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Development of Integrated Health Management for High Reliability Electronics Based on Synchrotron Radiation Computed Tomography Technologies

Research Project

Project/Area Number 15K05708
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeMulti-year Fund
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionToyama Industrial Technology Center,

Principal Investigator

Sayama Toshihiko  富山県工業技術センター, その他部局等, 課長 (40416128)

Co-Investigator(Kenkyū-buntansha) 森 孝男  富山県立大学, 工学部, 教授 (30275078)
釣谷 浩之  富山県工業技術センター, その他部局等, 主任研究員 (70416147)
Co-Investigator(Renkei-kenkyūsha) UESUGI KENTARO  財団法人高輝度光科学研究センター, 利用研究促進部門イメージングチーム, 主席研究員 (80344399)
Project Period (FY) 2015-04-01 – 2018-03-31
Project Status Completed (Fiscal Year 2017)
Budget Amount *help
¥4,810,000 (Direct Cost: ¥3,700,000、Indirect Cost: ¥1,110,000)
Fiscal Year 2017: ¥1,040,000 (Direct Cost: ¥800,000、Indirect Cost: ¥240,000)
Fiscal Year 2016: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2015: ¥2,860,000 (Direct Cost: ¥2,200,000、Indirect Cost: ¥660,000)
Keywords信頼性設計 / 高密度実装 / マイクロ接合部 / X線マイクロCT / 放射光 / はんだ / 熱疲労 / 寿命評価 / エレクトロニクス実装 / ヘルスモニタリング / 寿命
Outline of Final Research Achievements

In order to manage the strength reliability of the actual joints on printed circuit boards, a practical monitoring technique was investigated by applying synchrotron radiation laminography. The technique realized in-situ nondestructive monitoring of the joints through the fatigue process due to cyclic energization loading, in which the cracks initiate, propagate, and reach to failure, and then led to the integrated estimation of the fatigue lifetime. This result will widely contribute to the improvement of the reliability and the development of electronic equipment.

Report

(4 results)
  • 2017 Annual Research Report   Final Research Report ( PDF )
  • 2016 Research-status Report
  • 2015 Research-status Report
  • Research Products

    (13 results)

All 2017 2016 2015

All Journal Article (3 results) (of which Peer Reviewed: 2 results,  Open Access: 1 results) Presentation (10 results) (of which Int'l Joint Research: 3 results,  Invited: 1 results)

  • [Journal Article] In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading2017

    • Author(s)
      Tsuritani Hiroyuki、Sayama Toshihiko、Okamoto Yoshiyuki、Takayanagi Takeshi、Hoshino Masato、Uesugi Kentaro、Ooi Junya、Mori Takao
    • Journal Title

      ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

      Volume: -

    • DOI

      10.1115/ipack2017-74177

    • Related Report
      2017 Annual Research Report
    • Peer Reviewed
  • [Journal Article] 繰返し通電負荷を受けるパワーデバイスに対する適切な熱的信頼性試験のための放射光ラミノグラフィモニタリングの応用2017

    • Author(s)
      岡本佳之, 高柳 毅, 釣谷浩之, 佐山利彦, 星野真人, 上杉健太朗, 東方浩紀, 大井純也, 森 孝男
    • Journal Title

      平成29年度 SPring-8 産業新分野支援課題・一般課題(産業分野)実施報告書(2017A)

      Volume: - Pages: 25-28

    • Related Report
      2017 Annual Research Report
    • Open Access
  • [Journal Article] マイクロ接合部の疲労損傷評価のための非破壊ひずみ測定の可能性試験2015

    • Author(s)
      岡本 佳之, 高柳 毅, 釣谷 浩之, 佐山 利彦, 上杉 健太朗, 星野 真人, 長瀬 達則, 森 孝男
    • Journal Title

      SPring-8利用研究成果集(電子ジャーナル)

      Volume: 3 Pages: 1-4

    • NAID

      130007969228

    • Related Report
      2015 Research-status Report
    • Peer Reviewed
  • [Presentation] 繰返し通電を受けるダイアタッチ接合部の放射光ラミノグラフィによるその場観察2017

    • Author(s)
      釣谷浩之
    • Organizer
      第31回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      慶応義塾大学・矢上キャンパス
    • Year and Date
      2017-03-06
    • Related Report
      2016 Research-status Report
  • [Presentation] In-situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-attached Joints under Cyclic Energization Loading2017

    • Author(s)
      Hiroyuki Tsuritani
    • Organizer
      ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2017)
    • Related Report
      2017 Annual Research Report 2016 Research-status Report
    • Int'l Joint Research
  • [Presentation] 放射光X線CTを用いたはんだ接合部の非破壊ひずみ計測2017

    • Author(s)
      東方浩紀
    • Organizer
      日本機械学会M&M2017材料力学カンファレンス
    • Related Report
      2017 Annual Research Report
  • [Presentation] 放射光X線ラミノグラフィによる繰返し通電を受ける電子基板におけるダイアタッチ接合部の非破壊観察2017

    • Author(s)
      大井純也
    • Organizer
      日本機械学会M&M2017材料力学カンファレンス
    • Related Report
      2017 Annual Research Report
  • [Presentation] 高剛性ラップジョイント試験片によるはんだ接合部の疲労強度特性に及ぼす接合厚さの影響2017

    • Author(s)
      小川涼太
    • Organizer
      日本機械学会M&M2017材料力学カンファレンス
    • Related Report
      2017 Annual Research Report
  • [Presentation] 放射光X線ラミノグラフィによる平板構造を有するはんだ接合部における熱疲労き裂の非破壊観察2016

    • Author(s)
      佐山利彦
    • Organizer
      第30回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東京工業大学・大岡山キャンパス
    • Year and Date
      2016-03-22
    • Related Report
      2015 Research-status Report
  • [Presentation] 高剛性ラップジョイント試験体を用いたはんだ接合部の疲労寿命に及ぼすひずみ速度の影響評価2015

    • Author(s)
      森 孝男
    • Organizer
      日本機械学会2015年度年次大会
    • Place of Presentation
      北海道大学工学部
    • Year and Date
      2015-09-14
    • Related Report
      2015 Research-status Report
  • [Presentation] ラミノグラフィによるはんだ接合部における疲労き裂の観察2015

    • Author(s)
      佐山利彦
    • Organizer
      第15回X線マイクロ・ナノトモグラフィー研究会
    • Place of Presentation
      呉羽ハイツ(富山市吉作)
    • Year and Date
      2015-09-07
    • Related Report
      2015 Research-status Report
    • Invited
  • [Presentation] Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography2015

    • Author(s)
      Toshihiko Sayama
    • Organizer
      ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2015)
    • Place of Presentation
      San Francisco, CA, USA
    • Year and Date
      2015-07-06
    • Related Report
      2015 Research-status Report
    • Int'l Joint Research
  • [Presentation] Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints by Using Lap-joint Shear Specimen with High Stiffness Fixtures2015

    • Author(s)
      Takao Mori
    • Organizer
      ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2015)
    • Place of Presentation
      San Francisco, CA, USA
    • Year and Date
      2015-07-06
    • Related Report
      2015 Research-status Report
    • Int'l Joint Research

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Published: 2015-04-16   Modified: 2019-03-29  

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