| Budget Amount *help |
¥4,200,000 (Direct Cost: ¥4,200,000)
Fiscal Year 2004: ¥1,100,000 (Direct Cost: ¥1,100,000)
Fiscal Year 2003: ¥3,100,000 (Direct Cost: ¥3,100,000)
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| Research Abstract |
Functional materials coated with laminating films were produced by using an RF magnetron sputtering apparatus. In this study, ceramic material system of SiC/Al_2O_3 was selected as target material, and glass for electronic usage was as substrate. Two-layered film coating materials were generated under different sputtering conditions. The surface roughness and porosity were measured on the surface of two-layered films of SiC/Al_2O_3. As sputtering time became longer, the surface roughness was observed to be coarser. On the other hand, the porosity hardly depended on the sputtering condition, and its value was extremely low. Strength characteristics of materials coated with two-layered SiC/Al_2O_3 films were investigated. It was clarified that the strength in a lower strength region was improved in each coated material compared with the strength distribution of glass substrate. The strength in a higher strength region was, however, not improved so much. It was suggested that sputtering time gave great influence to a strength characteristic of coating materials ; i.e. longer sputtering time resulted in the decrease in the mechanical reliability which was associated with deteriorating homogeneity of coated films. Although a delamination phenomenon observed in SiC single coating film, such a delamination could be avoided by coating Al_2O_3 between glass substrate and SiC. In producing functional materials coated with laminating films, sputtering condition should be adopted so that sputtering time was reduced by considering conformity of substrate and coating materials. By selecting such a condition, strength characteristics of coated materials in service could be improved, and its integrity could be guaranteed. Furthermore, it was revealed that strength characteristics as index of integrity of coated materials could be evaluated by a measurement of the dynamic microhardness including substrate hardness.
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