Fundamental study of liquid cooling methodology for layered electrical components and its optimization

• Project/Area Number: 15K05836
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Research Field: Thermal engineering
• Research Institution: Toyama Prefectural University
• Principal Investigator: Nakagawa Shinji 富山県立大学, 工学部, 教授 (30337878)
• Research Collaborator: HATAKEYAMA Tomoyuki ; SEIKE Miho ; HIROSE Ryohei ; IIDA Keisuke ; SCHIANO Thomas
• Project Period (FY): 2015-10-21 – 2018-03-31
• Project Status: Completed (Fiscal Year 2017)
• Budget Amount: ¥4,550,000 (Direct Cost: ¥3,500,000、Indirect Cost: ¥1,050,000); Fiscal Year 2017: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000); Fiscal Year 2016: ¥1,040,000 (Direct Cost: ¥800,000、Indirect Cost: ¥240,000); Fiscal Year 2015: ¥2,860,000 (Direct Cost: ¥2,200,000、Indirect Cost: ¥660,000)
• Keywords: 電子機器冷却 / 熱流体シミュレーション / CAE / 数値シミュレーション / 対流伝熱

Outline of Final Research Achievements

The performance of the electronic equipment is greatly improving but the size of it becomes small. Layered structure of the electronic component is one of the key technology for achieving the both high performance and small size. However, the difficulty of the cooling in the layered structure will be the bottleneck for the future electronic equipment. This study aims to acquire the basic knowledge and technique of the cooling system which is suitable for the layered structure. Experimental system for evaluate the heat and fluid characteristics of the liquid cooling system has been established. Computational simulation system for reproduce the experimental result has been constructed using open-source software and supercomputers. Outcomes from this study can help the development and optimization of the thin liquid cooling system for the layered structure.

Research Products

• [Journal Article] Numerical simulation of fundamental liquid cooling heat sink for electronics using OpenFOAM (2017)
  • Author(s): Ryohei Hirose, Shinji Nakagawa, Tomoyuki Hatakeyama
  • Journal Title: Extended Abstracts of the Ninth JSME-KSME Thermal and Fluids Engineering Conference Volume: -
  • Peer Reviewed
• [Presentation] Conjugate heat transfer analysis of a thin liquid cooling heat sink using OpenFOAM (2017)
  • Author(s): Thomas Schiano, 広瀬良平. 飯田圭祐, 清家美帆, 畠山友行, 中川慎二
  • Organizer: オープンCAEシンポジウム2017
• [Presentation] OpenFOAMを利用した電子機器液冷システムのシミュレーション（基本的な解析機能の検証） (2016)
  • Author(s): 広瀬良平
  • Organizer: 第53回日本伝熱シンポジウム
  • Place of Presentation: グランキューブ大阪（大阪府立国際会議場）
  • Year and Date: 2016-05-25
• [Presentation] OpenFOAM を利用した電子機器液冷システムのシミュレーション (2016)
  • Author(s): 広瀬良平，中川慎二，畠山友行
  • Organizer: 第53回日本伝熱シンポジウム
  • Place of Presentation: 大阪
  • Year and Date: 2016-05-24