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Development of fully-implantable retinal prosthesis system realizing the same visual information processing as human vision

Research Project

Project/Area Number 15H01812
Research Category

Grant-in-Aid for Scientific Research (A)

Allocation TypeSingle-year Grants
Section一般
Research Field Medical systems
Research InstitutionTohoku University

Principal Investigator

TANAKA Tetsu  東北大学, 医工学研究科, 教授 (40417382)

Co-Investigator(Kenkyū-buntansha) 福島 誉史  東北大学, 工学研究科, 准教授 (10374969)
富田 浩史  岩手大学, 理工学部, 教授 (40302088)
清山 浩司  長崎総合科学大学, 工学部, 准教授 (60412722)
Co-Investigator(Renkei-kenkyūsha) KOYANAGI Mitsumasa  東北大学, 未来科学技術共同研究センター, 名誉教授 (60205531)
SUGANO Eriko  岩手大学, 理工学部, 准教授 (70375210)
KINO Hisashi  東北大学, 学際科学フロンティア研究所, 助教 (10633406)
Project Period (FY) 2015-04-01 – 2018-03-31
Project Status Completed (Fiscal Year 2017)
Budget Amount *help
¥39,000,000 (Direct Cost: ¥30,000,000、Indirect Cost: ¥9,000,000)
Fiscal Year 2017: ¥11,310,000 (Direct Cost: ¥8,700,000、Indirect Cost: ¥2,610,000)
Fiscal Year 2016: ¥12,090,000 (Direct Cost: ¥9,300,000、Indirect Cost: ¥2,790,000)
Fiscal Year 2015: ¥15,600,000 (Direct Cost: ¥12,000,000、Indirect Cost: ¥3,600,000)
Keywords人工網膜 / 三次元集積回路 / 医用システム / 生体医工学 / 人工視覚 / 人間医工学
Outline of Final Research Achievements

In order to restore visual sensation of blind patients such as age-related macular degeneration and retinitis pigmentosa, a fully-implantable retinal prosthesis have been developed in this research. The fully implantable retinal prosthesis consists of an intraocular and extraocular units. The intraocular unit has a coupling coil, a stimulus electrode array, and a 3-D stacked retinal prosthesis chip. The 3-D stacked retinal prosthesis chip is composed of a photoreceptor chip and a stimulus current generator chip. In this research, power dissipation of the stimulus current generator chip with an edge enhancement function successfully decreased to 62% due to no idling function. Other functions such as dark current compensation and temperature compensation were implemented into the circuit. A transparent stimulus electrode using Al-doped ZnO was successfully developed and showed appropriate CIC and electrical impedance values, which leads to x3 photoelectric conversion performance.

Report

(4 results)
  • 2017 Annual Research Report   Final Research Report ( PDF )
  • 2016 Annual Research Report
  • 2015 Annual Research Report
  • Research Products

    (57 results)

All 2018 2017 2016 2015 Other

All Journal Article (12 results) (of which Int'l Joint Research: 5 results,  Peer Reviewed: 12 results,  Open Access: 5 results) Presentation (42 results) (of which Int'l Joint Research: 29 results,  Invited: 7 results) Book (1 results) Remarks (2 results)

  • [Journal Article] Study of Al-doped ZnO Transparent Stimulus Electrodefor Fully Implantable Retinal Prosthesis with Three-dimensionally Stacked Retinal Prosthesis Chip2018

    • Author(s)
      Hisashi Kino, Takafumi Fukushima, and Tetsu Tanaka
    • Journal Title

      Sensors and Materials

      Volume: 30 Pages: 225-234

    • Related Report
      2017 Annual Research Report
    • Peer Reviewed / Open Access
  • [Journal Article] マルチウェル構造TSVを用いたTSV側壁界面評価方法の開発2018

    • Author(s)
      菅原 陽平, 木野 久志, 福島 誉史, 田中 徹
    • Journal Title

      電子情報通信学会論文誌 C

      Volume: J101-C Pages: 58-65

    • Related Report
      2017 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Self-Assembly and Electrostatic Carrier Technology for Via-Last TSV Formation Using Transfer Stacking-Based Chip-to-Wafer 3-D Integration2017

    • Author(s)
      Hideto Hashiguchi , Takafumi Fukushima , Hiroyuki Hashimoto, Ji-Cheol Bea, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Journal Title

      IEEE TRANSACTIONS ON ELECTRON DEVICES

      Volume: 64 Issue: 12 Pages: 5065-5072

    • DOI

      10.1109/ted.2017.2767598

    • Related Report
      2017 Annual Research Report
    • Peer Reviewed / Int'l Joint Research
  • [Journal Article] 半導体ウエハへの三次元配線加工:TSVと狭ピッチ電極を中心に2016

    • Author(s)
      福島誉史、李康旭、田中徹、小柳光正
    • Journal Title

      表面技術

      Volume: 67 Pages: 414-420

    • NAID

      130005875872

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration2016

    • Author(s)
      T. Fukushima, K.W. Lee, T. Tanaka, and M. Koyanagi
    • Journal Title

      ECS Transactions

      Volume: 75 Issue: 9 Pages: 285-290

    • DOI

      10.1149/07509.0285ecst

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Open Access / Int'l Joint Research
  • [Journal Article] Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration2016

    • Author(s)
      Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee , Tetsu Tanaka and Mitsumasa Koyanagi
    • Journal Title

      Micromachines

      Volume: 7 Issue: 10 Pages: 184-184

    • DOI

      10.3390/mi7100184

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Open Access / Int'l Joint Research
  • [Journal Article] 三次元集積用テンポラリー接着剤の特性とウエハエッジの影響2016

    • Author(s)
      福島誉史、マリアッパン ムルゲサン、裵志哲、李相勲、李康旭、 田中徹、小柳光正
    • Journal Title

      電子情報通信学会誌C

      Volume: J99-C Pages: 493-500

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC2016

    • Author(s)
      Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 55 Issue: 4S Pages: 04EC03-04EC03

    • DOI

      10.7567/jjap.55.04ec03

    • NAID

      210000146283

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Evaluation of In-plane Local Bending Stress Distribution with DRAM Cell Array for Highly Reliable 3D IC2016

    • Author(s)
      Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 55 Issue: 4S Pages: 04EC07-04EC07

    • DOI

      10.7567/jjap.55.04ec07

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Applications of three-dimensional LSI2015

    • Author(s)
      Mitsumasa Koyanagi, Takafumi Fukushima, Kang-Wook Lee, and Tetsu Tanaka
    • Journal Title

      MRS BULLETIN

      Volume: 40 Issue: 3 Pages: 242-247

    • DOI

      10.1557/mrs.2015.33

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration2015

    • Author(s)
      Kangwook Lee, Jichel Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Journal Title

      IEEE Electron Device Letters

      Volume: 37 Issue: 1 Pages: 81-83

    • DOI

      10.1109/led.2015.2502584

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Open Access / Int'l Joint Research
  • [Journal Article] Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration2015

    • Author(s)
      Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
    • Journal Title

      Journal of Microelectromechanical Systems

      Volume: 25 Issue: 1 Pages: 91-100

    • DOI

      10.1109/jmems.2015.2480787

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Open Access / Int'l Joint Research
  • [Presentation] スピン塗布型BCBライナー絶縁膜を用いたTSV形成技術2018

    • Author(s)
      李 晟豪, 菅原 陽平, 伊藤 誠人, 木野 久志, 福島 誉史, 田中 徹
    • Organizer
      第32回エレクトロニクス実装学会春季講演大会
    • Related Report
      2017 Annual Research Report
  • [Presentation] DRAMセルアレイを用いた3D-IC内部Cu汚染の高精度評価2018

    • Author(s)
      谷川 星野, 福島 誉史, 木野 久志, 田中 徹
    • Organizer
      第32回エレクトロニクス実装学会春季講演大会
    • Related Report
      2017 Annual Research Report
  • [Presentation] Directed Self-Assembly Patterning for 3D LSI2017

    • Author(s)
      T. Fukushimaand M. Koyanagi
    • Organizer
      INC 2017 Workshop
    • Related Report
      2017 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Temporary Bonding and De-bonding for Multichip-to-Wafer 3D Integration Process Using Spin-on Glass and Hydrogenated Amorphous Si2017

    • Author(s)
      M. Murugesan, T. Fukushima and M. Koyanagi
    • Organizer
      2017 IEEE 67th Electronic Components and Technology Conference
    • Related Report
      2017 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Remarkable Suppression of Local Stress in 3D IC by Manganese Nitride-Based Filler with Large Negative CTE2017

    • Author(s)
      Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
    • Organizer
      2017 IEEE 67th Electronic Components and Technology Conference
    • Related Report
      2017 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Minimized Hysteresis and Low Parasitic Capacitance TSV with PBO (Polybenzoxazole) Liner to Achieve Ultra-High-Speed Data Transmission2017

    • Author(s)
      Hisashi Kino, Masataka Tashiro, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima, and Tetsu Tanaka
    • Organizer
      IEEE International Interconnect Technology Conference
    • Related Report
      2017 Annual Research Report
    • Int'l Joint Research
  • [Presentation] 3D-IC Technology and Reliability Challenges2017

    • Author(s)
      Tetsu Tanaka
    • Organizer
      17th International Workshop on Junction Technology
    • Related Report
      2017 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] 矩形波インピーダンス計測のためのGIDL電流を用いた低周波リングオシレータの設計と評価2017

    • Author(s)
      竹澤 好樹, 下川 賢士, 銭正よう, 福島 奨, 木野 久志, 福島 誉史, 清山 浩司, 田中 徹
    • Organizer
      第78回応用物理学会秋季学術講演会
    • Related Report
      2017 Annual Research Report
  • [Presentation] 三次元積層人工網膜チップのためのラプラシアンエッジ強調機能を有する刺激電流生成回路の評価2017

    • Author(s)
      下川 賢士, 銭 正よう, 竹澤 好樹, 木野 久志, 福島 誉史, 清山 浩司, 田中 徹
    • Organizer
      第78回応用物理学会秋季学術講演会
    • Related Report
      2017 Annual Research Report
  • [Presentation] Characterization of Cu-TSVs Fabricated by a New All-Wet Process2017

    • Author(s)
      Miao Xiong,Yangyang Yan, Yingtao Ding,Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
    • Organizer
      2017 International Conference on Solid State Devices and Materials
    • Related Report
      2017 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Wide-range bioelectrical impedance analysis circuit with GIDL-controlled ultrasmall current and ultralow frequency square wave generator2017

    • Author(s)
      Yoshiki Takezawa, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
    • Organizer
      2017 International Conference on Solid State Devices and Materials
    • Related Report
      2017 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Ultrawide range square wave impedance analysis circuit with ultra-slow Ring-Oscillator using gate-induced drain-leakage current2017

    • Author(s)
      Yoshiki Takezawa, Koji Kiyoyama, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino, Takafumi Fukushima, and Tetsu Tanaka
    • Organizer
      The 13th IEEE Biomedical Circuit and Systems Conference 2017
    • Related Report
      2017 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Experimental Evaluation of Stimulus Current Generator with Laplacian Edge-enhancement for 3-D Stacked Retinal Prosthesis Chip2017

    • Author(s)
      Kenji Shimokawa, Zhengyang Qian, Yoshiki Takezawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, and Tetsu Tanaka
    • Organizer
      The 13th IEEE Biomedical Circuit and Systems Conference 2017
    • Related Report
      2017 Annual Research Report
    • Int'l Joint Research
  • [Presentation] 3D-IC Technology and Its Application to Fully Implantable Retinal Prosthesis2017

    • Author(s)
      Tetsu Tanaka, Takafumi Fukushima, Hisashi Kino
    • Organizer
      14th International Conference on Flow Dynamics
    • Related Report
      2017 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] 3D-IC Technology: Reliability Challenges and Biomedical Application2017

    • Author(s)
      Tetsu Tanaka
    • Organizer
      2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium
    • Related Report
      2017 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Wide-range and precise tissue impedance anaysis circuit with ultralow current source using gate-induced drain-leakage current2016

    • Author(s)
      Koji Kiyoyama, Yoshiki Takezawa, Tatsuya Goto, Keita Ito, Shoma Uno, Kenji Shimokawa, Satoru Nishino, Hisashi Kino, and Tetsu Tanaka
    • Organizer
      2016 IEEE Biomedical Circuits and Systems Conference(BioCAS 2016)
    • Place of Presentation
      Hotel Pullman Shanghai Skyway, Shanghai, China
    • Year and Date
      2016-10-17
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Evaluation of Depth-dependent TSV-liner Interface States Using Multi-well Structure TSV and Charge Pumping Technique2016

    • Author(s)
      Yohei Sugawara, Hisashi Kino, Takafumi Fukushima, Kang-Wook Lee, Mitsumasa Koyanagi, and Tetsu Tanaka
    • Organizer
      2016 International Conference on Solid State Devices and Materials
    • Place of Presentation
      Tsukuba International Congress Center, Tsukuba, Japan
    • Year and Date
      2016-09-26
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] マルチウェル構造TSVを用いたTSV側壁Si-SiO2界面準位の評価2016

    • Author(s)
      菅原陽平、木野久志、福島誉史、李康旭、小柳光正、田中徹
    • Organizer
      2016年第77回応用物理学会秋季学術講演会
    • Place of Presentation
      朱鷺メッセ、新潟県、新潟市
    • Year and Date
      2016-09-13
    • Related Report
      2016 Annual Research Report
  • [Presentation] 網膜下刺激人工網膜におけるAZO透明刺激電極の基礎評価2016

    • Author(s)
      下川賢士、後藤大輝、木野久志、福島誉史、田中徹
    • Organizer
      2016年第77回応用物理学会秋季学術講演会
    • Place of Presentation
      朱鷺メッセ、新潟県、新潟市
    • Year and Date
      2016-09-13
    • Related Report
      2016 Annual Research Report
  • [Presentation] シリコンマイクロチップの生体貼付・埋め込み医療分野への応用2016

    • Author(s)
      田中徹
    • Organizer
      次世代医療システム産業化フォーラム
    • Place of Presentation
      大阪商工会議所、大阪府、大阪市
    • Year and Date
      2016-07-26
    • Related Report
      2016 Annual Research Report
    • Invited
  • [Presentation] Influence of Cu-TSVs, CuSn-and PI- Microbumps on Vertically Stacked 20 Micron-Thick DRAM Chips2016

    • Author(s)
      Murugesan Mariappan, JiChel Bea, Hiroyuki Hashmoto, KangWook Lee, Mitsumasa Koyanagi, Takafumi Fukushima, Seiya Tanikawa, and Tetsu Tanaka
    • Organizer
      The 66th Electronic Components and Technology Conference (ECTC)
    • Place of Presentation
      The Cosmopolitan of Las Vegas, Las Vegas, USA
    • Year and Date
      2016-05-31
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Transfer and Non-Transfer 3D Stacking Technologies Based on Chip-to-Wafer Self-Assembly and Direct Bonding2016

    • Author(s)
      Takafumi Fukushima, Hideto Hashiguchi, Murugesan Mariappan, Jicheol Bea, Hiroyuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Kangwook Lee, and Mitsumasa Koyanagi
    • Organizer
      The 66th Electronic Components and Technology Conference (ECTC)
    • Place of Presentation
      The Cosmopolitan of Las Vegas, Las Vegas, USA
    • Year and Date
      2016-05-31
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Novel W2W/C2W Hybrid Bonding Technology with High Stacking Yield Using Ultra-Fine, Ultra-High Density Cu Nano-Pillar (CNP) for Exascale 2.5D/3D Integration2016

    • Author(s)
      Kangwook Lee, Chisato Nagai, Jichel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi, Suresh Ramalingam and Xin Wu
    • Organizer
      The 66th Electronic Components and Technology Conference (ECTC)
    • Place of Presentation
      The Cosmopolitan of Las Vegas, Las Vegas, USA
    • Year and Date
      2016-05-31
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] 画素間ばらつき補正機能を有する3次元積層人工網膜チップの提案2016

    • Author(s)
      伊藤圭汰、宇野正真、後藤竜也、竹澤好樹、西野悟、木野久志、清山浩司、田中徹
    • Organizer
      LSIとシステムのワークショップ2016
    • Place of Presentation
      東京大学、東京都
    • Year and Date
      2016-05-16
    • Related Report
      2016 Annual Research Report
  • [Presentation] Impact of local stress in 3D stacking process on memory retention characteristics in thinned DRAM chip2016

    • Author(s)
      Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
    • Organizer
      2016 IEEE International Reliability Physics Symposium(IRPS 2016)
    • Place of Presentation
      Pasadena Convention Center, Pasadena, USA
    • Year and Date
      2016-04-17
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] DRAMリテンション測定を用いた3DIC局所曲げ応力の影響評価2016

    • Author(s)
      谷川 星野, 木野久志, 福島 誉史, 田中 徹
    • Organizer
      2016年第63回応用物理学会春季学術講演会
    • Place of Presentation
      東京工業大学 大岡山キャンパス、東京都
    • Year and Date
      2016-03-19
    • Related Report
      2015 Annual Research Report
  • [Presentation] 3D-IC/TSVの信頼性評価技術と将来展望2015

    • Author(s)
      田中 徹
    • Organizer
      SEMICON Japan2015
    • Place of Presentation
      Tokyo Big Sight, Tokyo, Japan
    • Year and Date
      2015-12-16
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] シリコン貫通配線( TSV )と三次元集積化技術の研究開発動向2015

    • Author(s)
      福島 誉史, 李 康旭, 田中 徹, 小柳 光正
    • Organizer
      第32回「センサ・マイクロマシンと応用システム」シンポジウム
    • Place of Presentation
      朱鷺メッセ 新潟コンベンションセンター、新潟県、新潟市
    • Year and Date
      2015-10-28
    • Related Report
      2015 Annual Research Report
    • Invited
  • [Presentation] Electroless Nickel Barrier/Seed Layer Deposition on Dielectric Liners for Advanced Cu-TSV Applications2015

    • Author(s)
      Takafumi Fukushima, Kazuko Taniguchi, Shigeru Watariguchi, Mariappan Murugesan, Chisato Nagai, Ai Nakamura, Hiroyuki Hashimoto, Ji-Chel Bea, Tetsu Tanaka, Mitsumasa Koyanagi, and Kang-Wook Lee
    • Organizer
      2015 International Conference on Solid State Devices and Materials
    • Place of Presentation
      Sapporo Convention Center, Sapporo, Japan
    • Year and Date
      2015-09-27
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Local Stress Effect due to Operation-Heating-Induced Adhesive Expansion on Transistor Performances in 3D IC2015

    • Author(s)
      Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
    • Organizer
      2015 International Conference on Solid State Devices and Materials
    • Place of Presentation
      Sapporo Convention Center, Sapporo, Japan
    • Year and Date
      2015-09-27
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Evaluation of 2-D Local Stress Distribution in Stacked IC Chip Using Stress-induced Retention Time Modulation od DRAM Cell Array2015

    • Author(s)
      Seiya Tanikawa, Hideto Hashiguchi, Yohei Sugawara, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
    • Organizer
      2015 International Conference on Solid State Devices and Materials
    • Place of Presentation
      Sapporo Convention Center, Sapporo, Japan
    • Year and Date
      2015-09-27
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] DRAMセルアレイの電荷保持特性を用いた3DICにおける局所曲げ応力の影響評価2015

    • Author(s)
      谷川 星野、木野 久志、福島 誉史、小柳 光正、田中 徹
    • Organizer
      2015年第76回応用物理学会秋季学術講演会
    • Place of Presentation
      名古屋国際会議場、愛知県、名古屋市
    • Year and Date
      2015-09-13
    • Related Report
      2015 Annual Research Report
  • [Presentation] 3D IC用ビアラスト/バックサイドビアプロセスにおける高アスペクト比ビア形成がトランジスタに与える影響評価2015

    • Author(s)
      菅原 陽平, 木野 久志, 福島 誉史, 李康旭, 小柳光正, 田中 徹
    • Organizer
      2015年第76回応用物理学会秋季学術講演会
    • Place of Presentation
      名古屋国際会議場、愛知県、名古屋市
    • Year and Date
      2015-09-13
    • Related Report
      2015 Annual Research Report
  • [Presentation] 回路動作の発熱によって三次元集積回路内に生成される局所応力の影響に関する研究2015

    • Author(s)
      木野 久志, 橋口 日出登, 谷川 星野, 菅原 陽平, 池ヶ谷 俊介, 福島 誉史, 小柳 光正, 田中 徹
    • Organizer
      第25回マイクロエレクトロニクスシンポジウム MES2015
    • Place of Presentation
      大阪大学吹田キャンパス、大阪府、吹田市
    • Year and Date
      2015-09-03
    • Related Report
      2015 Annual Research Report
  • [Presentation] Novel Local Stress Evaluation Method in 3D IC Using DRAM Cell Array with Planar MOS Capacitors2015

    • Author(s)
      Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
    • Organizer
      IEEE 2015 International 3D Systems Integration Conference (3DIC)
    • Place of Presentation
      Sendai International Center, Sendai, Japan
    • Year and Date
      2015-08-31
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Reconfigured Multichip-on-wafer (mCoW) Cu/oxide Hybrid Bonding Technology for Ultra-high Density 3D Integration Using Recessed Oxide, Thin Glue Adhesive, and Thin Metal Capping Layers2015

    • Author(s)
      Kangwook Lee, Chisato Nagai, Ai Nakamura, H. Aizawa, H. Hashiguchi, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
    • Organizer
      IEEE 2015 International 3D Systems Integration Conference (3DIC)
    • Place of Presentation
      Sendai International Center, Sendai, Japan
    • Year and Date
      2015-08-31
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Consideration of Microbump Layout for Reduction of Local Bending Stress Due to CTE Mismatch in 3D IC2015

    • Author(s)
      Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
    • Organizer
      IEEE 2015 International 3D Systems Integration Conference (3DIC)
    • Place of Presentation
      Sendai International Center, Sendai, Japan
    • Year and Date
      2015-08-31
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Transfer and Non-transfer Stacking Technologies Based on Chip-to-wafer Self-assembly for High-throughput and High-precision Alignment and Microbump Bonding2015

    • Author(s)
      Takafumi FUKUSHIMA, Taku SUZUKI, Hideto HASHIGUCHI, Chisato NAGAI, Jichoel BEA, Hiroyuki HASHIMOTO, Mariappan MURUGESAN, Kang-Wook LEE, Tetsu TANAKA, Kazushi ASAMI, Yasuhiro KITAMURA, and Mitsumasa KOYANAGI
    • Organizer
      IEEE 2015 International 3D Systems Integration Conference (3DIC)
    • Place of Presentation
      Sendai International Center, Sendai, Japan
    • Year and Date
      2015-08-31
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Mitigating Thermo Mechanical Stress in High-density 3D-LSI Through Dielectric Liners in Cu-Through Silicon Via micro-RS and micro-XRD Study2015

    • Author(s)
      M. Murugesan, J.C. Bea, H. Hashimoto, K.W. Lee, and M. Koyanagi, T. Fukushima, and T. Tanaka
    • Organizer
      IEEE 2015 International 3D Systems Integration Conference (3DIC)
    • Place of Presentation
      Sendai International Center, Sendai, Japan
    • Year and Date
      2015-08-31
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Plasma Assisted Multichip-to-Wafer Direct Bonding Technology for Self-Assembly Based 3D Integration2015

    • Author(s)
      H. Hashiguchi, H. Yonekura, T. Fukushima, M. Murugesan, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi
    • Organizer
      2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
    • Place of Presentation
      Sheraton San Diego Hotel & Marina, San Diego, USA
    • Year and Date
      2015-05-26
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Impact of Deep-Via Plasma Etching Process on Transistor Performance in 3D-IC with Via-Last Backside TSV2015

    • Author(s)
      Yohei Sugawara, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
    • Organizer
      2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
    • Place of Presentation
      Sheraton San Diego Hotel & Marina, San Diego, USA
    • Year and Date
      2015-05-26
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Development of Highly-Reliable Microbump Bonding Technology Using Self-Assembly of NCF-Covered KGDs and Multi-Layer 3D Stacking Challenges2015

    • Author(s)
      Yuka Ito, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Organizer
      2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
    • Place of Presentation
      Sheraton San Diego Hotel & Marina, San Diego, USA
    • Year and Date
      2015-05-26
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Book] 新材料・新素材シリーズ 熱膨張制御材料の開発と応用2018

    • Author(s)
      木野久志, 田中徹
    • Total Pages
      205
    • Publisher
      シーエムシー出版
    • ISBN
      9784781313160
    • Related Report
      2017 Annual Research Report
  • [Remarks] 田中(徹)・木野/福島研究室

    • URL

      http://www.lbc.mech.tohoku.ac.jp/

    • Related Report
      2017 Annual Research Report
  • [Remarks] 完全埋め込み型人工網膜

    • URL

      http://www.lbc.mech.tohoku.ac.jp/index.html

    • Related Report
      2016 Annual Research Report 2015 Annual Research Report

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Published: 2015-04-16   Modified: 2019-03-29  

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