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Development of Miniature Creep Testing for Environment-Friendly Solders

Research Project

Project/Area Number 16560088
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionMaizuru National College of Technology

Principal Investigator

TAKADA Akiko  Maizuru National College of Technology, Department of Mechanical Engineering, Associate Professor, 機械工学科, 助教授 (80043363)

Co-Investigator(Kenkyū-buntansha) SAKANE Masao  Ritsumeikan University, Faculty of Science and Engineering, Professor, 理工学部, 教授 (20111130)
Project Period (FY) 2004 – 2005
Project Status Completed (Fiscal Year 2005)
Budget Amount *help
¥3,600,000 (Direct Cost: ¥3,600,000)
Fiscal Year 2005: ¥1,200,000 (Direct Cost: ¥1,200,000)
Fiscal Year 2004: ¥2,400,000 (Direct Cost: ¥2,400,000)
KeywordsSolder / Creep / Rupture Time / Electronic Device / Constitutive Equation / Larson-Miller Parameter / Size Effect / ラーソ・ミラー・パラメータ
Research Abstract

Solders have been used as a connecting material mechanically and electrically in electronic devices used for computers, automobiles, home electronics etc. Strength data have not been systematically obtained because solders have not been considered as a strength material. However, the strength data of solders began to compile recently in various testing methods.
One of the recent major issues relating to quality assurance of solder connections is on the reliability of miniature solder connections. Dimensions of the miniature solder connections are for 100μm-1mm and creep rupture properties for such small dimensions have not been discussed. Thus, development of the miniature creep testing method of solders applicable to such small connections is needed.
This study developed a new miniature creep testing method using specimens whose gage diameters were for 0.3-2mm. Systematic miniature creep tests were carried out using Sn-37Pb and Sn-3.5Ag miniature specimens ranging the specimen diameter from 0.3mm to 2mm. A new evaluation method for miniature creep strength was proposed based on the bulk data. The size effect on creep rupture live for Sn-37Pb and Sn-3.5Ag was discussed based on the bulk and miniature creep data.

Report

(3 results)
  • 2005 Annual Research Report   Final Research Report Summary
  • 2004 Annual Research Report
  • Research Products

    (9 results)

All 2005 2004

All Journal Article (6 results) Book (3 results)

  • [Journal Article] Miniature Creep Testing for Sn-37Pb and Sn-3.5Ag Solders2005

    • Author(s)
      Akio TAKADA
    • Journal Title

      2005 ASME International Mechanical Engineering Congress & Exposition (CD Media)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2005 Annual Research Report 2005 Final Research Report Summary
  • [Journal Article] Miniature Creep Testing for Sn-37Pb and Sn-3.5Ag Solders2005

    • Author(s)
      Akio Takada
    • Journal Title

      2005 ASME International Mechanical Engineering Congress & Exposition (CD Media)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2005 Final Research Report Summary
  • [Journal Article] はんだのクリープ試験法標準-日本材料学会標準試験法-2005

    • Author(s)
      高田 晄男
    • Journal Title

      エレクトロニクス実装学会第19回エレクトロニクス実装学術講演大会講演論文集

      Pages: 79-80

    • NAID

      130004588896

    • Related Report
      2004 Annual Research Report
  • [Journal Article] Sn-8Zn-3Biはんだのクリープおよびクリープ破断特性2005

    • Author(s)
      高田 晄男
    • Journal Title

      日本機械学会関西支部平成16年度関西学生会卒業研究発表講演会前刷集

    • NAID

      130002085934

    • Related Report
      2004 Annual Research Report
  • [Journal Article] 高温におけるSUS316ステンレス鋼の切欠きクリープ破壊に及ぼす真空ふん囲気の影響2005

    • Author(s)
      高田 晄男
    • Journal Title

      舞鶴工業高等専門学校紀要 No.40

      Pages: 1-6

    • NAID

      110004628986

    • Related Report
      2004 Annual Research Report
  • [Journal Article] Sn-8Zn-3Biはんだのクリープおよびクリープ破断特性2004

    • Author(s)
      高田 晄男
    • Journal Title

      日本材料学会第42回高温強度シンポジウム前刷集

      Pages: 48-52

    • NAID

      130002085934

    • Related Report
      2004 Annual Research Report
  • [Book] はんだのクリープ試験法標準(JSMS-SD-8-04)2004

    • Author(s)
      高田 晄男
    • Total Pages
      56
    • Publisher
      日本材料学会
    • Related Report
      2004 Annual Research Report
  • [Book] はんだのクリープ疲労試験法標準(JSMS-SD-9-04)2004

    • Author(s)
      高田 晄男
    • Total Pages
      80
    • Publisher
      日本材料学会
    • Related Report
      2004 Annual Research Report
  • [Book] Factual Database on Creep and Creep-Fatigue Properties of Sn-37Pb and Sn-3.5Ag Solders2004

    • Author(s)
      Akio TAKADA
    • Total Pages
      458
    • Publisher
      The Society of Materials Science, Japan
    • Related Report
      2004 Annual Research Report

URL: 

Published: 2004-04-01   Modified: 2016-04-21  

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