| Budget Amount *help |
¥44,590,000 (Direct Cost: ¥34,300,000、Indirect Cost: ¥10,290,000)
Fiscal Year 2017: ¥9,620,000 (Direct Cost: ¥7,400,000、Indirect Cost: ¥2,220,000)
Fiscal Year 2016: ¥12,480,000 (Direct Cost: ¥9,600,000、Indirect Cost: ¥2,880,000)
Fiscal Year 2015: ¥22,490,000 (Direct Cost: ¥17,300,000、Indirect Cost: ¥5,190,000)
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| Outline of Final Research Achievements |
Hetero-surface bonding technology between organic and inorganic surfaces has been developed based on VUV surface activation, self-assembled monolayer coating and surface flatning. Roughness of the inroganic surfaces had crucial effects on bonding temperature. In case of Al/COP(cyclo-olefin polymer, Tg = 140 C), bonding was sucessful only at temperatures higherr than 100 C with the rougness of Rrms = 25 nm, which is a few tens of degree below Tg, while the roughness ot Rrms = 10 nm lowered the bonding temperature down to bleow 70 C. When atomically flat inorganic surfaces were supplied, bonding at room tempeature was enabled. This room temerature surface bonding has been successfully acheived on bonding Al, Si or Ti with VUV-modified COP.
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