| Budget Amount *help |
¥16,510,000 (Direct Cost: ¥12,700,000、Indirect Cost: ¥3,810,000)
Fiscal Year 2017: ¥5,070,000 (Direct Cost: ¥3,900,000、Indirect Cost: ¥1,170,000)
Fiscal Year 2016: ¥5,850,000 (Direct Cost: ¥4,500,000、Indirect Cost: ¥1,350,000)
Fiscal Year 2015: ¥5,590,000 (Direct Cost: ¥4,300,000、Indirect Cost: ¥1,290,000)
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| Outline of Final Research Achievements |
Performance of large-scale integrated circuits has been improved through scaling of the transistors. However, further improvement through the scaling is becoming difficult, due to the short channel effects and propagation delay owing to parasitic resistance and capacitance of metal wiring. For further improvement of performance of the large-scale integrated circuits, it is useful to integrate high-speed transistors and optical interconnection, consisting of a novel material GeSn with superior electronic and optical properties compared with Si, on Si-based large-scale integrated circuits and build three-dimensional large-scale integrated circuits. To achieve this, in the present study, techniques to obtain high quality GeSn on insulator at low temperatures have been developed.
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