) |
2002 – 2003
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| Project Status |
Completed (Fiscal Year 2003)
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| Budget Amount *help |
¥14,400,000 (Direct Cost: ¥14,400,000)
Fiscal Year 2003: ¥5,600,000 (Direct Cost: ¥5,600,000)
Fiscal Year 2002: ¥8,800,000 (Direct Cost: ¥8,800,000)
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| Keywords | DNA / single molecule / monolayer / molecular recognition / nano-particle / nano-semiconductor / nucleobase / nano-arrangement |
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| Research Abstract |
We have studied the fabrication of nano metal wires by the electroless plating of stretched DNA immobilized on a substrate as a template. A cationic amphiphile (dimethyldihexadecylammonium, 2C_<16>N2C_1) monolayer was spread on a Lambda DNA-Tris buffer solution mixed with fluorescence probe. YOYO-1 and excess platinum compounds (ex.cis-diamminedichloroplatinum). After the formation of a polyion complex monolayer at the air-water interface, dimethylammine borane was added to the subphase to reduce the platinum compound for catalyzing the electroless deposition of silver metal. The monolayer was compressed at 5mN/m and transferred on a glass substrate by the vertical lifting method It was confirmed that DNA was stretched and aligned along the dipping direction on the substrate by fluorescence microscopy. The substrate was immersed in a silver electroless plating solution to deposit silver metal on the substrate. AEM observation after the metallization procedure showed that thin lines (ca.50mm height and 50〜100mm width) were fabricated on the substrate. Electrical current mapping obtained by conductive AFM indicated that electric current was observed on the obtained line structure.
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