| Budget Amount *help |
¥16,380,000 (Direct Cost: ¥12,600,000、Indirect Cost: ¥3,780,000)
Fiscal Year 2017: ¥2,470,000 (Direct Cost: ¥1,900,000、Indirect Cost: ¥570,000)
Fiscal Year 2016: ¥4,160,000 (Direct Cost: ¥3,200,000、Indirect Cost: ¥960,000)
Fiscal Year 2015: ¥9,750,000 (Direct Cost: ¥7,500,000、Indirect Cost: ¥2,250,000)
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| Outline of Final Research Achievements |
The feasibility of atmospheric-pressure plasma jet processing for improving cooling during SiC micro-milling was investigated. A comparison was made between SiC surfaces after milling, with and without the application of the plasma jet. The application of a plasma jet was found to result in a nano-level surface roughness. The Ra value of a surface machined with plasma jet assisted cooling remains approximately 1-2 nm for longer machining distance. The adhesion materials on the tool surface were suppressed over long machining distances when using the plasma jet. The plasma jet treatment is believed to result in an increase in hydrophilicity due to a surface modifying mechanism, wherein OH and N radicals are created by the plasma irradiation. The plasma jet appears to be highly effective at improving both the chip formation process, by imparting hydrophilicity to the tool and workpiece surfaces, and removing surface contamination at the tool edge during machining.
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