| Project/Area Number |
15K13782
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| Research Category |
Grant-in-Aid for Challenging Exploratory Research
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| Allocation Type | Multi-year Fund |
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| Research Field |
Polymer/Textile materials
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| Research Institution | Tokyo Institute of Technology |
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Principal Investigator |
Ando Shinji 東京工業大学, 物質理工学院, 教授 (00272667)
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| Co-Investigator(Kenkyū-buntansha) |
石毛 亮平 東京工業大学, 物質理工学院, 助教 (20625264)
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| Project Period (FY) |
2015-04-01 – 2017-03-31
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| Project Status |
Completed (Fiscal Year 2016)
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| Budget Amount *help |
¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2016: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2015: ¥2,730,000 (Direct Cost: ¥2,100,000、Indirect Cost: ¥630,000)
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| Keywords | 低体積膨張材料 / 耐熱・絶縁性薄膜材料 / 局所運動 / 凝集構造 / 赤外光干渉スペクトル / 動的緩和 / 自由体積 / 耐熱･絶縁性薄膜材料 |
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| Outline of Final Research Achievements |
We have improved the measurement accuracy of volume expansion coefficient (CVE) of highly heat-resistant polymers and measured thermal expansion behavior of low CVE polyimide (PI) developed based on our original design concept. As a design to suppress the local mobility of the PI main chain, 1) "Aggregation structure control" was studied, and a remarkably small CVE was observed with highly crystalline PI thin film. In addition, we have synthesized novel PIs incorporating 2) m-phenylene structure, 3) intramolecular / intermolecular hydrogen bond, 4) flexing alicyclic structure in the main chain, and analyzed their thermal expansion behavior and CVE values. A flexible PI thin film obtained by design 2) was amorphous, and its aggregation state was sparse than crystalline PI, but the CVE was significantly reduced. Furthermore, we succeeded in developing a transparent, heat-resistant insulating PI thin film showing a low CVE.
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