Creation of laminated pi -type thermoelectric power generation module using dissimilar metal direct bonding technology
Project/Area Number |
15K14169
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Research Category |
Grant-in-Aid for Challenging Exploratory Research
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Allocation Type | Multi-year Fund |
Research Field |
Structural/Functional materials
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Research Institution | National Institute of Advanced Industrial Science and Technology |
Principal Investigator |
Sato Hiroshi 国立研究開発法人産業技術総合研究所, 製造技術研究部門, 主任研究員 (70344166)
|
Co-Investigator(Kenkyū-buntansha) |
馬場 創 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域研究戦略部, 主任研究員 (20371065)
浅沼 博 千葉大学, 大学院工学研究科, 教授 (40167888)
柳迫 徹郎 工学院大学, 工学部, 助教 (80784628)
|
Project Period (FY) |
2015-04-01 – 2017-03-31
|
Project Status |
Completed (Fiscal Year 2016)
|
Budget Amount *help |
¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2016: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000)
Fiscal Year 2015: ¥2,340,000 (Direct Cost: ¥1,800,000、Indirect Cost: ¥540,000)
|
Keywords | 熱電発電 / ゼーベック効果 / 直接接合 / ニッケル / アルミニウム / アコーディオン構造 / 熱電デバイス / エナジーハーベスト |
Outline of Final Research Achievements |
In this study, we propose a new stacked π-type structure sandwiched between an insulating layer using a metal direct bonding technology. By using this technique, significantly lowered layered structure the electrical resistance of the joint portion, because it can be produced by laminating at least one hundred sheets at a time, even when using a metal material having low Seebeck effect, a sufficiently practical level. And by utilizing the anodic oxide film formed on the aluminum surface as an insulating layer, to prepare an accordion structure device adhered by the bonding portion of the π-type structure. With such a structure, increasing the cooling performance, the structure itself can correspond to the shape of the heat source has a flexibility.
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Report
(4 results)
Research Products
(5 results)