| Budget Amount *help |
¥16,640,000 (Direct Cost: ¥12,800,000、Indirect Cost: ¥3,840,000)
Fiscal Year 2017: ¥3,250,000 (Direct Cost: ¥2,500,000、Indirect Cost: ¥750,000)
Fiscal Year 2016: ¥5,980,000 (Direct Cost: ¥4,600,000、Indirect Cost: ¥1,380,000)
Fiscal Year 2015: ¥7,410,000 (Direct Cost: ¥5,700,000、Indirect Cost: ¥1,710,000)
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| Outline of Final Research Achievements |
To realize precision surface defect detection required for the next-generation semiconductor or LED wafers having smooth surfaces, a new defect detection method utilizing a heat flow generated in a tiny gap has been proposed. A prototype micro thermal sensor composed of a thin metal film resistor and a pair of electrodes has successfully been fabricated. In addition, a micro thermal sensor probe, which has a function of detecting the displacement and tilts of the probe tip where the micro thermal sensor is mounted, has been developed. By using the developed micro thermal sensor probe, a method to detect a contact between a measurement surface and the tip of the probe has successfully been established. Furthermore, non-contact detection of micrometric surface patterns have successfully been demonstrated by the developed micro thermal sensor probe.
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