| Budget Amount *help |
¥4,810,000 (Direct Cost: ¥3,700,000、Indirect Cost: ¥1,110,000)
Fiscal Year 2017: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2016: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
Fiscal Year 2015: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
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| Outline of Final Research Achievements |
Novel abrasive free slicing method for photovoltaic materials has been developed to achieve damage free wafer surface with a low kerf loss. In this method, a chemical etchant is supplied to the material and the material surface is abraded by a wire tool. In this research, studies to improve a material removal rate, to achieve multi-wire processing, to scale up the material size, and to reduce the use of HF solution has been conducted. Although the material removal rate remain an issue, the multi-wire processing with lower kerf loss has been achieved, compared with the conventional mechanical machining. Further, an etching method employing an UV-assisted etching with optical fiber has been developed without using HF solution.
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