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Bonding process for sintered layer with high thermostability using a nanoporous structure

Research Project

Project/Area Number 16H04508
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypeSingle-year Grants
Section一般
Research Field Composite materials/Surface and interface engineering
Research InstitutionOsaka University

Principal Investigator

Nishikawa Hiroshi  大阪大学, 接合科学研究所, 教授 (90346180)

Co-Investigator(Kenkyū-buntansha) 水野 潤  早稲田大学, ナノ・ライフ創新研究機構, 上級研究員(研究院教授) (60386737)
齋藤 美紀子  早稲田大学, ナノ・ライフ創新研究機構, 上級研究員(研究院教授) (80386739)
Project Period (FY) 2016-04-01 – 2019-03-31
Project Status Completed (Fiscal Year 2018)
Budget Amount *help
¥17,940,000 (Direct Cost: ¥13,800,000、Indirect Cost: ¥4,140,000)
Fiscal Year 2018: ¥2,080,000 (Direct Cost: ¥1,600,000、Indirect Cost: ¥480,000)
Fiscal Year 2017: ¥4,810,000 (Direct Cost: ¥3,700,000、Indirect Cost: ¥1,110,000)
Fiscal Year 2016: ¥11,050,000 (Direct Cost: ¥8,500,000、Indirect Cost: ¥2,550,000)
Keywordsナノポーラス構造 / 焼結型接合 / 高耐熱 / 界面反応 / エレクトロニクス実装 / 高温はんだ代替接合 / ナノポーラス材料 / 接合
Outline of Final Research Achievements

Several bonding processes have been proposed as an alternative to high-Pb-containing soders. There are many reports on bonding process using nanoparticles. But some reliability concerns reported such as formation of undesired voids and gaps that caused by residue solvent. In order to overcome these issues, we proposed a solid-state bonding process without solvents using nanoporous sheet. The feasibility study on nanoporous bonding for the high temperature die attachment has been investigated. In previous studies, the joint using Cu nanoporous sheet showed high shear strength over 20 MPa and potential in terms of long-term reliability. In this research, we elucidate the bonding mechanism and deterioration behavior of the joint using nanoporous structure. The reason for the decrease of the shear strength may be oxidation of sintered Cu nanoporous layer.

Academic Significance and Societal Importance of the Research Achievements

ナノポーラス構造を利用し、350℃程度の接合プロセスで高い耐熱性と接合信頼性を備えた接合部を確立することを最終目的として、本研究ではナノポーラス材料とバルク金属(被接合材)との界面反応や接合メカニズム、また新たなナノポーラス構造の作製方法について研究を行った。基礎現象論の深掘りに多くの時間を費やしたが、接合部評価方法の構築や「低温焼結現象を利用した接合科学」という新たな学問領域の構築に向けた大きな一歩を踏み出した。それら成果の社会的意義も非常に大きい。

Report

(4 results)
  • 2018 Annual Research Report   Final Research Report ( PDF )
  • 2017 Annual Research Report
  • 2016 Annual Research Report
  • Research Products

    (26 results)

All 2019 2018 2017 2016

All Journal Article (7 results) (of which Int'l Joint Research: 1 results,  Peer Reviewed: 7 results,  Open Access: 2 results,  Acknowledgement Compliant: 1 results) Presentation (19 results) (of which Int'l Joint Research: 10 results,  Invited: 2 results)

  • [Journal Article] Low Temperature Flip Chip Bonding Using Squeegee-Embedded Au Nanoporous Bump Activated by VUV/O3 Treatment2018

    • Author(s)
      Fu Weixin、Kaneda Tatsushi、Okada Akiko、Matsunaga Kaori、Shoji Shuichi、Saito Mikiko、Nishikawa Hiroshi、Mizuno Jun
    • Journal Title

      Journal of Electronic Materials

      Volume: 47 Issue: 10 Pages: 5952-5958

    • DOI

      10.1007/s11664-018-6462-8

    • Related Report
      2018 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Effect of Poly (N-vinyl-pyrrolidone) on Electrochemical Production of Cu Nanoparticles2018

    • Author(s)
      M. Saito, T. Ishii, H. Fujiwara, and T. Homma
    • Journal Title

      J. Electrochem. Soc.

      Volume: 165(2) Issue: 2 Pages: E50-E57

    • DOI

      10.1149/2.0921802jes

    • Related Report
      2017 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Low temperature direct bonding between PEEK and Pt via vapor-assisted vacuum ultraviolet surface modificatrion2017

    • Author(s)
      Weixin Fu, Akitsu Shigetou, Shuichi Shoji, Jun Mizuno
    • Journal Title

      MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS

      Volume: 7 Issue: 2 Pages: 49-62

    • DOI

      10.17265/2161-6221/2017.3-4.001

    • Related Report
      2017 Annual Research Report
    • Peer Reviewed / Open Access
  • [Journal Article] Influence of ENIG defects on shear strength of pressureless Ag nanoparticle sintered joint under isothermal aging2017

    • Author(s)
      M-S. Kim、H. Nishikawa
    • Journal Title

      Microelectronics Reliability

      Volume: 76-77 Pages: 420-425

    • DOI

      10.1016/j.microrel.2017.06.083

    • Related Report
      2017 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection2016

    • Author(s)
      M. Ohyama、M. Nimura、J. Mizuno、S. Shoji、T. Nonaka、Y. Shinba、A. Shigetou
    • Journal Title

      Microelectronics Reliability

      Volume: 59 Pages: 134-139

    • DOI

      10.1016/j.microrel.2015.12.033

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Open Access / Int'l Joint Research
  • [Journal Article] Fabrication of bottom-emitting organic light-emitting diode panels interconnected with encapsulation substrate by AuAu flip-chip bonding and capillary-driven filling process2016

    • Author(s)
      S. Yamada、C-H. Shim、T. Edura、A. Okada、C. Adachi、S. Shoji、J. Mizuno
    • Journal Title

      Microelectronic Engineering

      Volume: 161 Pages: 94-97

    • DOI

      10.1016/j.mee.2016.04.012

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Application of I-Structure Though-Glass Interconnect Filled with Submicron Gold Particles to a Hermetic Sealing Device2016

    • Author(s)
      K. Nomura, A. Okada, S. Shoji, T. Ogashiwa, J. Mizuno
    • Journal Title

      Journal of Micromechanics and Microengineering

      Volume: 26 Issue: 10 Pages: 17-17

    • DOI

      10.1088/0960-1317/26/10/105018

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Presentation] Cuナノポーラスシートを用いた接合部の劣化挙動の解明2019

    • Author(s)
      古賀俊一,齋藤美紀子,水野潤,西川 宏
    • Organizer
      第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム
    • Related Report
      2018 Annual Research Report
  • [Presentation] Bonding Process Using a Nanoporous Sheet for High Temperature Electronics2019

    • Author(s)
      H. Nishikawa
    • Organizer
      1st JWRI-IMS Collaboration Seminar on Joining and Materials Science
    • Related Report
      2018 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] 異種金属を用いたナノポーラス構造による界面形成現象の比較2018

    • Author(s)
      古賀俊一,齋藤美紀子,水野潤,西川 宏
    • Organizer
      第28回マイクロエレクトロニクスシンポジウム論文集
    • Related Report
      2018 Annual Research Report
  • [Presentation] Long-term Reliability of Joint Using Ag Nanoporous Sheet without Solvent2018

    • Author(s)
      H. Nishikawa and M.-S. Kim
    • Organizer
      The 71st IIW ANNUAL ASSEMBLY & INTERNATIONAL CONFERENCE
    • Related Report
      2018 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Cu-Mg合金から作製したCuナノポーラスシートを用いた接合部の高温放置試験2018

    • Author(s)
      古賀俊一、キムミンス、齋藤美紀子、水野潤、西川宏
    • Organizer
      第24回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム
    • Related Report
      2017 Annual Research Report
  • [Presentation] 電析とデアロイを用いたナノポーラス電極形成検討2018

    • Author(s)
      齋藤美紀子,古賀俊一, 水野 潤,西川 宏, 楠 美智子
    • Organizer
      国際的高度人材育成ライフイノベーションマテリアル創製共同研究プロジェクト公開討論会
    • Related Report
      2017 Annual Research Report
  • [Presentation] 三次元ナノ構造を利用した高耐熱・高放熱新奇接合技術2018

    • Author(s)
      西川 宏,Omid Mokhtari,水野潤,齋藤美紀子,乗松航,楠 美智子
    • Organizer
      国際的高度人材育成ライフイノベーションマテリアル創製共同研究プロジェクト公開討論会
    • Related Report
      2017 Annual Research Report
    • Invited
  • [Presentation] 電析と選択溶解を用いたAu-Agナノポーラス構造制御2017

    • Author(s)
      齋藤美紀子,古賀俊一, 水野 潤,西川 宏
    • Organizer
      2017年 電気化学 秋季大会
    • Related Report
      2017 Annual Research Report
  • [Presentation] Nanoporous Electrode Formed by Electrodeposition and Dealloying on Aligned CNT Films2017

    • Author(s)
      M. Saito, J. Mizuno, H. Nishikawa, M. Kusunoki
    • Organizer
      ICMaSS 2017
    • Related Report
      2017 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Cu-Mg合金のデアロングによるCuナノポーラス構造の作製と接合への応用2017

    • Author(s)
      古賀俊一、キムミンス、齋藤美紀子、水野潤、西川宏
    • Organizer
      第27回マイクロエレクトロニクスシンポジウム
    • Related Report
      2017 Annual Research Report
  • [Presentation] ナノポーラス金接合に向けた真空紫外光による表面前処理2017

    • Author(s)
      金田達志,岡田愛姫子,付偉欣,庄子習一,齋藤美紀子,西川宏,水野潤
    • Organizer
      第23回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム
    • Related Report
      2016 Annual Research Report
  • [Presentation] Low temperature heterogeneous bonding of PEEK and Pt2017

    • Author(s)
      W. Fu, S. Shuichi, J. Mizuno
    • Organizer
      Research and Education Consortium for Innovation of Advanced Integrated Science (CIAiS) 2017
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] 高密度・高配向 CNTへのAu-Ag電析膜形成2017

    • Author(s)
      齋藤美紀子,水野 潤,西川 宏,楠 美智子
    • Organizer
      学際・国際的高度人材育成ライフイノベーションマテリアル創製共同研究プロジェクトキックオフ公開討論会
    • Related Report
      2016 Annual Research Report
  • [Presentation] Effect of isothermal aging at 250 C on shear strength of joints using Au nanoporous bonding for die attach2016

    • Author(s)
      H. Nishikawa, K. Matsunaga, M-S. Kim, M. Saito, J. Mizuno
    • Organizer
      International Conference on High Temperature Electronics (HiTEC 2016)
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Bonding process using Au nanoporous metal sheet for die attach2016

    • Author(s)
      H. Nishikawa, K. Matsunaga, M-S. Kim, M. Saito, J. Mizuno
    • Organizer
      69th IIW Annual Assembly & International Conference
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Bonding process using a nanoporous gold sheet for high temperature electronics2016

    • Author(s)
      H. Nishikawa, K. Matsunaga, M-S. Kim, M. Saito, J. Mizuno
    • Organizer
      International Symposium on Micro-Nano Science and Technology 2016
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments2016

    • Author(s)
      W. Fu, A. Shigetou, S. Shoji, J. Mizuno
    • Organizer
      2016 International Conference on Electronic Packaging (ICEP)
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] tudy of LiTaO3/ST-quartz Bonding with Amorphous Interlayer Assisted by VUV/O3 Treatment for SAW Device2016

    • Author(s)
      H. Suzaki, H. Kuwae, A. Okada, B. Ma, S. Shoji, J. Mizuno
    • Organizer
      2016 International Microsystems, Packaging, Assembly and Circuits Technology Conference (iMPACT)
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Formation of Nanoporous Electrode on Aligned CNT Films using Dealloying2016

    • Author(s)
      M. Saito, J. Mizuno, M. Kusunoki, H. Nishikawa
    • Organizer
      230th Meeting of the Electrochem. Soc.
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research

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Published: 2016-04-21   Modified: 2020-03-30  

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