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Quasi-three-dimensional integration using time-domain interconnection

Research Project

Project/Area Number 15K13962
Research Category

Grant-in-Aid for Challenging Exploratory Research

Allocation TypeMulti-year Fund
Research Field Electron device/Electronic equipment
Research InstitutionTohoku University

Principal Investigator

Kotani Koji  東北大学, 工学研究科, 准教授 (20250699)

Project Period (FY) 2015-04-01 – 2017-03-31
Project Status Completed (Fiscal Year 2016)
Budget Amount *help
¥3,770,000 (Direct Cost: ¥2,900,000、Indirect Cost: ¥870,000)
Fiscal Year 2016: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
Fiscal Year 2015: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
Keywords疑似三次元集積 / 集積回路 / 時間軸配線 / 時間軸 / 擬似三次元集積
Outline of Final Research Achievements

In this study, as a novel integrated circuit architecture, a quasi-3D integration scheme, in which time domain is taken as a new integration dimension and combined with a conventional physical 2D integration of the integrated circuit technology, has been established and its effectiveness has been evaluated. Taking multiple-stage 2D image processing circuits as a specific evaluation example, a quasi-3D signal processing architecture composed of an array of unit processing nodes and temporary memory elements acting as time-domain interconnects has been developed. Its superior performance against the conventional parallel processing architecture, in which multiple signal processing layers are simply placed in a 2D integration plane, has been demonstrated.

Report

(3 results)
  • 2016 Annual Research Report   Final Research Report ( PDF )
  • 2015 Research-status Report
  • Research Products

    (2 results)

All 2017 2016

All Journal Article (1 results) (of which Peer Reviewed: 1 results,  Acknowledgement Compliant: 1 results) Presentation (1 results) (of which Int'l Joint Research: 1 results)

  • [Journal Article] Quasi-three-dimensional integration scheme using time-domain interconnection2017

    • Author(s)
      Koji Kotani
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 56

    • NAID

      210000148108

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Presentation] Quasi-3D Integration Using Time-Domain Interconnection (Q3D-TD) -Realization Example and Performance Evaluation in 45 nm Technology Node-2016

    • Author(s)
      Koji Kotani
    • Organizer
      Advanced Metallization Conference
    • Place of Presentation
      東京大学(東京都文京区)
    • Year and Date
      2016-10-20
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research

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Published: 2015-04-16   Modified: 2018-03-22  

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