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Development of age-hardened Cu-Ni-Sn alloys with high strength and good conductivity and stress relaxation resistance

Research Project

Project/Area Number 15K06480
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeMulti-year Fund
Section一般
Research Field Structural/Functional materials
Research InstitutionKanazawa University

Principal Investigator

Monzen Ryoichi  金沢大学, 機械工学系, 教授 (20166466)

Project Period (FY) 2015-04-01 – 2018-03-31
Project Status Completed (Fiscal Year 2017)
Budget Amount *help
¥4,810,000 (Direct Cost: ¥3,700,000、Indirect Cost: ¥1,110,000)
Fiscal Year 2017: ¥780,000 (Direct Cost: ¥600,000、Indirect Cost: ¥180,000)
Fiscal Year 2016: ¥520,000 (Direct Cost: ¥400,000、Indirect Cost: ¥120,000)
Fiscal Year 2015: ¥3,510,000 (Direct Cost: ¥2,700,000、Indirect Cost: ¥810,000)
KeywordsCu-Ni-Sn合金 / 高強度 / 耐応力緩和特性 / 導電性 / 転位密度 / 変形双晶 / 析出物
Outline of Final Research Achievements

In this study, we aimed to fabricate an age-hardened Cu-Ni-Sn alloy with a high strength, an excellent stress relaxation resistance and a suitable conductivity. A Cu-9wt%Ni-9wt%Sn alloy with proposed compositions of Ni and Sn, and Cu-9wt%Ni-6wt%Sn, Cu-15wt%Ni-8wt%Sn, and Cu-21wt%Ni-5.5wt%Sn alloys with almost the same compositions of Ni and Sn as commercial Cu-Ni-Sn alloys were first peak-aged at 400°C, then cold-rolled, and finally annealed at 400°C to improve the stress relaxation resistance of the four cold-rolled alloys. This thermomechanical heat treatment is the author's unique method. The four alloys have tensile strengths higher than those of commercially available alloys by about 100 to 200 MPa, and their conductivities are comparable, but their resistances to stress relaxation are smaller. Among the four alloys, the balance of strength, stress relaxation resistance, and conductivity of the Cu-9%Ni-9%Sn alloy is the most excellent.

Report

(4 results)
  • 2017 Annual Research Report   Final Research Report ( PDF )
  • 2016 Research-status Report
  • 2015 Research-status Report
  • Research Products

    (7 results)

All 2018 2017 2016 2015

All Journal Article (3 results) (of which Peer Reviewed: 3 results,  Open Access: 1 results,  Acknowledgement Compliant: 2 results) Presentation (4 results) (of which Int'l Joint Research: 1 results)

  • [Journal Article] 単純な加工熱処理によって作製されたCu-Ni-Sn合金の強度と耐応力緩和特性評価2018

    • Author(s)
      渡邊 光,北 和久,國峯崇裕,門前亮一,村松尚国
    • Journal Title

      材料

      Volume: 67

    • NAID

      130007397950

    • Related Report
      2017 Annual Research Report
    • Peer Reviewed
  • [Journal Article] 時効とその後の圧延によって作製されたCu-Ni-Sn 合金の強度,耐応力緩和特性,導電性2017

    • Author(s)
      福岡俊彦,渡邊 光,渡邊千尋,門前亮一,村松尚国
    • Journal Title

      銅と銅合金

      Volume: 56 Pages: 6-11

    • NAID

      40021292757

    • Related Report
      2016 Research-status Report
    • Peer Reviewed / Open Access / Acknowledgement Compliant
  • [Journal Article] Enhancement of strength of Cu-15wt%Ni-8wt%Sn alloy2015

    • Author(s)
      T. Oshima, K. KIta and R. Monzen
    • Journal Title

      Proceeding of Processing and Farication of Advanced Materials-XXIV

      Volume: none Pages: 494-503

    • NAID

      40020551760

    • Related Report
      2015 Research-status Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Presentation] 単純な加工熱処理によって作製されたCu-Ni-Sn合金の強度,導電性,耐応力緩和特性2017

    • Author(s)
      渡邊 光, 國峯崇裕,渡邊千尋,門前亮一,村松尚国
    • Organizer
      日本金属学会
    • Related Report
      2017 Annual Research Report
  • [Presentation] Cu-9wt%-6wt%Sn合金における曲げ加工性と微細組織2017

    • Author(s)
      張 宇禅,渡邊 光,渡邊千尋,門前亮一,山上直樹
    • Organizer
      日本金属学会
    • Related Report
      2017 Annual Research Report
  • [Presentation] Cu-Ni-Sn合金の強度,耐応力緩和特性,導電性の改善2016

    • Author(s)
      福岡俊彦,門前亮一,渡邊千尋,村松尚国
    • Organizer
      日本銅学会
    • Place of Presentation
      東海大学 高輪キャンパス
    • Year and Date
      2016-10-29
    • Related Report
      2016 Research-status Report
  • [Presentation] Enhancement of strength of Cu-15wt%Ni-8wt%Sn alloy2015

    • Author(s)
      T. Oshima, K. KIta and R. Monzen
    • Organizer
      International Conference of Processing and Farication of Advanced Materials-XXIV
    • Place of Presentation
      関西大学
    • Year and Date
      2015-12-18
    • Related Report
      2015 Research-status Report
    • Int'l Joint Research

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Published: 2015-04-16   Modified: 2019-03-29  

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