| Budget Amount *help |
¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2017: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2016: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2015: ¥2,080,000 (Direct Cost: ¥1,600,000、Indirect Cost: ¥480,000)
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| Outline of Final Research Achievements |
When a material is difficult-to-grind, where does the cause of that difficulty lie? Generally speaking, the cause is often that the material has high strength, is hard and brittle, or has outstanding heat resistance. In this research, it is presumed that if grinding heat produced between the grinding wheel and ground material while grinding can be suppressed, then it should be possible to cope with many cases where grinding is difficult. Therefore, a processing experiment was performed in which grinding of some materials was carried out with vibration assist in the radial direction of the grinding wheel. With this approach, since contact between the grinding wheel and ground material is intermittent, it is possible to reduce friction acting between the two, and as a result, it should be possible to suppress grinding heat. The above is effective for grinding the Inconel718, titanium alloy, and SiC wafer, difficult-to-grind materials.
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