Development of chemical slicing method for Photovaltaic materials with low ker-loss and thin wafer thickness
| Project/Area Number |
15K05736
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Kindai University |
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Principal Investigator |
Murata Junji 近畿大学, 理工学部, 准教授 (70531474)
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| Project Period (FY) |
2015-04-01 – 2018-03-31
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| Project Status |
Completed (Fiscal Year 2017)
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| Budget Amount *help |
¥4,810,000 (Direct Cost: ¥3,700,000、Indirect Cost: ¥1,110,000)
Fiscal Year 2017: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2016: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
Fiscal Year 2015: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
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| Keywords | 切断加工 / エッチング / 太陽電池 / 切断 / 半導体 / スライシング / 光照射援用加工 / 光ファイバ |
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| Outline of Final Research Achievements |
Novel abrasive free slicing method for photovoltaic materials has been developed to achieve damage free wafer surface with a low kerf loss. In this method, a chemical etchant is supplied to the material and the material surface is abraded by a wire tool. In this research, studies to improve a material removal rate, to achieve multi-wire processing, to scale up the material size, and to reduce the use of HF solution has been conducted. Although the material removal rate remain an issue, the multi-wire processing with lower kerf loss has been achieved, compared with the conventional mechanical machining. Further, an etching method employing an UV-assisted etching with optical fiber has been developed without using HF solution.
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Report
(4 results)
Research Products
(8 results)
